• Current Applied Physics
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• 제18권11호
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• pp.1381-1387
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• 2018

One dimensional (1D) grating has been fabricated (using focused ion beam) on 50 nm gold (Au) film deposited on higher refractive index Gallium phosphate (GaP) substrate. The sub-wavelength periodic metal nano structuring enable to couple photon to couple with the surface plasmons (SPs) excited by them. These grating devices provide the efficient control on the SPs which propagate on the interface of noble metal and dielectric whose frequency is dependent on the bulk electron plasma frequency of the metal. For a fixed periodicity (${\Lambda}=700 nm$) and slit width (w = 100 nm) in the grating device, the efficiency of SPP excitation is about 40% compared to the transmission in the near-field. Efficient coupling of SPs with photon in dielectric provide field localisation on sub-wavelength scale which is needed in Heat Assisted Magnetic recording (HAMR) systems. The GaP is also used to emulate Vertical Cavity Surface emitting laser (VCSEL) in order to provide cheaper alternative of light source being used in HAMR technology. In order to understand the underlying physics, far-and near-field results has been compared with the modelling results which are obtained using COMSOL RF module. Apart from this, grating devices of smaller periodicity (${\Lambda}=280nm$) and slit width (w = 22 nm) has been fabricated on GaP substrate which is photoluminescence material to observe amplified spontaneous emission of the SPs at wavelength of 805 nm when the grating device was excited with 532 nm laser light. This observation is unique and can have direct application in light emitting diodes (LEDs).

• 한국분말재료학회지
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• 제21권3호
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• pp.207-214
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• 2014

In this study, nano-scale copper powders were reduction treated in a hydrogen atmosphere at the relatively high temperature of $350^{\circ}C$ in order to eliminate surface oxide layers, which are the main obstacles for fabricating a nano/ultrafine grained bulk parts from the nano-scale powders. The changes in composition and microstructure before and after the hydrogen reduction treatment were evaluated by analyzing X-ray diffraction (XRD) line profile patterns using the convolutional multiple whole profile (CMWP) procedure. In order to confirm the result from the XRD line profile analysis, transmitted electron microscope observations were performed on the specimen of the hydrogen reduction treated powders fabricated using a focused ion beam process. A quasi-statically compacted specimen from the nano-scale powders was produced and Vickers micro-hardness was measured to verify the potential of the powders as the basis for a bulk nano/ultrafine grained material. Although the bonding between particles and the growth in size of the particles occurred, crystallites retained their nano-scale size evaluated using the XRD results. The hardness results demonstrate the usefulness of the powders for a nano/ultrafine grained material, once a good consolidation of powders is achieved.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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• pp.223-223
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• 2012

Surface engineering plays a significant role in fabricating highly functionalized materials applicable to industrial and biomedical fields. Surface wrinkles and folds formed by ion beam or plasma treatment are buckling-induced patterns and controlled formation of those patterns has recently gained considerable attention as a way of creating well-defined surface topographies for a wide range of applications. Surface wrinkles and folds can be observed when a stiff thin layer attached to a compliant substrate undergoes compression and plasma treatment is one of the techniques that can form stiff thin layers on compliant polymeric substrates, such as poly (dimethylsiloxane) (PDMS). Here, we report two effective methods using plasma modification techniques for controlling the formation of surface wrinkles and folds on flat or patterned PDMS substrates. First, we show a method of creating wrinkled diamond-like carbon (DLC) film on grooved PDMS substrates. Grooved PDMS substrates fabricated by a molding method using a grooved master prepared by photolithography and a dry etching process were treated with argon plasma and subsequently coated with DLC film, which resulted in the formation of wrinkled DLC film aligning perpendicular to the steps of the pre-patterned ridges. The wavelength and the amplitude of the wrinkled DLC film exhibited variation in the submicron- to micron-scale range according to the duration of argon plasma pre-treatment. Second, we present a method for controlled formation of folds on flat PDMS substrates treated with oxygen plasma under large compressive strains. Flat PDMS substrates were strained uniaxially and then treated with oxygen plasma, resulting in the formation of surface wrinkles at smaller strain levels, which evolved into surface folds at larger strain levels. Our results demonstrate that we can control the formation and evolution of surface folds simply by controlling the pre-strain applied to the substrates and/or the duration of oxygen plasma treatment.

• JSTS:Journal of Semiconductor Technology and Science
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• 제2권4호
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• pp.259-267
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• 2002

We present a novel 3D fabrication method with single X-ray process utilizing an X-ray mask in which a micro-actuator is integrated. An X-ray absorber is electroplated on the shuttle mass driven by the integrated micro-actuator during deep X-ray exposures. 3D microstructures are revealed by development kinetics and modulated in-depth dose distribution in resist, usually PMMA. Fabrication of X-ray masks with integrated electrothermal xy-stage and electrostatic actuator is presented along with discussions on PMMA development characteristics. Both devices use $20-\mu\textrm{m}$-thick overhanging single crystal Si as a structural material and fabricated using deep reactive ion etching of silicon-on-insulator wafer, phosphorous diffusion, gold electroplating, and bulk micromachining process. In electrostatic devices, $10-\mu\textrm{m}-thick$ gold absorber on $1mm{\times}1mm$ Si shuttle mass is supported by $10-\mu\textrm{m}-wide$, 1-mm-long suspension beams and oscillated by comb electrodes during X-ray exposures. In electrothermal devices, gold absorber on 1.42 mm diameter shuttle mass is oscillated in x and y directions sequentially by thermal expansion caused by joule heating of the corresponding bent beam actuators. The fundamental frequency and amplitude of the electrostatic devices are around 3.6 kHz and $20\mu\textrm{m}$, respectively, for a dc bias of 100 V and an ac bias of 20 VP-P (peak-peak). Displacements in x and y directions of the electrothermal devices are both around $20{\;}\mu\textrm{m}$at 742 mW input power. S-shaped and conical shaped PMMA microstructures are demonstrated through X-ray experiments with the fabricated devices.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.436-437
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• 2012

Double patterning technology (DPT) has been suggested as a promising candidates of the next generation lithography technology in FLASH and DRAM manufacturing in sub-40nm technology node. DPT enables to overcome the physical limitation of optical lithography, and it is expected to be continued as long as e-beam lithography takes place in manufacturing. Several different processes for DPT are currently available in practice, and they are litho-litho-etch (LLE), litho-etch-litho-etch (LELE), litho-freeze-litho-etch (LFLE), and self-aligned double patterning (SADP) [1]. The self-aligned approach is regarded as more suitable for mass production, but it requires precise control of sidewall space etch profile for the exact definition of hard mask layer. In this paper, we propose etch end point detection (EPD) in spacer etching to precisely control sidewall profile in SADP. Conventional etch EPD notify the end point after or on-set of a layer being etched is removed, but the EPD in spacer etch should land-off exactly after surface removal while the spacer is still remained. Precise control of real-time in-situ EPD may help to control the size of spacer to realize desired pattern geometry. To demonstrate the capability of spacer-etch EPD, we fabricated metal line structure on silicon dioxide layer and spacer deposition layer with silicon nitride. While blanket etch of the spacer layer takes place in inductively coupled plasma-reactive ion etching (ICP-RIE), in-situ monitoring of plasma chemistry is performed using optical emission spectroscopy (OES), and the acquired data is stored in a local computer. Through offline analysis of the acquired OES data with respect to etch gas and by-product chemistry, a representative EPD time traces signal is derived. We found that the SE-EPD is useful for precise control of spacer etching in DPT, and we are continuously developing real-time SE-EPD methodology employing cumulative sum (CUSUM) control chart [2].

• 한국전기전자재료학회논문지
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• 제31권4호
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• pp.231-237
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• 2018

In this study, two important requirements for the home production of a robot to detect and remove improvised explosive devices (IEDs) are presented in terms of the total cost for robot system development and the performance improvement of the mine detection technology. Firstly, cost analyses were performed in order to provide a reasonable solution following an engineering estimate method. As a result, the total cost for a mass production system without the mine detection system was estimated to be approximately 396 million won. For the case including the mine detection system, the total cost was estimated to be approximately 411 million won, in which labor costs and overhead charges were slightly increased and the material costs for the mine detection system were negligible. Secondly, a method for fabricating the carbon nanotube (CNT) based gas detection sensor was studied. The detection electrodes were formed by a photolithography process using a photosensitive CNT paste. As a result, this method was shown to be a scalable and expandable technology for producing excellent mine detection sensors. In particular, it was found that surface treatments by using adhesive taping or ion beam bombardment methods are effective for exposing the CNTs to the ambient air environment. Fowler-Nordheim (F-N) plots were obtained from the electron-emission characteristics of the surface treated CNT paste. The F-N plot suggests that sufficient electrons are available for transport between CNT surfaces and chemical molecules, which will make an effective chemiresistive sensor for the advanced IED detection system.

• 대한방사선기술학회지:방사선기술과학
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• 제31권4호
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• pp.407-413
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• 2008

2D-ARRAY chamber를 이용하여 고정형쐐기(Physical wedge filter)와 동적쐐기(Dynamic wedge)의 조사야 주변의 선량을 비교 평가하고자 하였다. 고체팬텀 위에 2D-ARRAY seven 29 (PTW, Germany) chamber를 이용하여 조사야 $10cm{\times}10cm$, SSD 90cm로 고정시키고, 에너지는 6MV와 15MV로 변화시켜 산란선의 영향을 많이 받는 피부 깊이인 5mm 깊이의 조사야 밖 인접 선량을 측정하였다. 고정형 쐐기 $15^{\circ}$, $45^{\circ}$와 선형가속기에 장착된 동적쐐기의 $15^{\circ}$, $45^{\circ}$를 측정하여 조사야 끝에서 쐐기의 heel부분과 toe 부분의 1cm되는 지점에서 5cm 지점까지의 1cm 간격으로 주변선량을 비교, 분석하였다. 6MV 에너지는 동적쐐기가 고정형쐐기 보다 조사야 주변 선량이 $0.1{\sim}1.4%$ 정도 모두 낮았다. 15MV 에너지는 조사야에서 근접한 거리에서 동적쐐기의 선량이 $0.4{\sim}0.9%$ 정도 높지만 멀어지면서 급격하게 감소하여 동적쐐기가 최대 1.6% 낮게 측정 되었다. 동적쐐기는 heel부분과 toe부분의 선량차이가 없는 반면 고정형쐐기는 에너지가 높고 쐐기 각도가 클수록 heel부분 보다 toe부분의 선량이 2% 정도 높게 측정되었다. 따라서 동적쐐기를 사용할 경우 치료주위선량을 균일하게 감소시킬 수 있으므로 치료부위와 근접한 표면에 가까운 주요장기의 선량을 최소화 할 수 있었다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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• pp.231-231
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• 2012

Correct determination of the interface locations is critical for the calibration of the depth scale and measurement of layer thickness in SIMS depth profiling analysis of multilayer films. However, the interface locations are difficult to determine due to the unwanted distortion from the real ones by the several effects due to sputtering with energetic ions. In this study, the layer thicknesses of Si/Ge and Si/Ti multilayer films were measured by SIMS depth profiling analysis using the oxygen and cesium primary ion beam. The interface locations in the multilayer films could be determined by two methods. The interfaces can be determined by the 50 at% definition where the atomic fractions of the constituent layer elements drop or rise to 50 at% at the interfaces. In this method, the raw depth profiles were converted to compositional depth profiles through the two-step conversion process using the alloy reference relative sensitivity factors (AR-RSF) determined by the alloy reference films with well-known compositions determined by Rutherford backscattering spectroscopy (RBS). The interface locations of the Si/Ge and Si/Ti multilayer films were also determined from the intensities of the interfacial composited ions (SiGe+, SiTi+). The determination of the interface locations from the composited ions was found to be difficult to apply due to the small intensity and the unclear variation at the interfaces.

• 대한전자공학회논문지SD
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• 제39권5호
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• pp.1-7
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• 2002

Deep sub-micron bulk CMOS circuits require gate electrode materials such as metal silicide and titanium silicide for gate oxides. Many authors have conducted research to improve the quality of the sub-micron gate oxide. However, few have reported on the electrical quality and reliability of an ultra-thin gate. In this paper, we will recommend a novel shallow trench isolation structure and a two-step TiS $i_2$ formation process to improve the corner metal oxide semiconductor field-effect transistor (MOSFET) for sub-0.1${\mu}{\textrm}{m}$ VLSI devices. Differently from using normal LOCOS technology, deep sub-micron CMOS devices using the novel shallow trench isolation (STI) technology have unique "inverse narrow-channel effects" when the channel width of the device is scaled down. The titanium silicide process has problems because fluorine contamination caused by the gate sidewall etching inhibits the silicide reaction and accelerates agglomeration. To resolve these Problems, we developed a novel two-step deposited silicide process. The key point of this process is the deposition and subsequent removal of titanium before the titanium silicide process. It was found by using focused ion beam transmission electron microscopy that the STI structure improved the narrow channel effect and reduced the junction leakage current and threshold voltage at the edge of the channel. In terms of transistor characteristics, we also obtained a low gate voltage variation and a low trap density, saturation current, some more to be large transconductance at the channel for sub-0.1${\mu}{\textrm}{m}$ VLSI devices.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2012년도 춘계학술발표대회
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• pp.55.2-55.2
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• 2012

Intensive theoretical and experimental studies have been carried out at Korean Institute of Science and Technology (KIST) on controlling the bio absorbing rate of the Mg alloys with high mechanical strength through tailoring of electrochemical potential. Key technology for retarding the corrosion of the Mg alloys is to equalize the corrosion potentials of the constituent phases in the alloys, which prevented the formation of Galvanic circuit between the constituent phases resulting in remarkable reduction of corrosion rate. By thermodynamic consideration, the possible phases of a given alloy system were identified and their work functions, which are related to their corrosion potentials, were calculated by the first principle calculation. The designed alloys, of which the constituent phases have similar work function, were fabricated by clean melting and extrusion system. The newly developed Mg alloys named as KISTUI-MG showed much lower corrosion rate as well as higher strength than previously developed Mg alloys. Biocompatibility and feasibility of the Mg alloys as orthopedic implant materials were evaluated by in vitro cell viability test, in vitro degradation test of mechanical strength during bio-corrosion, in vivo implantation and continuous observation of the implant during in vivo absorbing procedures. Moreover, the cells attached on the Mg alloys was observed using cryo-FIB (focused ion beam) system without the distortion of cell morphology and its organ through the removal of drying steps essential for the preparation of normal SEM/TEM samples. Our Mg alloys showed excellent biocompatibility satisfying the regulations required for biomedical application without evident hydrogen evolution when it implanted into the muscle, inter spine disk, as well as condyle bone of rat and well contact interface with bone tissue when it was implanted into rat condyle.