• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.1272-1275
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• 2008

We present the development of dry etch process for the liquid crystal display (LCD) fabrication using a dielectric barrier discharge (DBD) system at atmospheric pressure. In this experimental work, the dry etch characteristics and the electrical properties of thin film transistor are evaluated by using the scanning electron microscopy and electric probe, and TFT-LCD panel ($300\;mm\;{\times}\;400\;mm$) is manufactured with the application of the amorphous silicon etch step in the 4 mask and 5 mask processes.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07b
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• pp.948-951
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• 2005

New technology that reduces photolithography process steps from 4 to 3 in fabrication of TFT LCD is introduced. The core technology for 3mask-TFTs is the lift-off process [1], by which the PAS and PXL layer are formed simultaneously. To evaluate the stability of this lift-off process, outgases from photo resist on a substrate during ITO deposition and the quality of ITO film were analyzed and the conventional photo resist stripper machine which operates lift-off process was examined to see its ability to reduce particle problems of the machine. Through the development of total process and design for TFTs using this 3mask technology, panels in TN and IPS modes which exhibit same performances of a display using a conventional process were achieved. In addition, this process was already verified in the mass production line and now some products are being produced by the 3mask technology.

• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.1111-1113
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• 2004

n+ etching process is investigated in the fabrication of TFF-LCD using low resistance data line of Mo/Al/Mo. Problems of consumption of upper Mo layer and contamination of channel area are resolved. Either of HCl or $Cl_2$ can be selected as a main etchant gas, and either of $SF_6$ or $CF_4$ can be selected as an additive. Plasma treatment after n+ etching process can reduce the off-current high problem.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.34 no.3
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• pp.1-7
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• 2011

The stocker system is another name of automated storage and retrieval system (AS/RS) and being popularly used as main material handling tools in Liquid Crystal Display (LCD) and semiconductor fabrication facilities. Recently the use of the stocker system has been extended to transportation from conventional storage and retrieval in LCD fabrication facilities. Toolsets are connected in the ground level of the stocker system and 4~6 stories of the shelves are placed in the upper or lower ground level. As a consequence of the more sophisticated design, move requests imposed on the system greatly increased. For solving this problem, the industry adopted the dual-robot stocker system that two robots are moving along the same guide line in the stocker system. This research develops a closed-form solution to estimate a delivery rate of the dual robot stocker system under given design and operation parameters. Using this stochastic model, industry practitioners could analyze performance levels under given various design parameters, and ultimately the model helps optimizing the design parameters.

• Journal of the Korean Graphic Arts Communication Society
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• v.29 no.3
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• pp.105-124
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• 2011

TFT-LCD consists of LCD panel on the top, circuit unit on the side and BLU on the bottom. The recent development issues of BLU-dependent TFT-LCD have been power consumption minimization, slimmerization and size maximization. As a result of this trend, LED is adopted as BLU instead of CCFL to increase brightness and to reduce thickness. In liquid crystal displays, the light efficiency is below 10% due to the loss of light in the path from a light source to an LCD panel and presence of absorptive polarizer. This low efficiency results in low brightness and high power consumption. One way to circumvent this situation is to use a reflective polarizer between backlight units and LCD panels. Since a nano-wire grid polarizer has been known as a reflective polarizer, an idea was proposed that it can be used for the enhancement of the brightness of LCD. The use of reflective polarizing film is increasing as edge type LED TV and 3D TV markets are growing. This study has been carried out to fabrication of the nano-wire grid polarizer(NWGP) and investigated the brightness enhancement of LCD through polarization recycling by placing a NWGP between an c and a backlight unit. NWGPs with a pitch of 200nm were fabricated using laser interference lithography and aluminum sputtering and wet etching. And The NWGP fabrication process was using by the UV imprinting and was applied to plastic PET film. In this case, the brightness of an LCD with NWGPs was 1.21 times higher than that without NWGPs due to polarization recycling.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.434-438
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• 2006

High-quality a-Si TFTs were fabricated on 7 inch plastic PES substrates at $130^{\circ}C$ and $100^{\circ}C$. It had been shown that the key factor for successful TFT fabrication on the relatively large plastic substrates is thorough control of total active layer's stress by means of deposition temperature reduction and single layer's intrinsic stress optimization.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.376-379
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• 2007

Although years of trials for the fabrication of TFT LCD color filters with the piezo Drop-On-Demand (DOD) inkjet printing technology have been made, the underlying physics of jetting and wetting has not been fully understood. In this study, the key engineering issues, jetting and wetting, are investigated with mathematical models.

• Transactions of Materials Processing
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• v.16 no.1 s.91
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• pp.42-47
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• 2007

LCD-BLU is one of kernel parts of LCD and it consists of several optical sheets: LGP, light source and mold frame. The LGP of LCD-BLU is usually manufactured by etching process and forming numerous dots with $50\sim300{\mu}m$ diameter on the surface. But the surface of the etched dots of LGP is very rough due to the characteristics of the etching process during the mold fabrication, so that its light loss is high along with the dispersion of light into the surface. Accordingly, there is a limit in raising the luminance of LCD-BLU. In order to overcome the limit of current etched dot patterned LGP, optical pattern with continuous microlens was designed using optical simulation CAE. Also, a mold with continuous micro-lens was fabricated by UV-LiGA reflow process and applied to 7 inch size of navigator LCD-BLU in the present study.

• Korean Management Science Review
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• v.29 no.1
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• pp.131-141
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• 2012

The automated material handling systems today are playing ever more important roles in semiconductor/LCD fabrication facilities. Recently they became more flexible, intelligent, and speedy than in the past. The facilities have been fully automated because the size and weight of the unit loads used in the facilities were being increased beyond the limits that a human operator can handle. This research develops an efficient procedure to streamline the delivery of unit loads by the automated material handling system (AMHS). For this task, the research employs the event scheduling theory that has been successfully used in the both academia and industry. The developed procedure was applied to an actual LCD fabrication facility and improved the performance of an existing material handling system.

• Journal of Information Display
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• v.10 no.1
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• pp.33-36
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• 2009

A new hybrid silicon thin-film transistor (TFT) fabrication process using the DPSS laser crystallization technique was developed in this study to realize low-temperature poly-Si (LTPS) and a-Si:H TFTs on the same substrate as a backplane of the active-matrix liquid crystal flat-panel display (AMLCD). LTPS TFTs were integrated into the peripheral area of the activematrix LCD panel for the gate driver circuit, and a-Si:H TFTs were used as a switching device of the pixel electrode in the active area. The technology was developed based on the current a-Si:H TFT fabrication process in the bottom-gate, back-channel etch-type configuration. The ion-doping and activation processes, which are required in the conventional LTPS technology, were thus not introduced, and the field effect mobility values of $4\sim5cm^2/V{\cdot}s$ and $0.5cm^2/V{\cdot}s$ for the LTPS and a-Si:H TFTs, respectively, were obtained. The application of this technology was demonstrated on the 14.1" WXGA+(1440$\times$900) AMLCD panel, and a smaller area, lower power consumption, higher reliability, and lower photosensitivity were realized in the gate driver circuit that was fabricated in this process compared with the a-Si:H TFT gate driver integration circuit