• Title/Summary/Keyword: Junction properties

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Dependance of Ionic Polarity in Semiconductor Junction Interface (반도체 접합계면이 가스이온화에 따라 극성이 달라지는 원인)

  • Oh, Teresa
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.19 no.6
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    • pp.709-714
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    • 2018
  • This study researched the reasons for changing polarity in accordance with junction properties in an interface of semiconductors. The contact properties of semiconductors are related to the effect of the semiconductor's device. Therefore, it is an important factor for understanding the junction characteristics in the semiconductor to increase the efficiency of devices. For generation of various junction properties, carbon-doped silicon oxide (SiOC) was deposited with various argon (Ar) gas flow rates, and the characteristics of the SiOC was varied based on the polarity in accordance with the Ar gas flows. Tin-doped zinc oxide (ZTO) as the conductor was deposited on the SiOC as an insulator to research the conductivity. The properties of the SiOC were determined from the formation of a depletion layer by the ionization reaction with various Ar gas flow rates due to the plasma energy. Schottky contact was good in the condition of the depletion layer, with a high potential barrier between the silicon (Si) wafer and the SiOC. The rate of ionization reactions increased when increasing the Ar gas flow rate, and then the potential barrier of the depletion layer was also increased owing to deficient ions from electron-hole recombination at the junction. The dielectric properties of the depletion layer changed to the properties of an insulator, which is favorable for Schottky contact. When the ZTO was deposited on the SiOC with Schottky contact, the stability of the ZTO was improved by the ionic recombination at the interface between the SiOC and the ZTO. The conductivity of ZTO/SiOC was also increased on SiOC film with ideal Schottky contact, in spite of the decreasing charge carriers. It increases the demand on the Schottky contact to improve the thin semiconductor device, and this study confirmed a high-performance device owing to Schottky contact in a low current system. Finally, the amount of current increased in the device owing to ideal Schottky contact.

NOTE ON THE GROUND STATES OF TWO-COMPONENT BOSE-EINSTEIN CONDENSATES WITH AN INTERNAL ATOMIC JOSEPHSON JUNCTION

  • Lu, Zhongxue;Liu, Zuhan
    • Bulletin of the Korean Mathematical Society
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    • v.50 no.5
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    • pp.1441-1450
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    • 2013
  • In this paper, we consider two-component Bose-Einstein condensates with an internal atomic Josephson junction in the general case, i.e., 0 < p < $\frac{2}{(d-2)^+}$. We prove existence and uniqueness results for the ground states, and obtain some properties of the ground states with large parameters.

Effect of barrier materials on the properties of magnetic tunnel junctions

  • 박병국;임우창;배지영;이택동
    • Proceedings of the Korean Magnestics Society Conference
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    • 2002.12a
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    • pp.66-67
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    • 2002
  • Magnetic tunnel junction에서는 spin의 tunneling이 가장 기본적인 현상이기 때문에 tunnel junction의 특성은 tunnel barrier의 성질에 크게 의존한다. Tunnel barrier로는 지금까지 $Al_2$O$_3$가 주로 사용되고 있다. 하지만 $Al_2$O$_3$의 경우는 barrier height가 2-3 eV로 높기 때문에 저 저항의 tunnel junction을 형성하기 위해서는 Al의 두께가 1nm 이하로 낮아져야 한다. 따라서 이를 극복하기 위해서 $Al_2$O$_3$ 보다 낮은 barrier height를 갖는 절연막을 tunnel barrier로 사용하고자 하는 연구가 많이 진행되고 있다 (예를 들면 TaOx [1], ZrOx [2], GaOx [3], and HfOx [4]). (중략)

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Low Temperature Properties of Exchange-biased Magnetic Tunnel Junction

  • Lee, K. I.;J. G. Ha;S. Y. Bae;K. H. Shin
    • Proceedings of the Korean Magnestics Society Conference
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    • 2000.09a
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    • pp.325-326
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    • 2000
  • Low temperature diagnosis was performed as a probe for the integrity of MTJ(Magnetic tunnel junction) process which is optimised for the given plasma oxidation condition. TMR ratio increased slowly with decreasing temperature than that expected from spin wave exitation theory〔1〕. Junction resistance (RJ) does not follow T$\^$-$\frac{1}{2}$/ law below 200 K, indicating another conduction path besides spin polarized tunneling is involved at low temperature. Temperature dependence of conductance dip and bias dependence of TMR with temperature are discussed, from which the quality of tunnel barrier and its formation process can be inferred.

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Formation of Chimeric Gap Junction Channels in Mammalian Ovarian Follicle

  • Oh Seunghoon
    • Reproductive and Developmental Biology
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    • v.28 no.3
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    • pp.147-153
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    • 2004
  • The oocyte and its surrounding granulosa cells co-exist in a closed compartment called a follicle, although they receive many signals from other parts of the body. It is well established that the intercellular communications between the oocyte and granulosa cells are required for normal oocyte development and ovulation during folliculogenesis. Gap junctions are intercellular channels allowing the direct transmission of ions and small molecules between coupled cells. Several lines of studies have shown that multiple connexins (Cx, subunits of gap junction) are expressed in mammalian ovarian follicles. Among them, two major connexins Cx37 and Cx43 are expressed in different manner. While the gap junction channels formed by Cx37 are localized between the oocyte and encompassing granulosa cells, the intercellular channels by Cx43 are located between granulosa cells. In this review, I will summarize the general properties of gap junction channels and discuss their possible formation (or compatibility) of intercellular channels formed by the oocyte and granulosa cells.

Diode and MOSFET Properties of Trench-Gate-Type Super-Barrier Rectifier with P-Body Implantation Condition for Power System Application

  • Won, Jong Il;Park, Kun Sik;Cho, Doo Hyung;Koo, Jin Gun;Kim, Sang Gi;Lee, Jin Ho
    • ETRI Journal
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    • v.38 no.2
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    • pp.244-251
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    • 2016
  • In this paper, we investigate the electrical characteristics of two trench-gate-type super-barrier rectifiers (TSBRs) under different p-body implantation conditions (low and high). Also, design considerations for the TSBRs are discussed in this paper. The TSBRs' electrical properties depend strongly on their respective p-body implantation conditions. In the case of the TSBR with a low p-body implantation condition, it exhibits MOSFET-like properties, such as a low forward voltage ($V_F$) drop, high reverse leakage current, and a low peak reverse recovery current owing to a majority carrier operation. However, in the case of the TSBR with a high p-body implantation condition, it exhibits pn junction diode.like properties, such as a high $V_F$, low reverse leakage current, and high peak reverse recovery current owing to a minority carrier operation. As a result, the TSBR with a low p-body implantation condition is capable of operating as a MOSFET, and the TSBR with a high p-body implantation condition is capable of operating as either a pn junction diode or a MOSFET, but not both at the same time.

Employing Al Etch Stop Layer for Nb-based SNS Josephson Junction Fabrication Process (Al 식각정지층을 이용한 Nb-based SNS 조셉슨 접합의 제조공정)

  • Choi, J.S.;Park, J.H.;Song, W.;Chong, Y.
    • Progress in Superconductivity
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    • v.12 no.2
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    • pp.114-117
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    • 2011
  • We report our efforts on the development of Nb-based non-hysteretic Josephson junction fabrication process for quantu device applications. By adopting and modifying the existing Nb-aluminum oxide tunnel junction process, we develop a process for non-hysteretic Josephson junction circuits using metal-silicide as metallic barrier material. We use sputter deposition of Nb and $MoSi_2$, PECVD deposition of silicon oxide as insulator material, and ICP-RIE for metal and oxide etch. The advantage of the metal-silicide barrier in the Nb junction process is that it can be etched in $SF_6$ RIE together with Nb electrode. In order to define a junction area precisely and uniformly, end-point detection for the RIE process is critical. In this paper, we employed thin Al layer for the etch stop, and optimized the etch condition. We have successfully demonstrated that the etch stop properties of the inserted Al layer give a uniform etch profile and a precise thickness control of the base electrode in Nb trilayer junctions.

A Study on the Self-Aligned Cobalt Silicidation and the Formation of a Shallow Junction by Concurrent Junction Process (동시 접합 공정에 의한 자기정렬 코발트 실리사이트 및 얇은 접합 형성에 관한 연구)

  • 이석운;민경익;주승기
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.29A no.2
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    • pp.68-76
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    • 1992
  • Concurrent Junction process (simultaneous formation of a silicide and a junction on the implanted substrate) by Rapid Thermal Annealig has been investigated. Electrical and material properties of CoSi$_2$ films were analyzed with Alpha Step, 4-point probe, X-ray diffraction(XRD) and Scanning Electron Microscope(SEM). And CoSi$_2$ junctions were examined with Spreading Resistance probe in order to see the redistribution of electrically activated dopants and determined the junction depth. Two step annealing process, which was 80$0^{\circ}C$ for 30sec and 100$0^{\circ}C$ for 30sec in NS12T ambient was employed to form CoSi$_2$ and shallow junctions. Resistivity of CoSi$_2$ was turned out to be 11-15${\mu}$cm and shallow junctions less than 0.1$\mu$m were successfully formed by the process. It was found that the dopant concentration at CoSi$_2$/Si interface increased as decreasing the thickness of Co films in case of $p^{+}/n$ and $n^{+}/p$ junctions while the junction depth decreased as increasing CoSiS12T thickness in case of $p^{+}/n$ junction.

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