• Title/Summary/Keyword: Junction device

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Electrical characteristics of polysilicon thin film transistors with PNP gate (PNP 게이트를 가지는 폴리 실리콘 박막 트랜지스터의 전기적 특성)

  • 민병혁;박철민;한민구
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.33A no.3
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    • pp.96-106
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    • 1996
  • One of the major problems for poly-Si TFTs is the large off state leakage current. LDD (lightly doped drain) and offset gated structures have been employed in order to reduce the leakage current. However, these structures also redcue the oN current significantly due to the extra series resistance caussed by the LDD or offset region. It is desirable to have a device which would have the properties of the offset gated structure in the OFF state, while behaving like a fully gated device in the oN state. Therefore, we propose a new thin film transistor with pnp junction gate which reduce the leakage curretn during the OFF state without sacrificing the ON current during the ON state.

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Dependence of deep submicron CMOSFET characteristics on shallow source/drain junction depth (얕은 소오스/드레인 접합깊이가 deep submicron CMOSFET 소자 특성에 미치는 영향)

  • 노광명;고요환;박찬광;황성민;정하풍;정명준
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.33A no.4
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    • pp.112-120
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    • 1996
  • With the MOsES (mask oxide sidewall etch scheme)process which uses the conventional i-line stepper and isotropic wet etching, CMOSFET's with fine gate pattern of 0.1.mu.m CMOSFET device, the screening oxide is deposited before the low energy ion implantation for source/drain extensions and two step sidewall scheme is adopted. Through the characterization of 0.1.mu.m CMOSFET device, it is found that the screening oxide deposition sheme has larger capability of suppressing the short channel effects than two step sidewall schem. In cse of 200.angs.-thick screening oxide deposition, both NMOSFET and PMOSFET maintain good subthreshold characteristics down to 0.1.mu.m effective channel lengths, and show affordable drain saturation current reduction and low impact ionization rates.

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Inorganic charge transport materials for high reliable perovskite solar cells (고신뢰성 페로브스카이트 태양전지용 무기물 기반 전하전달층)

  • Park, So Jeong;Ji, Su Geun;Kim, Jin Young
    • Ceramist
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    • v.23 no.2
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    • pp.145-165
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    • 2020
  • Halide perovskites are promising photovoltaic materials due to their excellent optoelectronic properties like high absorption coefficient, low exciton binding energy and long diffusion length, and single-junction solar cells consisting of them have shown a high certified efficiency of 25.2%. Despite of high efficiency, perovskite photovoltaics show poor stability under actual operational condition, which is the mostly critical obstacle for commercialization. Given that the stability of the perovskite devices is significantly affected by charge-transporting layers, the use of inorganic charge-transporting layers with better intrinsic stability than the organic counterparts must be beneficial to the enhanced device reliability. In this review article, we summarized a number of studies on the inorganic charge-transporting layers of the perovskite solar cells, especially focusing on their effects on the enhanced device reliability.

The Technical Trends of Power MOSFET (전력용 MOSFET의 기술동향)

  • Bae, Jin-Yong;Kim, Yong;Lee, Eun-Young;Lee, Kyu-Hoon;Lee, Dong-Hyun
    • Proceedings of the KIEE Conference
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    • 2009.04b
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    • pp.125-130
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    • 2009
  • This paper reviews the characteristics technical trends in Power MOSFET technology that are leading to improvements in power loss for power electronic system. The power electronic technology requires the marriage of power device technology with MOS-gated device and bipolar analog circuits. The technology challenges involved in combining power handling capability with finger gate, trench array, super junction structure, and SiC transistor are described, together with examples of solutions for telecommunications, motor control, and switch mode power supplies.

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Power Supply for White GaN LED by Using SMD Type Solar Cell Array (SMD 타입 태양전지 어레이를 이용한 white GaN LED용 전원 공급 장치)

  • Kim, Seong-Il;Lee, Yoon-Pyo
    • New & Renewable Energy
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    • v.5 no.4
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    • pp.34-37
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    • 2009
  • Using six SMD(surface mount device) type AlGaAs/GaAs single junction solar cells connected in series, a power source was fabricated for a white GaN LED. The electrical properties of the power source was measured and analyzed under one sun (100mW/$cm^2$) and various indoor light (300 - 900 lux) conditions. Under 600 lux indoor light condition, output power was 17.06 ${\mu}W$ and it was 30.75 ${\mu}W$ under 900 lux indoor light condition. Using the fabricated solar cell power supply, we have turned on the white GaN LED. It was worked well under 15 ${\mu}W$(at 480 lux) power supplied from solar cell array. This kind of solar cell power supply can be used as a power source for ubiquitous sensor network (USN).

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Compositional Change of MgO Barrier and Interface in CoFeB/MgO/CoFeB Tunnel Junction after Annealing

  • Bae, J.Y.;Lim, W.C.;Kim, H.J.;Kim, D.J.;Kim, K.W.;Kim, T.W.;Lee, T.D.
    • Journal of Magnetics
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    • v.11 no.1
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    • pp.25-29
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    • 2006
  • Recent experiments have demonstrated high TMR ratios in MTJs with the MgO barrier [1,2]. The CoFeB/MgO/CoFeB junctions showed better properties than the CoFe/MgO/CoFe junctions because the MgO layer had a good crystalline structure with (001) texture and smooth and sharp interface between CoFeB/MgO [3]. The amorphous CoFeB with 20 at%B starts the crystallization at $340^{\circ}C$ [4] and this crystallization of the CoFeB helps obtaining the high TMR ratio. In this work, the compositional changes in the MgO barrier and at the interface of CoFeB/MgO/CoFeB after the CoFeB crystallization were studied in annealed MTJs. XPS depth profiles were utilized. TEM analyses showed that the MgO barrier had (100) texture on CoFeB in the junctions. B in the bottom CoFeB layer diffused into the MgO barrier and B-oxide was formed at the interface of CoFeB/MgO/CoFeB after the CoFeB crystallization.

The degradation phenomena in SiGe hetero-junction bipolar transistors induced by bias stress (바이어스 스트레스에 의한 실리콘-게르마늄 이종접합 바이폴라 트랜지스터의 열화 현상)

  • Lee, Seung-Yun;Yu, Byoung-Gon
    • Journal of the Korean Vacuum Society
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    • v.14 no.4
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    • pp.229-237
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    • 2005
  • The degradation phenomena in SiGe hetero-junction bipolar transistors(SiGe HBTs) induced by bias stress are investigated in this review. If SiGe HBTs are stressed over a specific time interval, the device parameters deviate from their nominal values due to the internal changes in the devices. Reverse-bias stress on emitter-base(EB) junctions causes base current increase and current gain decrease because carriers accelerated by the electrical field generate recombination centers. When forward-bias current stress is conducted at an ambient temperature above $140^{\circ}C$ , hot carriers produced by Auger recombination or avalanche multiplication induce current gain fluctuation. Mixed-mode stressing, where high emitter current and high collector-base voltage are simultaneously applied to the device, provokes base current rise as EB reverse-bias stressing does.

Present Status of Thin Film Solar Cells Using Textured Surfaces: A Brief Review

  • Park, Hyeongsik;Iftiquar, S.M.;Le, Anh Huy Tuan;Ahn, Shihyun;Kang, Junyoung;Kim, Yongjun;Yi, Junsin;Kim, Sunbo;Shin, Myunghun
    • Transactions on Electrical and Electronic Materials
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    • v.17 no.5
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    • pp.275-279
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    • 2016
  • This is a brief review on light trapping in Si based thin film solar cells with textured surfaces and transparent conducting oxide front electrodes. The light trapping scheme appears to be essential in improving device efficiency over 10%. As light absorption in a thin film solar cells is not sufficient, light trapping becomes necessary to be effectively implemented with a textured surface. Surface texturing helps in the light trapping, and thereby raises short circuit current density and its efficiency. Such a scheme can be adapted to single junction as well as tandem solar cell, amorphous or micro-crystalline devices. A tandem cell is expected to have superior performance in comparison to a single junction cell and random surface textures appears to be preferable to a periodic structures.

Fabrication and characterization of PbIn-Au-PbIn superconducting junctions

  • Kim, Nam-Hee;Kim, Bum-Kyu;Kim, Hong-Seok;Doh, Yong-Joo
    • Progress in Superconductivity and Cryogenics
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    • v.18 no.4
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    • pp.5-8
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    • 2016
  • We report on the fabrication and measurement results of the electrical transport properties of superconductor-normal metal-superconductor (SNS) weak links, made of PbIn superconductor and Au metal. The maximum supercurrent reaches up to ${\sim}6{\mu}A$ at T = 2.3 K and the supercurrent persists even at T = 4.7 K. Magnetic field dependence of the critical current is consistent with a theoretical fit using the narrow junction model. The superconducting quantum interference device (SQUID) was also fabricated using two PbIn-Au-PbIn junctions connected in parallel. Under perpendicular magnetic field, we clearly observed periodic oscillations of dV/dI with a period of magnetic flux quantum threading into the supercurrent loop of the SQUID. Our fabrication methods would provide an easy and simple way to explore the superconducting proximity effects without ultra-low-temperature cryostats.

An Analysis on Optimal Design and Electrical Characteristics of CT-IGBT(Circular Trench IGBT) (CT-IGBT의 최적 설계 및 전기적 특성에 관한 분석)

  • Kwak, Sang-Hyeon;Seo, Jun-Ho;Seo, In-Kon;Sung, Man-Young
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.11a
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    • pp.22-23
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    • 2008
  • The conventional IGBT has two problems to make the device taking high performance. The one is high on state voltage drop associated with JFET region, the other is low breakdown voltage associated with concentrating the electric field on the junction of between p base and n drift. This paper is about the structure to effectively improve both the lower on state voltage drop and the higher breakdown voltage than the conventional IGBT. For the fabrication of the circular trench IGBT with the circular trench layer, it is necessary to perform the only one wet oxidation step for the circular trench layer. Analysis on both the on state voltage drop and the Breakdown voltage show the improved values compared to the conventional IGBT structure. Because the circular trench layer disperses electric field from p base and n drift junction to circular trench, the breakdown voltage increase. The on state voltage drop decrease due to reduction of JFET region and direction change of current path which pass through reversed layer channel.

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