• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.19 no.2
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• pp.55-62
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• 2005

There are many risk factors of electrical shock caused by a minimum of protective devices, loose working environments, deterioration of installations at temporary power installations of construction sites. An insulation cover for instrument transformer(MOF) used in 22.9[kV] class power receiving system hasn't shown good performance in terms of electrical safety because of short clearance between insulation cover and each input and output wire junction part. The insulation cover is easily moved by outside environment as wind or rain because of different size between insulation cover and busing, also can be leaded to breakdown by tracking. Therefore, we have proposed the insulation cover which effectively can prevent from electrical disaster in this paper, and a utility model patent had been registered already. To decrease the electric field concentrated on specific part, we had roundly designed the shape of insulation cover and the clearance between cover and live part was adjusted to be longer than the existing thing. The proposed insulation cover was evaluated by using the electric field solution program.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.9
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• pp.559-564
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• 2016

This study examined the malfunction mode of the HCMOS IC under narrow-band high-power electromagnetic wave. Magnetron is used to a narrow-band electromagnetic source. MFR (malfunction failure rate) was measured to investigate the HCMOS IC. In addition, we measured the resistance between specific pins of ICs, which are exposed and not exposed to the electromagnetic wave, respectively. As a test result of measurement, malfunction mode is shown in three steps. Flicker mode causing a flicker in LED connected to output pin of IC is dominant in more than 7.96 kV/m electric field. Self-reset mode causing a voltage drop to the input and output of IC during electromagnetic wave radiation is dominant in more than 9.1 kV/m electric field. Power-reset mode making a IC remained malfunction after electromagnetic radiation is dominant in more than 20.89 kV/m. As a measurement result of pin-to-pin resistance of IC, the differences between IC exposed to electromagnetic wave and normal IC were minor. However, the five in two hundred IC show a relatively low resistance. This is considered to be the result of the breakdown of pn junction when latch-up in CMOS occurred. Based on the results, the susceptibility of HCMOS IC can be applied to a basic database to IC protection and impact analysis of narrow-band high-power electromagnetic waves.

• Clean Technology
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• v.29 no.4
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• pp.255-261
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• 2023

Power semiconductors are semiconductors used for power conversion, transformation, distribution, and control. Recently, the global demand for high-voltage power semiconductors is increasing across various industrial fields, and optimization research on high-voltage IGBT components is urgently needed in these industries. For high-voltage IGBT development, setting the resistance value of the wafer and optimizing key unit processes are major variables in the electrical characteristics of the finished chip. Furthermore, the securing process and optimization of the technology to support high breakdown voltage is also important. Etching is a process of transferring the pattern of the mask circuit in the photolithography process to the wafer and removing unnecessary parts at the bottom of the photoresist film. Ion implantation is a process of injecting impurities along with thermal diffusion technology into the wafer substrate during the semiconductor manufacturing process. This process helps achieve a certain conductivity. In this study, dry etching and wet etching were controlled during field ring etching, which is an important process for forming a ring structure that supports the 3.3 kV breakdown voltage of IGBT, in order to analyze four conditions and form a stable body junction depth to secure the breakdown voltage. The field ring ion implantation process was optimized based on the TEG design by dividing it into four conditions. The wet etching 1-step method was advantageous in terms of process and work efficiency, and the ring pattern ion implantation conditions showed a doping concentration of 9.0E13 and an energy of 120 keV. The p-ion implantation conditions were optimized at a doping concentration of 6.5E13 and an energy of 80 keV, and the p+ ion implantation conditions were optimized at a doping concentration of 3.0E15 and an energy of 160 keV.

• Journal of the Korean Society of Radiology
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• v.10 no.1
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• pp.21-28
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• 2016

This study tries to evaluate the usefulness CSI treatment. Compare the standard technique and simple technique, using the volume region of a high dose of Field joints (hot spot) or low dose regions (cold Spot). In patients who agreed to this study, obtain CT image using CT simulator skull to pelvis region. Standard Technique were performed on the movement of the joint radiation field range and simple technique has set a treatment plan to secure the radiation field range and analyzed treatment planning. Under analysis standard technique occurred the area of the high dose(Hot Spot) for the area overlapping the field and simple technique showing a uniform doses. CI indices of standard technique and simple technique was 1.6~3, 1.6~1.87, CN indices was 0.32~0.53, 0.46~0.51 and HI indices was 0.11~0.33, 0.2~0.26. Therefore, adjacent to part of the dose distribution junction more equally than simple technique compared to the Standard Technique. Compare the dose distribution patterns using CI, CN, HI indices, showed a uniform dose distribution in the simple technique. so, simple technique was determined appropriate treatment the CSI.

• Journal of the Korean Magnetics Society
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• v.21 no.4
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• pp.121-126
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• 2011

Spin dynamics of magnetic tunnel junctions with free and fixed reference layers is investigated by ferromagnetic resonance micromagnetic simulations. First, in magnetic tunnel junctions with an exchange biased synthetic ferrimagnetic reference layer, a magnetization direction of each layer and the tunneling magnetoresistance are calculated for a DC magnetic field. To investigate the spin exciting modes in magnetic tunnel junctions, we simulate the ferromagnetic resonance frequency spectra with small RF magnetic fields. Exciting modes of the tunneling magnetoresistance calculated by an included angle between free and reference layers is interpreted from those of each layer. Spin exciting modes are different according to a signs of the DC magnetic field. In a negative magnetic field, FMR frequency spectra of free and reference layers are well elucidated by the modified Kittel's equation. However, in a positive magnetic field, there is no simple analytic solution related to FMR frequency spectra due to the coupled modes. Since ferromagnetic layers in magnetic tunnel junctions are interactive each other, careful considerations of the reference and fixed layer as well as the free layer are required for understanding on the spin dynamics of magnetic tunnel junctions with an exchange biased synthetic ferrimagnetic reference layer.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.8
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• pp.14-18
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• 2018

Generally. the Ohmic's law is an important factor to increase the conductivity in a micro device. So it is also known that the Ohmic contact in a semiconductor device is import. The PN junction as a structure of semiconductor involves the depletion layer, and this depletion layer induces the non linear electrical properties and also makes the Schottky contact as an intrinsic characteristics of semiconductor. To research the conduction effect of insulators in the semiconductor device, $SiO_2$ thin film and $V_2O_5/SiO_2$ thin film were researched by using the current-voltage system. In the nano electro-magnetic system, the $SiO_2$ thin film as a insulator had the non linear Schottky contact, and the as deposited $V_2O_5$ thin film had the linear Ohmic contact owing to the $SiO_2$ thin film with superior insulator's properties, which decreases the leakage current. In the positive voltage, the capacitance of $SiO_2$ thin film was very low, but that of $V_2O_5$ thin film increased with increasing the voltage. In the normal electric field system, it was confirmed that the conductivity of $V_2O_5$ thin film was increased by the effect of $SiO_2$ thin film. It was confirmed that the Schottky contact of semiconductors enhanced the performance of electrical properties to increased the conductivity.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.36 no.4
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• pp.413-417
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• 2023

Gallium Oxide (Ga₂O₃) is preferred as a material for next generation power semiconductors. The Ga₂O₃ should solve the disadvantages of low thermal resistance characteristics and difficulty in forming an inversion layer through p-type ion implantation. However, Ga₂O₃ is difficult to inject p-type ions, so it is being studied in a heterojunction structure using p-type oxides, such as NiO, SnO, and Cu₂O. Research the lateral-type FET structure of NiO/Ga₂O₃ heterojunction under the Gate contact using the Sentaurus TCAD simulation. At this time, the VG-ID and VD-ID curves were identified by the thickness of the Epi-region (channel) and the doping concentration of NiO of 1×10¹⁷ to 1×10¹⁹ cm-3. The increase in Epi region thickness has a lower threshold voltage from -4.4 V to -9.3 V at I_D = 1×10^-8 mA/mm, as current does not flow only when the depletion of the PN junction extends to the Epi/Sub interface. As an increase of NiO doping concentration, increases the depletion area in Ga₂O₃ region and a high electric field distribution on PN junction, and thus the breakdown voltage increases from 512 V to 636 V at I_D =1×10^-3 A/mm.

• Journal of the Korean Magnetics Society
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• v.20 no.4
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• pp.129-133
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• 2010

Two-layered ferromagnetic alloy films (NiFe, CoFe) with a Conetic (NiFeCuMo) intermediately soft magnetic layer of different thickness were investigated to correlate the coercivity values and magnetization process with the strength of saturation field of hard axis. Thickness dependence of the $H_{EC}$ (coercivity of easy axis), $H_{HS}$ (saturation field of hard axis.), and X (susceptibility) of NiFe and NiFeCuMo thin films for the glass/Ta(5 nm)/[CoFe or NiFe(5 nm-t/2)]/NiFeCuMo(t = 0, 4, 6, 8, 10 nm)/[CoFe or NiFe(5 nm-t/2)]/Ta(5 nm) films prepared by the ion beam deposition method was measured. The magnetic properties $H_{EC}$, $H_{HS}$, and X of two-layered ferromagnetic CoFe, NiFe films with a NiFeCuMo intermediately super-soft magnetic layer were strongly depended on the thickness of NiFeCuMo layer. The value of the coercivity and magnetic susceptibility of the NiFeCuMo film decreased by 25% and doubled relative to that of the NiFe film.

• Progress in Superconductivity
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• v.5 no.1
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• pp.50-54
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• 2003

We have fabricated $∂^2$$B_{z}$ /$∂x^2$ type planar gradiometers and studied their properties in operation under various field conditions. $YBa_2$$Cu_3$$O_{7}$ film was deposited on $SrTiO_3$ (100) substrate by a pulsed laser deposition (PLD) system and patterned into a device by the photolithography with ion milling technique. The device consists of 3 pickup loops designed symmetrically Inner dimension and the width of the square side loops are 3.6 mm and 1.2 mm, respectively, and the corresponding dimensions of the center loop are 2.0 mm and 1.13 mm. The length of baseline gradiometer is 5.8 mm. Step-edge junction width is 3.0 $\mu\textrm{m}$ and the hole size of the SQUID loop is 3 $\mu\textrm{m}$ ${\times}$ 52 $\mu\textrm{m}$. The SQUID inductance is estimated to be 35 pH. The device was formed on a 20 mm ${\times}$ 10 mm substrate. We have tested the behavior of the device in various field conditions. The unshielded gradiometer was stable under extremely hostile conditions on a laboratory bench. Noise level 0.45 pT/$\textrm{cm}^2$/(equation omitted)Hz and 0.84 pT/$\textrm{cm}^2$/(equation omitted)Hz at 1 Hz for the shielded and the unshielded cases, which correspond to equivalent field noises of 150 fT/(equation omitted)Hz and 280 fT/(equation omitted)Hz, respectively. In spite of the short baseline of 5.8 mm, the high common-mode-rejection-ratio of the gradiometer, $10^3$, allowed us to successfully record magnetocardiogram of a human subject, which demonstrates the feasibility of the design in biomagnetic studies.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.3 no.1
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• pp.18-25
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• 1978

The 1/f noise spectrum of short-circuited output drain current due to the Shockley-Read-Hal] recombination centers with a single lifetime in homogeneous nondegenerate MOS-field effcte transtors with n-type channel is calculated under the assumptions that the quasi-Fermi level for the carriers in each energy band can not be defined if we include the fluctuation for time varying quantities. and so 1/f noise is a majority carrier effect. Under these assumptions the derived 1/f noise in this paper show some essential features of the 1/f noise in MOS-field effect transistors. That is, it has no lowfrequency plateau and is proportionnal to the channel cross area A and to the driain bias voltage Vd and inversely proportional to the channel length L3 in MOS field effect transistors. This model can explain the discrepancy between the transition frequency of the noise spectrum from 1/f- response to 1/f2 and the frequency corresponding to the relaxation time related to the surface centers in p-n junction diodes. In this paper the results show that the functional form of noise spectrum is greatly influenced by the functional forms of the electron capture probability cn (E) and the relaxation time r (E) for scattering and the case of lattice scattering show to be responsible for the 4 noise in MOS fold effect transistors. So we canconclude that the source of 1/f noise is due to lattice scattering.