• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.3
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• pp.18-27
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• 1998

Molecular dynamicsinvestigations of ion implantation considering point defect generation were performed with ion energies in the range of ~1keV, Simulation starts perfect diamond cubic lattice site. Stillinger-Weber potential and ZBL potential were used to calculate forces between atoms. We have simulated slowing-down of ion velocity, ion trajectory and coupled-coing between ion and silicon. We also discussed distribution of point defect using rdial distribution function. We found that interstitial produced by ion bombardment mainly formed interstitial cluster.

• Tribology and Lubricants
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• v.20 no.3
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• pp.145-151
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• 2004

A modified surface layer by ion implantation is very thin (under 1 $\mu\textrm{m}$) but has superior mechanical characteristics. therefore ion implantation has been used successfully as a surface treatment technology to improve the wear, fatigue, and corrosion resistances of materials. MEVVA which is a kind of ion beam apparatus has merits of low cost and is usable to various metals, but occurs a droplet ranging from micron to tens of micron on the implanted surface at ion implantations. wear is a dynamic phenomenon on interacting surfaces with rotative motion. Since wear changes in condition of the surface, we should control to surface. In order to improve a wear resistance of Ti ion implanted 1C-3Cr steel(material for roller in the cold working process), it is essential to investigate the effect of the droplets on the wear characteristics. In this study, we investigate the effect of the droplets on the wear characteristics of 1C-3Cr steel using SEM Tribosystem as in-situ system. Results show that the droplet occurred at ion implantation becomes the cause of severe wear. Therefore, the ion-implanted surface should be removed the droplet to improve wear resistance.

• Journal of Radiation Industry
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• v.5 no.3
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• pp.243-247
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• 2011

In this study, a convenient method for the selective immobilization of single strand DNA (ssDNA) on a polymer surface was described. A positively charged polyelectrolyte, poly(diallyldimethylammonium chloride) (PDDA), was spin-coated on a tissue culture petridish and the micropatterns of the PDDA were formed by selective ion implantation through a pattern mask. The surface property of the implanted PDDA was investigated by using a surface profiler and FT-IR spectrometer. Cy3-labeled ssDNA was selectively immobilized on the PDDA patterns through ionic interaction and thus, well-defined ssDNA patterns were obtained.

• Journal of Korean Vacuum Science & Technology
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• v.1 no.1
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• pp.1-12
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• 1997

A new three-dimensional (3D) Monte Carlo ion implantation simulator, TRICSI, has been developed to investigate 3D mask effects in the typical mask structure for ion implantation into crystalline silicon. We present the mask corner and mask size effects of implanted boron range profiles, and also show the calculated damage distributions by applying the modified Kinchin-Pease equation in the single-crystal silicon target. The simulator calculates accurately and efficiently the implanted-boron range profiles under the relatively large implanted area, using a newly developed search algorithm for the collision partner in the single-crystal silicon. All of the typical implant parameters such as dose, tilt and rotation angles, in addition to energy can be used for the 3D simulation of ion implantation.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.155.2-155.2
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• 2013

Strain-relaxed SiGe layer on Si substrate has numerous potential applications for electronic and opto- electronic devices. SiGe layer must have a high degree of strain relaxation and a low dislocation density. Conventionally, strain-relaxed SiGe on Si has been manufactured using compositionally graded buffers, in which very thick SiGe buffers of several micrometers are grown on a Si substrate with Ge composition increasing from the Si substrate to the surface. In this study, a new plasma process, i.e., the combination of PIII&D and HiPIMS, was adopted to implant Ge ions into Si wafer for direct formation of SiGe layer on Si substrate. Due to the high peak power density applied the Ge sputtering target during HiPIMS operation, a large fraction of sputtered Ge atoms is ionized. If the negative high voltage pulse applied to the sample stage in PIII&D system is synchronized with the pulsed Ge plasma, the ion implantation of Ge ions can be successfully accomplished. The PIII&D system for Ge ion implantation on Si (100) substrate was equipped with 3'-magnetron sputtering guns with Ge and Si target, which were operated with a HiPIMS pulsed-DC power supply. The sample stage with Si substrate was pulse-biased using a separate hard-tube pulser. During the implantation operation, HiPIMS pulse and substrate's negative bias pulse were synchronized at the same frequency of 50 Hz. The pulse voltage applied to the Ge sputtering target was -1200 V and the pulse width was 80 usec. While operating the Ge sputtering gun in HiPIMS mode, a pulse bias of -50 kV was applied to the Si substrate. The pulse width was 50 usec with a 30 usec delay time with respect to the HiPIMS pulse. Ge ion implantation process was performed for 30 min. to achieve approximately 20 % of Ge concentration in Si substrate. Right after Ge ion implantation, ~50 nm thick Si capping layer was deposited to prevent oxidation during subsequent RTA process at $1000^{\circ}C$ in N2 environment. The Ge-implanted Si samples were analyzed using Auger electron spectroscopy, High-resolution X-ray diffractometer, Raman spectroscopy, and Transmission electron microscopy to investigate the depth distribution, the degree of strain relaxation, and the crystalline structure, respectively. The analysis results showed that a strain-relaxed SiGe layer of ~100 nm thickness could be effectively formed on Si substrate by direct Ge ion implantation using the newly-developed PIII&D process for non-gaseous elements.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.21 no.5
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• pp.755-760
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• 2012

In this study, three dimensional cutting force components and surface roughness appeared in high speed cutting by using tungsten carbide endmill tools implanted ion or not found mutual relations through several analysis of statistical dispersion. It is showed that cutting force(Fx) is affect with spindle speed and feed rate, cutting force(Fy) is affect with spindle speed and ion implantation time and cutting force(Fz) is affect with feed rate in interaction through the statistical method of ANOVA of cutting force and surface roughness, it is analyzed that it is affected of spindle speed and feed rate in surface roughness.

• Journal of the Korean institute of surface engineering
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• v.39 no.5
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• pp.235-239
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• 2006

The aluminum nitride(AlN) layer on Al7075 substrate has been formed through nitrogen ion implantation process. The implantation process was performed under the conditions : 100 keV energy, total ion dose up to $2{\times}10^{18}\;ions/cm^2$. XRD analysis showed that aluminum nitride layers were formed by nitrogen implantation. The formation of Aluminum nitride enhanced surface hardness up to 265HK(0.02 N) from 150HK(0.02 N) for the unimplanted specimen. Micro-Knoop hardness test showed that wear resistance was improved about 2 times for nitrogen implanted specimens above $5\;{\times}\;10^{17}\;ions/cm^2$. The friction coefficient was measured by Ball-on-disc type wear tester and was decreased to 1/3 with increasing total nitrogen ion dose up to $1\;{\times}\;10^{18}ions/cm^2$. The enhancement of mechanical properties was observed to be closely associated with AlN formation. AES analysis showed that the maximum concentration of nitrogen increased as ion dose increased until $5\;{\times}\;10^{17}\;ions/cm^2$.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.31 no.10
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• pp.73-78
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• 2003

MEMS technology in the field of aerospace engineering is more important with light weight and high resolution. Therefore the investigation of thin films properties is issued and the residual stress of thin filrns is one of the important problems to solve. Ion implantation without thermal annealing is applied for the stress gradient relaxation of LPCVD polysilicon films used as the structural part in MEMS. He+ and Ar+ ion implantations reduce the stress gradient of polysilicon films. The property modification of polysilicon films by ion implantation is also investigated. The elastic modulus and hardness of polysilicon films with ion implantation is studied by CSM method which is an advanced nano-indentation method. Ion implantation decreases the elastic modulus and hardness of polysilicon films. However, they are improved with increasing ion dose.

• Proceedings of the Korean Vacuum Society Conference
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• 1995.06a
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• pp.101-101
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• 1995

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.111-111
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• 2007

Further scaling the semiconductor devices down to low dozens of nanometer needs the extremely shallow depth in junction and the intentional counter-doping in the silicon gate. Conventional ion beam ion implantation has some disadvantages and limitations for the future applications. In order to solve them, therefore, plasma source ion implantation technique has been considered as a promising new method for the high throughputs at low energy and the fabrication of the ultra-shallow junctions. In this paper, we study about the effects of DC bias and base pressure as a process parameter. The diluted mixture gas (5% $PH_3/H_2$) was used as a precursor source and chamber is used for vacuum pressure conditions. After ion doping into the Si wafer(100), the samples were annealed via rapid thermal annealing, of which annealed temperature ranges above the $950^{\circ}C$. The junction depth, calculated at dose level of $1{\times}10^{18}/cm^3$, was measured by secondary ion mass spectroscopy(SIMS) and sheet resistance by contact and non-contact mode. Surface morphology of samples was analyzed by scanning electron microscopy. As a result, we could accomplish the process conditions better than in advance.