• 전기전자학회논문지
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• 제25권4호
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• pp.778-781
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• 2021

본 논문에서는 SPICE를 사용한 16단 3D NAND Flash memory compact modeling을 제안한다. 동일한 structure와 simulation 조건에서 Down Coupling Phenomenon(DCP)과 Natural Local Self Boosting(NLSB)에 대한 channel potential을 Technology Computer Aided Design(TCAD) tool Atlas(Silvaco^TM)와 SPICE로 simulation하고 분석했다. 그 결과 두 현상에 대한 TCAD와 SPICE의 channel potential이 매우 유사한 것을 확인할 수 있었다. SPICE는 netlist를 통해 소자 structure를 직관적으로 확인할 수 있다. 또한, simulation 시간이 TCAD에 비해 짧게 소요된다. 그러므로 SPICE를 이용하여 3D NAND Flash memory의 효율적인 연구를 기대할 수 있다.

• 전기학회논문지
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• 제65권3호
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• pp.439-444
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• 2016

The method for extracting the SPICE model parameter of Schottky diode under DC forward bias is proposed. A method for improving the accuracy of the SPICE model parameter at various temperatures is proposed. Three analysis steps according to the magnitude of the current is used in order to extract the parameters effectively. At each analysis step, initial parameters are calculated by using the current-voltage equations and the Levenberg-Marquardt analysis is proceeded. To verify the validity of the proposed method, the SPICE model parameters for the BAT45 and FSV1045 under DC forward bias is extracted. Schottky diode currents obtained from the proposed method shows the average relative error of 6.1% and 9% compared with the measured data for the BAT45 and FSV1045 sample at various temperatures.

• 정보처리학회논문지:소프트웨어 및 데이터공학
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• 제5권7호
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• pp.339-344
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• 2016

자동차 소프트웨어의 복잡성이 높아짐에 따라 안전문제가 중요해졌다. 그래서 이를 해결하기 위하여 Automotive SPICE 프로세스가 제안되었다. Automotive SPICE 프로세스 수행을 위해서는 통합된 관리 체계와 도구가 필요하다. 하지만 중소기업의 경우에는 인원과 자본이 부족하여 통합된 관리체계와 도구를 도입하기 힘들다. 따라서 Automtovie spice 최소 요구사항을 준수하는 HIS scope 항목을 목표로 해야 한다. 본 논문에서는 Automotive HIS scope 항목을 수행하는데 필요한 오픈 소스 기반 프로세스 관리 도구 시스템을 제안한다. 제안된 시스템으로 Automotive SPICE HIS scope 항목을 수행할 수 있으며, 수행 결과를 통하여 Automotive SPICE HIS scope 항목을 만족하는 것을 보였다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2007년도 제38회 하계학술대회
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• pp.1203-1204
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• 2007

In the methods for securing software quality and safety, two approaches - product centered approach and process centered approach - can be suggested. SPICE is a standard for the process improvement and the capability determination, which is planned for securing software quality and safety by the process centered approach. In this paper, general SPICE model, which is presented in ISO/IEC 15504 and Automotive SPICE model for automobile industry are analyzed. For securing railway software quality and safety, appropriate scheme to apply Automotive SPICE to railway software is proposed.

• 대한전기학회논문지
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• 제43권2호
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• pp.206-215
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• 1994

A method for simulating general characteristics and temperature characteristics of discharging SCR of the capacitor discharge impulse magnetizer-magnetizing fixture system using SPICE is presented. This method has been developed which can aid the design, understanding and inexpensive, time-saving of magnetizing circuit. As the detailed characteristic of magnetizing circuit can be obtained, the efficient design of the magntizing circuit which produce desired magnet will be possible using our SPICE modeling. Especially, computation of the temperature rise of discharging SCR is very important since it gives some indication of thermal characteristic of discharging circuit. It is implemented on a 486 personal computer, and the modeling results are checked against experimental measures. The experimental results have been achived using 305[V] and 607[V] charging voltage, low-energy capacitor discharge impulse magnetizer-magnetizing fixture of air cleaner DC motor.

• 대한전자공학회논문지SD
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• 제37권2호
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• pp.38-45
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• 2000

광연결 시스템의 SPICE 모델링과 이를 이용한 시스템 성능 분석에 관한 연구를 수행하였다. 먼저, 광소자의 등가회로 모델을 구현하고, 송·수신단의 회로를 설계하여 안정적인 SPICE 시뮬레이션 결과를 얻었다. SPICE 시뮬레이션 결과로 eye 다이어그램을 얻을 수 있고, 이를 토대로 BER을 계산할 수 있었다. 바이어스 조건에 따라서 turn-on 지연으로 인한 jitter 현상을 볼 수 있고, 전송율, BER, 송신단의 전력 소모, 바이어스 조건의 상호 관계를 통해 시스템의 최적화를 이룰 수 있다. 광연결 시스템의 SPICE를 이용한 최적화 방법은 Gigabit Ethernet, ATM등의 응용 분야에서 LD 구동회로와 수신단의 회로 설계에 유용하게 쓰일 것으로 기대된다.

• 한국지구과학회지
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• 제32권5호
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• pp.437-452
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• 2011

The Steptoean Positive Carbon Isotope Excursion (SPICE) is found in the Machari Formation which was interpreted to have been deposited on the middle to outer carbonate ramp environment. The Machari Formation is the Middle to Late Cambrian in age and distributed in the Yeongweol area, Gangweon Province, Korea. The SPICE event in the Machari Formation begins with the first appearance datum of trilobite Glyptagnostus reticulatus and ends with the first appearance of datum of trilobite Irvingella. The SPICE is found in approximately 120 m thick sequence and ${\delta}^{13}C$ values in the SPICE interval range from 0.6 to 4.4‰. The SPICE in the Machari Formation is interpreted to be caused by burial of organic matter in the sea floor and subsequent increase of $^{13}C$ isotope of the Late Cambrian ocean. The SPICE interval in the Machari Formation corresponds to the highstand to transgressive systems tracts.

• 전기학회논문지
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• 제58권9호
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• pp.1769-1774
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• 2009

An algorithm for extracting the BJT DC model parameter values for SPICE model is proposed. The nonlinear optimization method for analyzing the device I-V data using the Levenberg-Marquardt algorithm is proposed and the method for calculating initial conditions of model parameters to improve the convergence characteristics is proposed. The base current and collector current obtained from the proposed method shows the root mean square error of 6.04% compared with the measured data of the PNP BJT named 2SA1980.

• Journal of Power Electronics
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• 제19권6호
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• pp.1591-1600
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• 2019

In this paper, a practical SPICE model for an IGBT and a PiN diode is proposed based on the Finite Differential Method (FDM). Other than the conventional Fourier model and the Hefner model, the excess carrier distribution can be accurately solved by a fast FDM in the SPICE simulation tool. In order to improve the accuracy of the SPICE model, the Taguchi method is adopted to calibrate the extracted parameters. This paper presents a numerical modelling approach of an IGBT and a PIN diode, which are also verified by SPICE simulations and experiments.

• Journal of information and communication convergence engineering
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• 제14권2호
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• pp.115-121
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• 2016

Currently there is a lack of literature on SPICE-level models of double-gate (DG) tunnel field-effect transistors (TFETs). A DG TFET compact model is presented in this work that is used to develop a SPICE model for DG TFETs implemented with Verilog-A language. The compact modeling approach presented in this work integrates several issues in previously published compact models including ambiguity about the use of tunneling parameters A_k and B_k, and the use of a universal equation for calculating the surface potential of DG TFETs in all regimes of operation to deliver a general SPICE modeling procedure for DG TFETs. The SPICE model of DG TFET captures the drain current-gate voltage (I_ds-V_gs) characteristics of DG TFET reasonably well and offers a definite computational advantage over TCAD. The general SPICE modeling procedure presented here could be used to develop SPICE models for any combination of structural parameters of DG TFETs.