• Proceedings of the Materials Research Society of Korea Conference
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• 1993.11a
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• pp.77-77
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• 1993

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 1998.05a
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• pp.162-163
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• 1998

• The Korean Journal of Ceramics
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• v.6 no.2
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• pp.129-133
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• 2000

Boron nitride films were synthesized with $N_2$ion flux of low energy, up to 100 eV, at different substrate temperatures of no heating, 200, 400, 500, and $800^{\circ}C$, respectively. Boron was supplied by e-beam evaporation at the rate of $1.5\AA$/sec. For all the conditions, hexagonal BN (h-BN) phase was mainly synthesized and high resolution transmission electron microscopy (HRTEM) showed that (002) planes of h-BN phase were aligned vertical to the Si substrate. The maximum alignment occurred around $400^{\circ}C$. In addition to major h-BN phase, transmission electron diffraction (TED) rings identified the formation of cubic BN (c-BN) phase. But HRTEM showed no distinct and continuous c-BN layer. These results suggest that c-BN phase may form in a scattered form even when h-BN phase is mainly synthesized under small momentum transfer by bombarding ions, which are not reconciled with the macro compressive stress model for the c-BN formation.

• Journal of Sensor Science and Technology
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• v.6 no.3
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• pp.200-206
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• 1997

Using $SiCl_{2}H_{2}$, $NH_{3}$ and $N_{2}O$, we have fabricated silicon oxynitride ($Si_{x}O_{y}N_{z}$) layers on thermally oxidized silicon wafer by low pressure chemical vapor deposition. Three different compositions were achieved by controlling gas flow ratios($NH_{3}/N_{2}O$)) to 0.2, 0.5 and 2 with fixed gas flow of $SiCl_{2}H_{2}$. Ellipsometry and high frequency capacitance-voltage(HFCV) measurements were adapted to investigate the difference of the refractive index, dielectric constant, and composition, respectively. Regardless of nitride content, silicon oxynitrides had similar stability to silicon nitrides. The relative standing of alkali ion sensitivity in silicon oxynitride layers was influenced by nitride content. The better alkali ion-sensitivity was achieved by increasing oxide content in bulk of silicon oxynitrides.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.137-137
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• 2012

인공관절은 노인성 질환이나 자가 면역질환, 신체적인 외상 등으로 인하여 발생하는 관절의 손상 부위를 대체하기 위하여 고안된 관절의 인공 대용물이다. 인공 관절 중 인공 고관절의 경우 라이너(Liner)와 헤드(Head) 부분이 직접적인 마모 운동을 수행하게 되므로, 이 부분의 소재 특성에 따라 인공관절의 수명이 결정 되게 된다. 현재 헤드 소재로서는 Co-Cr-Mo 합금이, 라이너 소재로서는 고분자 소재인 UHMWPE (Ultra High Molecular Weight Polyethylene)가 주로 사용되고 있다. 이러한 MOP (Metal-On-Polymer) 구조의 인공관절의 경우, 충격흡수의 장점이 있는 반면, 관절 운동시 발생하는 UHMWPE 의wear debris에 의해 골용해가 발생하게 되어 인공관절의 수명이 저하되는 문제점이 있으며, 금속 헤드의 마모로 인한 금속이온의 용출은 세포 독성의 문제를 야기하여 인공관절의 수명을 저하시키는 또 다른 원인이 되고 있다. 따라서 본 연구에서는 PIII&D (Plasma Immersion Ion Implantation & Deposition) 공정을 이용하여 금속 (Co-Cr-Mo 합금)소재 위에 세라믹 (niobium nitride) 박막을 증착하여 상대재인 UHMWPE의 마모를 줄이고자 하는 연구를 진행하였다. 금속 소재 위에 증착된 세라믹 박막은 상대재인 UHMWPE의 마모량을 줄여줄 뿐만 아니라 금속이온의 용출을 막아준다는 장점이 있으나, 장시간의 마모 운동에 의하여 발생하는 박막의 박리 현상은 인공관절의 수명을 급격히 저하시키는 또 다른 원인이 된다. 이러한 단점을 해결하기 위하여, 박막의 증착 초기에 이온주입과 증착을 동시에 수행하는 dynamic ion mixing공정을 수행하였다. Dynamic ion mixing 공정을 수행함에 따라 박막과 금속 사이의 접착력이 증가하게 되어, UHMWPE의 마모량이 2배 가까이 감소하는 것을 확인할 수 있었으며, 장시간의 마모시험에서도 우수한 결과를 얻을 수 있었다. 또한 UHMWPE의 마모량을 감소시키기 위하여 박막을 증착하기 전에 금속 소재에 질소 이온주입을 수행하는 pre-ion implantation 공정을 도입하였다. 질소 이온주입 결과 Co-Cr-Mo 합금 표면에 부분적으로 CrN, Cr2N의 세라믹 상이 형성 되는 것을 확인할 수 있었으며, 그에 따라 UHMWPE의 마모량이 2배 이상 감소 되는 것을 확인 할 수 있었다.

• Journal of Surface Science and Engineering
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• v.29 no.5
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• pp.556-562
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• 1996

Carbon nitride (CN) films were synthesized on silicon substrates by a combined ion-beam and laser-ablation method under various conditions; ion-beam energy and ion-beam current were varied. Raman spectroscopy and spectroscopic ellipsometry (SE) were employed to characterize respectively the structural and the optical properties of the CN films. Raman spectra show that all the CN films are amorphous independent of the ion-beam current and the ion-beam energy. Refractive indices, extinction coefficients and optical band gaps which were determined from the measured SE spectra exhibit a significant dependence on the synthesis conditions. Especially, the decrease of the refractive indices and the shrinkage of the optical band gap is noticeable as the ion-beam current and/or the ion-beam energy increase.

• Transactions on Electrical and Electronic Materials
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• v.5 no.3
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• pp.98-103
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• 2004

The plasma properties in the facing target sputtering system during carbon nitride film deposition have been investigated. The ionized nitrogen species of the deposited films increased with increasing discharge current and were independent of the nitrogen pressure. The nitrogen content in the films did not vary significantly with the variation of nitrogen gas. The electron temperature was high close to that in the inter-cathode region, reduced as the electrons moved away from the most intense region of magnetic confinement and increased again outside this region. Calculations based on the film composition showed that the ion to carbon atom ratio at the substrate was about 50 and that the ratio between the ionized and neutral nitrogen molecules was about 0.25.

• Proceedings of the KIEE Conference
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• 1988.07a
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• pp.328-331
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• 1988

Sealed Interface Local Oxidation (SILO) technology has been investigated using a nitride/oxide/nitride three-layered sandwich structure. P-type silicon substrate was either nitrided by rapid thermal processing, or silicon nitride was deposited by LPCVD method. A three-layered sandwich structure was patterned either by reactive ion etch (RIE) mode or by plasma mode. Sacrificial oxidation conditions were also varied. Physical characterization such as cross-section analysis of field oxide, and electrical characterization such as gate oxide integrity, junction leakage and transistor behavior were carried out. It was found that bird's beak was nearly zero or below 0.1um, and the junction leakages in plasma mode were low compared to devices of the same geometry patterned in RIE mode, and gate oxide integrity and transistor behavior were comparable. Conclusively, SILO process is compatible with conventional local oxidation process.

• Journal of Surface Science and Engineering
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• v.23 no.4
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• pp.218-224
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• 1990

Silicon nitride thin(SiNx) is deposited onto 3 inch silicon wafor using ECR plasma apparatus. For the two different plasma extraction windows size, the thin films which were deposited by changing the SiH4/N2 gas fole at at 1.5mTorr without substrate heating are analyzed through the XPS and wlliposometer measurements. The very uniform and good quality silicon nitride thin film were obtained with the analyzed results of the deposited films, and particularly, ion temperature perpendicular to the magnetic filed was nearly same as the neutral gas temperature. The large amount of plasma loss in the transport process following magnetic field lines could be seen from the plasma emission intensity measurements.

• Transactions on Electrical and Electronic Materials
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• v.12 no.1
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• pp.16-19
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• 2011

The oxide-nitride-oxide (ONO) deposition process was added to the beginning of a 0.25 ${\mu}m$ embedded polysiliconoxide-nitride-oxide-silicon (SONOS) process before all of the logic well implantation processes in order to maintain the characteristics of basic CMOS(complementary metal-oxide semiconductor) logic technology. The system subsequently suffered severe ONO rupture failure. The damage was caused by the ONO implantation and was responsible for the ONO rupture failure in the embedded SONOS process. Furthermore, based on the experimental results as well as an implanted ion's energy loss model, processes primarily producing permanent displacement damages responsible for the ONO rupture failure were investigated for the embedded SONOS process.