• Title/Summary/Keyword: Ion beam technology

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TEM sample preparation of microsized LiMn2O4 powder using an ion slicer

  • Jung Sik Park;Yoon‑Jung Kang;Sun Eui Choi;Yong Nam Jo
    • Applied Microscopy
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    • v.51
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    • pp.19.1-19.7
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    • 2021
  • The main purpose of this paper is the preparation of transmission electron microscopy (TEM) samples from the microsized powders of lithium-ion secondary batteries. To avoid artefacts during TEM sample preparation, the use of ion slicer milling for thinning and maintaining the intrinsic structure is described. Argon-ion milling techniques have been widely examined to make optimal specimens, thereby making TEM analysis more reliable. In the past few years, the correction of spherical aberration (Cs) in scanning transmission electron microscopy (STEM) has been developing rapidly, which results in direct observation at an atomic level resolution not only at a high acceleration voltage but also at a deaccelerated voltage. In particular, low-kV application has markedly increased, which requires a sufficiently transparent specimen without structural distortion during the sample preparation process. In this study, sample preparation for high-resolution STEM observation is accomplished, and investigations on the crystal integrity are carried out by Cs-corrected STEM.

Improvement of Out-coupling Efficiency of Organic Light Emitting Device by Ion-beam Plasma-treated Plastic Substrate (이온빔 플라즈마 처리된 플라스틱 기판에 의한 OLED의 광추출 효율 향상)

  • Kim, Hyeun Woo;Song, Tae Min;Lee, Hyeong Jun;Jeon, Yongmin;Kwon, Jeong Hyun
    • Journal of the Semiconductor & Display Technology
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    • v.21 no.2
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    • pp.7-10
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    • 2022
  • A functional polyethylene terephthalate substrate to increase light extraction efficiency of organic light-emitting diodes is studied. We formed nano-structured PET surfaces by controlling the power, gas, and exposure time of the linear ion-beam. The haze of the polyethylene terephthalate can be controlled from 0.2% to 76.0% by changing the peak-to-valley roughness of nano structure by adjusting the exposure cycle. The treated polyethylene terephthalate shows average haze of 76.0%, average total transmittance of 86.6%. The functional PET increases the current efficiency of organic light-emitting diodes by 47% compared to that of organic light-emitting diode on bare polyethylene terephthalate. In addition to polyethylene terephthalate with light extraction performance, by conducting additional research on the development of functional PET with anti-reflection and barrier performance, it will be possible to develop flexible substrates suitable for organic light-emitting diodes lighting and transparent flexible displays.

Development of Nano Stage for Ultra High Vacuum (진공용 나노스테이지 개발)

  • 홍원표;강은구;이석우;최헌종
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2004.04a
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    • pp.472-477
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    • 2004
  • Miniaturization is the central theme in modern fabrication technology. Many of the components used in modem products are becoming smaller and smaller. The direct write FIB technology has several advantages over contemporary micromachining technology, including better feature resolution with low lateral scattering and capability of mastless fabrication. Therefore, the application of focused ion beam(FIB) technology in micro fabrication has become increasingly popular. In recent model of FIB, however the feeding system has been a very coarse resolution of about a few ${\mu}{\textrm}{m}$. It is not unsuitable to the sputtering and the deposition to make the high-precision structure in micro or macro scale. Our research is the development of nano stage of 200mm strokes and l0nm resolutions. Also, this stage should be effectively operating in ultra high vacuum of about 1$\times$10$^{-5}$ pa. This paper presents the concept of nano stages and the discussion of the material treatment for ultra tush vacuum.

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Graft copolymerization of GMA and EDMA on PVDF to hydrophilic surface modification by electron beam irradiation

  • Lim, Seung Joo;Shin, In Hwan
    • Nuclear Engineering and Technology
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    • v.52 no.2
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    • pp.373-380
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    • 2020
  • This study was carried out to convert the hydrophobic characteristics of PVDF to hydrophilic. Poly(-vinylidene fluorine) (PVDF) was grafted by electron beam irradiation and sulfonated. The grafting degree of modified PVDF increased with the monomer concentration, but not the conversion degree. From the results of FTIR and XPS, it was shown that the amount of converted sulfur increased with the grafting degree. The radiation-induced graft polymerization led to decrease fluorine from 35.7% to 21.3%. Meanwhile, the oxygen and sulfur content increased up to 8.1% and 3.2%. The pore size of modified membranes was shrunken and the roughness sharply decreased after irradiation. The ion exchange capacity and contact angle were investigated to show the characteristics of PVDF. The enhanced ion exchange capacity and lower contact angle of modified PVDF showed that the hydrophilicity played a role in determining membrane fouling. Electron beam irradiation successfully modified the hydrophobic characteristics of PVDF to hydrophilic.

200 MeV Ag15+ ion beam irradiation induced modifications in spray deposited MoO3 thin films by fluence variation

  • Rathika, R.;Kovendhan, M.;Joseph, D. Paul;Vijayarangamuthu, K.;Kumar, A. Sendil;Venkateswaran, C.;Asokan, K.;Jeyakumar, S. Johnson
    • Nuclear Engineering and Technology
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    • v.51 no.8
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    • pp.1983-1990
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    • 2019
  • Spray deposited Molybdenum trioxide (MoO3) thin film of thickness nearly 379 nm were irradiated with 200 MeV Ag15+ ion beam at different fluences (Ø) of 5 ×1011, 1 × 1012, 5 × 1012 and 1 × 1013 ions/㎠. The X-ray diffraction (XRD) pattern of the pristine film confirms orthorhombic structure and the crystallinity decreased after irradiation with the fluence of 5 × 1011 ions/㎠ due to irradiation induced defects and became amorphous at higher fluence. In pristine film, Raman modes at 665, 820, 996 cm-1 belong to Mo-O stretching, 286 cm-1 belong to Mo-O bending mode and those below 200 cm-1 are associated with lattice modes. Raman peak intensities decreased upon irradiation and vanished completely for the ion fluence of 5 ×1012 ions/㎠. The percentage of optical transmittance of pristine film was nearly 40%, while for irradiated films it decreased significantly. Red shift was observed for both the direct and indirect band gaps. The pristine film surface had densely packed rod like structures with relatively less porosity. Surface roughness decreased significantly after irradiation. The electrical transport properties were also studied for both the pristine and irradiated films by Hall effect. The results are discussed.

Adhesion Properties between Polyimide Film and Copper by Ion Beam Treatment and Imidazole-Silane Compound (이온빔 및 이미다졸-실란 화합물에 의한 폴리이미드 필름과 구리의 접착 특성)

  • Kang, Hyung Dae;Kim, Hwa Jin;Lee, Jae Heung;Suh, Dong Hack;Hong, Young Taik
    • Journal of Adhesion and Interface
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    • v.8 no.1
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    • pp.15-27
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    • 2007
  • Polyimide (PI) surface modification was carried out by ion-beam treatment and silane-imidazole coupling agent to improve the adhesion between polyimide film and copper. Silane-imidazole coupling agent contains imidazole functional groups for the formation of a complex with copper metal through a coordination bonding and methoxy silane groups for the formation of siloxane polymers. The PI film surface was first treated by argon (Ar)/oxygen ($O_2$) ion-beam, followed by dipping it into a modified silane-imidazole coupling agent solution. The results of X-ray photoelectron spectroscopy (XPS) spectra revealed that the $Ar/O_2$ plasma treatment formed oxygen functional groups such as hydroxyl and carbonyl groups on the polyimide film surface and confirmed that the PI surface was modified by a coupling reaction with imidazole-silane coupling agent. Adhesion between copper and the treated PI film by ion-beam and coupling agent was superior to that with untreated PI film. In addition, adhesion of PI film treated by an $Ar/O_2$ plasma to copper was better than that of PI film treated by a coupling agent. The peeled-off layers from the copper-PI film joint were completely different in chemical composition each other. The layer of PI film side showed similar C1s, N1s, O1s spectra to the original Upilex-S and no Si and Cu atoms appeared. On the other hand the layer of copper side showed different C1s and N1s spectra from the original PI film and many Si and Cu atoms appeared. This indicates that the failure occurs at an interface between the imidazole-silane and PI film layers rather than within the PI layers.

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The characteristics of AlN buffered GaN on ion beam modified Si(111) substrates (Si(111) 위에 Ion beam 처리 후 AlN layer를 완충층으로 이용하여 성장시킨 GaN의 특성)

  • Kwang, Min-Gu;Chin, Jeong-Geun;Lee, Jae-Seok;Oh, Seung-Seok;Hyun, Jin;Byun, Dong-Jin
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2003.03a
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    • pp.99-99
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    • 2003
  • The growth of GaN on Si is of great interest due to the several advantages : low cost, large size and high-quality wafer availability as well as its matured technology. The crystal quality of GaN is known to be much influenced by the surface pretreatment of Si substrate[1]. In this work, the properties of GaN overlayer grown on ion beam modified Si(111) have been investigated. Si(111) surface was treated RIB with 1KeV-N$_2$$\^$+/(at 1.9 ${\times}$ 10$\^$-5/) to dose ranging from 5${\times}$10$\^$15/ to 1${\times}$10$\^$17/ prior to film growth. GaN epilayers were grown at 1100$^{\circ}C$ for 1 hour after growing AlN buffer layers for 5∼30 minutes at 1100$^{\circ}C$ in Metal Organic Chemical Vapor Deposition (MOCVD). The properties of GaN epilayers were evaluated by X-Ray Diffraction(XRD), Raman spectroscopy, Photoluminescence(PL) and Hall measurement. The results showed that the ion modified treatment markedly affected to the structural, optical and electrical characteristic of GaN layers.

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FIB Machining Characteristic Analysis according to $Ga^+$ Ion Beam Current (집속이온빔의 전류변화에 따른 미세가공 특성분석)

  • Kang, Eun-Goo;Choi, Byeong-Yeol;Hong, Won-Pyo;Lee, Seok-Woo;Choi, Hon-Zong
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.15 no.6
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    • pp.58-63
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    • 2006
  • FIB equipment can perform sputtering and chemical vapor deposition simultaneously. It is very advantageously used to fabricate a micro structure part having 3D shape because the minimum beam size of ${\Phi}10nm$ and smaller is available. Since general FIB uses very short wavelength and extremely high energy, it can directly make a micro structure less than $1{\mu}m$. As a result, FIB has been probability in manufacturing high performance micro devices and high precision micro structures. Until now, FIB has been commonly used as a very powerful tool in the semiconductor industry. It is mainly used for mask repair, device correction, failure analysis, IC error correction, etc. In this paper FIB-Sputtering and FIB-CVD characteristic analysis were carried out according to $Ga^+$ ion beam current that is very important parameter for minimizing the pattern size and maximizing the yield. Also, for FIB-Sputtering burr caused by redeposition of the substrate characteristic analysis was carried out.

Fabrication of Micro/nanoscale Cutting Tool Geometry of Single Crystal Diamond Tool by Focused Ion Beam (집속이온빔(Focused Ion Beam)에 의한 단결정 다이아몬드 공구의 마이크로/나노스케일 절삭공구 형상 제작)

  • Baek, Seung Yub;Jang, Sung Min
    • Journal of the Korean Society for Precision Engineering
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    • v.31 no.3
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    • pp.207-213
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    • 2014
  • A study was carried out to fabricate the cutting tool geometry with micro/nanoscale on the single crystal diamond tool by using the FIB. The FIB technique is an ideal tool for TEM sample preparation that allows for the fabrication of electron-transparent foils. The FIB is appropriate techniques to sample and subsequently define the chemical composition and the structural state of mineral inclusion on the micro/nanoscale. The combination of FIB with a SEM allows for 3D information to be obtained from samples including 3D imaging. Cutting strategies were demonstrated to improve the performance of cutting tool geometry and to generate high aspect ratio micro cutting tool. A finely focused beam of 30keV Ga+ ions was used to mill cutting tool shapes for various micro patterns. Therefore FIB sputtering is used to shape a variety of cutting tools with dimensions in the $1-5{\mu}m$ range and cutting edge radii of curvature of under 50nm.