• Title/Summary/Keyword: Ionized water

Search Result 150, Processing Time 0.023 seconds

Surface Characteristics of PLA(Polylactic acid) Film Treated by Atmospheric Pressure Plasma (대기압 플라즈마 처리에 따른 PLA(polylactic acid) 필름의 표면특성 변화)

  • Jung, Jin Suk;Liu, Xuyan;Choi, Ho Suk
    • Korean Chemical Engineering Research
    • /
    • v.47 no.1
    • /
    • pp.59-64
    • /
    • 2009
  • This study investigated the surface characteristics of polylactic acid (PLA) film after one atmospheric pressure plasma treatment. We used de-ionized water and diiodomethane as polar and non-polar solvents, respectively, for measuring contact angles, and subsequently calculated the surface free energy of PLA film. The contact angle and free energy of PLA surface were optimized at the treatment time of 30 sec, RF-power of 70 W, Ar gas flow rate of 6 lpm and air exposure time of 5 min. We analyzed the change of chemical functional groups on the surface of PLA film through XPS and were able to observe the change of polar functional groups such as -C=O, -CO, -COO on the surface of PLA film after one atmospheric pressure plasma treatment.

Effects of Ni Concentration on Residual Stress in Electrodeposited Ni Thin Film for 63Ni Sealed Source (63Ni 밀봉선원용 Ni 전기도금 박막에서 Ni 농도가 잔류응력에 미치는 영향)

  • Yoon, Pilgeun;Park, Deok-Yong
    • Journal of the Korean institute of surface engineering
    • /
    • v.50 no.1
    • /
    • pp.29-34
    • /
    • 2017
  • Chloride plating solution was fabricated by dissolving metal Ni powders in a mixed solution with HCl and de-ionized water. Effects of $Ni^{2+}$ and saccharin concentrations in the plating baths on current efficiency, residual stress, surface morphology and microstructure of Ni films were studied. In the case of $0.2M\;Ni^{2+}$ concentration, current efficiency was decreased to about 65 % with increasing saccharin concentration, but, in the case of $0.7M\;Ni^{2+}$ concentration, it was shown more than 90 % with the increase of saccharin concentration. Residual stress of Ni thin film was appeared to be about 400 MPa up to 0.0244 M saccharin concentration at the $0.2M\;Ni^{2+}$ concentration and surface morphology with severe cracks was observed in the range of 0.0487~0.0975 M saccharin concentration. Residual stress of Ni thin films was measured to be about 750 MPa without saccharin addition and 114~148 MPa at the range of 0.0097~0.0975 M saccharin concentration for the $0.7M\;Ni^{2+}$ concentration. Relatively low residual stress values (114~148 MPa) of the Ni films at the range of 0.0097~0.0975 M saccharin concentration may be resulted from codeposition of S from saccharin. Ni films at $0.7M\;Ni^{2+}$ concentration showed smooth surface morphology and were independent of saccharin concentration. Ni films at $0.7M\;Ni^{2+}$ concentration consist of FCC(111), FCC(200), FCC(220) and FCC(311) peaks and the intensities of FCC(111) and FCC(200) peaks increased with increasing saccharin concentration. Also, the average grain size decreased with increasing saccharin concentration from about 30 nm to about 15 nm.

Dry Etching of NiFe, NiFeCo, and Ta in Cl2/Ar Inductively Coupled Plasma (Cl2/Ar 유도 결합 플라즈마를 이용한 NiFe, NiFeCo, Ta의 건식식각)

  • Ra, Hyun-Wook;Park, HyungJo;Kim, Ki Ju;Kim, Wan-Young;Hahn, Yoon-Bong
    • Korean Chemical Engineering Research
    • /
    • v.43 no.1
    • /
    • pp.76-79
    • /
    • 2005
  • Dry etching of NiFe, NiFeCo, and Ta for magnetic random access memory (MRAM) by inductively coupled plasmas (ICPs) of $Cl_2/Ar$ has been carried out. NiFe and NiFeCo showed maximum etch rates at a particular ICP source power, but the etch rate of Ta increased with the ICP source power. The etch rates of the magnetic thin films increased with the RF chuck power, but decreased with the operating pressure and the $Cl_2$ concentration. To avoid a corrosion problem by chlorine, the etched samples were rinsed with de-ionized water for 5 minutes after etching. The etch profile showed a clean and smooth surface at 50% $Cl_2$ concentration.

Polarization Behaviors of SnCu Pb-Free Solder Depending on the P, Ni, Addition (SnCu계 무연솔더의 Ni, P 첨가에 따른 분극거동)

  • Hong Won Sik;Kim Whee Sung;Park Sung Hun;Kim Kwang-Bae
    • Korean Journal of Materials Research
    • /
    • v.15 no.8
    • /
    • pp.528-535
    • /
    • 2005
  • It is inclined to increase that use of hazardous substances such as lead(Pb), mercury (Hg), cadmium(Cd) etc. are prohibited in the electronics according to environmental friendly policies of an advanced nation for protecting environment of earth. As this reasons, many researches for ensuring the reliability were proceeding in Pb free soldering process. n the flux remains on the PCB(printed circuit board) in the soldering process or the electronics exposed to corrosive environment, it becomes the reasons of breakdown or malfunction of the electronics caused by corrosion. Therefore in this studies we researched the polarization and Tafel properties of Sn40Pb and SnCu system solders based on the electrochemical theory. The experimental polarization curves were measured in distilled ionized water and 1 mole $3.5 wt\%$ NaCl electrolyte of $40^{\circ}C$, pH 7.5. Ag/AgCl and graphite were utilized by reference and counter electrodes, respectively. To observe the electrochemical reaction, polarization test was conducted from -250mV to +250mV. From the polarization curves composed of anodic and cathodic curves, we obtained Tafel slop, reversible electrode potential(Ecorr) and exchange current density((cow). In these results, we compared the corrosion rate of SnPb and SnCu solders.

Tafel Characteristics by Electrochemical Reaction of SnAgCu Pb-Free Solder (SnAgCu계 무연솔더의 전기화학적 반응에 따른 타펠 특성)

  • Hong Won Sik;Kim Kwang-Bae
    • Korean Journal of Materials Research
    • /
    • v.15 no.8
    • /
    • pp.536-542
    • /
    • 2005
  • Recently European Council(EU) published the RoHS(restriction of the use of certain hazardous substances in electrical and electronic equipment) which is prohibit the use of Pb, Hg, Cd, $Cr^{+6}$, PBB or PBDE in the electrical and electronic equipments. So EU member States shall ensure that, from 1 July 2006, new electrical and electronic equipment put on the market does not contain 6 hazardous substances. The one of the most important in electronics manufacturing process is soldering. Soldering process use the chemical substances which are applied in fluxing and cleaning processes and it can generate the malfunction of electronics caused by corrosion in the fields conditions. Therefore this study researched on the polarization and Tafel properties of Sn40Pb and Sn3.0Ag0.5Cu(SAC) solder based on the electrochemical theory. We prepared SnPb specimens which was aged in $150^{\circ}C,\;180^{\circ}C$ for 15 minutes ana Sn3.0Ag0.5Cu specimens that was aged in $180^{\circ}C,\;220^{\circ}C$ for 10 minutes. Experimental polarization curves were measured in distilled ionized water and $3.5 wt\%$, 1 mole NaCl electrolyte of $40^{\circ}C$, pH 7.5. Ag/AgCl and graphite were utilized by reference and counter electrode, respectively. To observe the electrochemical reaction, polarization test was conducted from -250 mV to +250 mV. From the polarization curves that were composed of anodic and cathodic curves, we obtained Tafel slop, reversible electrode potential(Ecorr) and exchange current density(Icorr). In these results, corrosion rate for two specimen were compared Sn3.0Ag0.5Cu with SnPb solders

Ionization Behaviors in Various Soils Subjected to Impulse Currents (임펄스전류에 의한 토양의 종류별 이온화 특성)

  • Lee, Bok-Hee;Kim, Hoe-Gu;Park, Geon-Hun;Baek, Young-Hwan
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
    • /
    • v.22 no.12
    • /
    • pp.87-94
    • /
    • 2008
  • This parer presents the soil ionization phenomena and parameters associated to characterize the transient performances of grounding system under lightning impulse Currents. Ionization properties in occurring some soil media were experimentally investigated. The cylindrical test cell was employed in order to facilitate the analysis of soil breakdown field intensity and ionized radius. The soil breakdown field intensity, dependence of impedance on the amplitude of impulse current, V-I curves and transient impedances were discussed based on the voltage and current oscillograms. It was found that the ionization process and dynamic behaviors were strongly dependent on the types of soil and two current peaks were not observed in highly water-saturated soils. The results presented in this paper will provide useful information on the improvement of transient performance of a grounding system subjected to lightning impulse Current considering the soil ionization.

A Study on the Improvement of Oxide-CMP Characteristics by Dispersion Time and Content of Abrasive (연마제의 분산시간과 첨가량이 Oxide-CMP에 미치는 영향)

  • Park, Sung-Woo;Han, Sang-Jun;Lee, Sung-Il;Lee, Young-Kyun;Choi, Gwon-Woo;Seo, Yong-Jin;Lee, Woo-Sun
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2007.11a
    • /
    • pp.527-527
    • /
    • 2007
  • CMP가 1980년 IBM에 의해 반도체 웨이퍼의 표면 연마를 위해 적용된 후, 많은 연구 개발의 노력으로 반도체 집적회로의 제조 공정에서 필수 핵심기술이 되었으나, 소모자재(연마패드, 탄성지지대, 슬러리, 패드 컨디셔너)의 비용이 CMP 공정 비용의 70% 이상을 차지하는 등 제조단가가 높다는 단점을 극복할 수가 없었다. 특히, 고가의 슬러리가 차지하는 비중이 40% 이상을 넘고 있어, 슬러리 원액의 소모량을 줄이기 위한 연구들이 현재 활발히 연구 중이다. 슬러리의 변수로는 연마입자의 종류 및 특성, 용액의 pH, 연마입자의 슬러리내 안정성 등이 있다. 슬러리내 연마입자는 연마량과 균일도 측면에서 밀접한 관계를 가지고 있다. 또한, 연마제의 영향에 따라 연마율의 차이 즉, CMP 특성의 변화를 보이고 있기 때문에 투입량 또한 최적화가 필요하다. 본 연구에서는 새로운 연마제의 특성을 알아보기 위해 탈이온수(de-ionized water; DIW)에 $CeO_2,\;MnO_2,\;ZrO_2$ 등을 첨가한 후 분산시간에 따른 연마 특성과 atomic force microscopy (AFM)분석을 통해 표면 거칠기를 비교 분석하였다. 그리고, 세 가지 종류의 연마제를 각각 1wt%, 3wt%, 5wt% 첨가하여 산화막에 대한 CMP 특성을 알아본 후, scanning electron microscopy (SEM) 측정과 입도 분석을 통해 그 가능성을 알아보았다.

  • PDF

Sonochemical Synthesis and Photocatalytic Characterization of ZnO Nanoparticles (초음파 방법을 이용한 ZnO 나노입자 합성 및 광촉매 특성 연구)

  • Kim, Min-Seon;Kim, Jae-Uk;Yoo, Jeong-Yeol;Kim, Jong-Gyu
    • Journal of the Korean Chemical Society
    • /
    • v.60 no.1
    • /
    • pp.34-38
    • /
    • 2016
  • In this paper, zinc oxide nanoparticles (ZnO NPs) were synthesized using the sonochemical method, where equimolar amounts of zinc acetate dehydrate and sodium hydroxide were separately dissolved in deionized water, and then mixed for 30 min under magnetic stirring. The resultant white gel was sonicated for 60, 120, 180, 240, and 360 min with magnetic stirring. The obtained precipitates were centrifuged, repeatedly washed with ethanol to remove ionic impurities, and dried at 50 ℃ for 24 h. The formation of pure NPs was confirmed by X-ray diffraction, and their crystallinity and crystal phases were analyzed as well. Structural investigation was carried out by field-emission scanning electron microscopy (FE-SEM). The photocatalysis behavior of the ZnO NPs was investigated in a dark room under UV irradiation, using Rhodamine B. Spherical, rod, and flower-like ZnO NPs could be obtained by adjusting the sonication time, as observed by FE-SEM. The flower-like ZnO NPs exhibited excellent photocatalytic activity.

Surface Modification of Ba0.6Sr0.4TiO3 by Trimethylsilyl Chloride as a Silylation Agent (Trimethylsilyl Chloride를 Silylation Agent로 사용한 Ba0.6Sr0.4TiO3 나노입자의 표면개질 연구)

  • Lee, Chan;Han, Wooje;Park, Hyung-Ho
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.26 no.4
    • /
    • pp.127-132
    • /
    • 2019
  • In this study, barium strontium titanate (BSTO) with high dielectric perovskite structure was synthesized by liquid-solid solution synthesis and the surface was modified using trimethylsilyl chloride (TMCS) as a silylation agent. Silylation surface modification is a method of reacting -OH ligand on the surface of BSTO nanoparticles with Cl in TMCS to generate HCl and replacing the ligand on the surface of nanoparticles with -Si, -CH3. Silylation was optimized by varying the concentration of TMCS, and the structure of the silicon network was confirmed by Fourier-transform infrared spectroscopy. In addition, the crystallinity of BSTO nanoparticles was confirmed by X-ray diffractometer and the size of the nanoparticles was calculated using Scherrer equation. The field emission scanning electron microscopic image observed the change of the surface-modified BSTO particle size, and the contact angle measurement confirmed the hydrophobic property of the contact angle of 120.9° in the optimized nanoparticles. Finally, the surface-modified BSTO dispersion experiment in de-ionized water confirmed the hydrophobic degree of the nanoparticles.

Temperature Effect on the Swelling Pressure of a Domestic Compacted Bentonite Buffer (국산 압축벤토나이트 완충재의 온도에 따른 팽윤압 특성 연구)

  • Lee, Ji-Hyeon;Lee, Min-Soo;Choi, Heui-Joo;Choi, Jong-Won
    • Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
    • /
    • v.8 no.3
    • /
    • pp.207-213
    • /
    • 2010
  • The effect of temperature on swelling pressure was observed with a Korean domestic Ca-bentonite which has been considered as a potential buffer material in the engineering barrier of a high level radioactive waste (HLW) disposal system. The Ca-bentonite was compacted to a dry density of 1.6 g/$cm^3$, and then de-ionized water was supplied into it with a constant pressure of 0.69 MPa. The equilibrium swelling pressures were measured with different temperatures of $25^{\circ}C$, $30^{\circ}C$, $40^{\circ}C$, $50^{\circ}C$, $60^{\circ}C$, $70^{\circ}C$, respectively. The Ca-bentonite showed a sufficiently high swelling pressure of 5.3 MPa at room temperatures. Then it was clearly showed that the equilibrium swelling pressure was decreased with an increase of temperature. Interestingly, there were some differences in temperature effect on the equilibrium swelling pressure when the environmental temperature is increasing or decreasing. For further clarifying the swelling behaviour of a Korea domestic Ca-bentonite, the change of a compaction level, and the composition variation of a supplied water would be needed to use in conceptual design of HLW disposal system.