• Korean Journal of Materials Research
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• v.17 no.8
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• pp.402-407
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• 2007

In electronics manufacturing processes, soldering process has generally been used in surface mounting technology. Because of environmental restriction, lead free solders as like a SnAgCu ternary system are being used widely. After soldering process, the formation and growth of intermetalic compounds(IMCs) are formed in the interface between solder and Cu substrate as follows isothermal temperature and time. In this studies, therefore, we investigated the effects of the Cu substrate thickness on the IMC formation and growth of Sn-40Pb/Cu and Sn-3.0Ag-0.5Cu/Cu solder joints, respectively. The effect of the Cu thickness in PCB Cu pad and pure Cu plate was analyzed as measuring of thickness of each IMC. After solder was soldered on PCB and Cu plate which have different Cu thickness, we measured the IMC thickness in solder joints respectively. Also we compared with the effectiveness of Cu thickness on the IMC growth. From these results, we calculated the activation energy.

• Advances in materials Research
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• v.1 no.1
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• pp.83-92
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• 2012

The effect of under-bump-metallization (UBM) on electromigration was investigated at temperatures ranging from $135^{\circ}C$ to $165^{\circ}C$. The UBM structures were examined: 5-${\mu}m$-Cu/3-${\mu}m$-Ni and $5{\mu}m$ Cu. Experimental results show that the solder joint with the Cu/Ni UBM has a longer electromigration lifetime than the solder joint with the Cu UBM. Three important parameters were analyzed to explain the difference in failure time, including maximum current density, hot-spot temperature, and electromigration activation energy. The simulation and experimental results illustrate that the addition 3-${\mu}m$-Ni layer is able to reduce the maximum current density and hot-spot temperature in solder, resulting in a longer electromigration lifetime. In addition, the Ni layer changes the electromigration failure mode. With the $5{\mu}m$ Cu UBM, dissolution of Cu layer and formation of $Cu_6Sn_5$ intermetallic compounds are responsible for the electromigration failure in the joint. Yet, the failure mode changes to void formation in the interface of $Ni_3Sn_4$ and the solder for the joint with the Cu/Ni UBM. The measured activation energy is 0.85 eV and 1.06 eV for the joint with the Cu/Ni and the Cu UBM, respectively.

• Journal of Powder Materials
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• v.8 no.1
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• pp.55-60
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• 2001

Mechanical alloying technique was applied to prepare hard magnetic $Sm_2Fe_{17}N_x$ compound powders. Staring from pure Fe and Sm powders, the formation process of hard magnetic $Sm_2Fe_{17}N_x$ phase by mechanical alloying and subsequent solid state reaction was studied. As milled powders were found to consist of Sm-Fe amorphous and $\alpha$-Fe phases in all compositions of $Sm_xFe_{100-x}$(x = 11, 13, 15, 17). The effects of starting composition on the formation of $Sm_2Fe_{17}$ intermetallic compound was investigated by heat treatment of mechanically-alloyed powders. When Sm content was 15 at.％, heat-treated powders consisted of nearly $Sm_2Fe_{17}$ single phase. For preparation of hard magnetic $Sm_2Fe_{17}N_x$ powders, additional nitriding treatment was performed under $N_2$ gas flow at 45$0^{\circ}C$. The increase in the coercivity and remanence was proportional to the nitrogen content which increased drastically at first and then increased gradually as the nitriding time was extended to 3 hours.

• Journal of Powder Materials
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• v.28 no.2
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• pp.91-96
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• 2021

Rare earth magnets with excellent magnetic properties are indispensable in the electric device, wind turbine, and e-mobility industries. The demand for the development of eco-friendly recycling techniques has increased to realize sustainable green technology, and the supply of rare earth resources, which are critical for the production of permanent magnets, are limited. Liquid metal extraction (LME), which is a type of pyrometallurgical recycling, is known to selectively extract the metal forms of rare earth elements. Although several studies have been carried out on the formation of intermetallic compounds and oxides, the effect of oxide formation on the extraction efficiency in the LME process remains unknown. In this study, microstructural and phase analyses are conducted to confirm the oxidation behavior of magnets pulverized by a jaw crusher. The LME process is performed with pulverized scrap, and extraction percentages are calculated to confirm the effect of the oxide phases on the extraction of Dy during the reaction. During the L ME process, Nd is completely extracted after 6 h, while Dy remains as Dy₂Fe₁₇ and Dy-oxide. Because the decomposition rate of Dy₂Fe₁₇ is faster than the reduction rate of Dy-oxide, the importance of controlling Dy-oxide on Dy extraction is confirmed.

• Journal of the Korean Society for Heat Treatment
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• v.34 no.6
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• pp.309-314
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• 2021

Due to the superior corrosion resistance and mechanical properties of TiAl alloy at high temperature, it has been utilized as a turbine wheel of a turbocharger. The dissimilar metallic bonding is usually applied to combine the TiAl turbine wheel with the SCM440 structural steel which is used as a driving shaft. In this study, the TiAl and SCM440 joint were fabricated by using a friction welding technique. During bonding process, to suppress the martensitic transformation and the formation of cracks, which might reduce a strength of the joints, Cu was used as an insert metal to relieve stress. As a result, the intermetallic compounds (IMCs) layer was observed at TiAl/Cu interface while no IMC formation was formed at SCM440/Cu interface. Since understanding of the IMCs effects on the mechanical performance of welded joint is also essential for ensuring the reliability and integrity of the turbocharger system, we estimated the nanohardness of welded joint region through nanoindentation. The relation between the microstructural feature and its mechanical property is discussed in detail.

• Journal of the Korean Society for Heat Treatment
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• v.37 no.2
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• pp.58-65
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• 2024

In the present study, the effect of annealing condition on the microstructures and mechanical properties of the cold-rolled CoCrFeMnNi high entropy alloys were studied. Annealing treatment was performed under six different temperatures. Microstructural analyses confirmed that annealing below 800℃ resulted in the formation of intermetallic sigma (σ) phase within face-centered cubic (FCC) matrix, and this σ phase has beneficial effects on the formation of fine-grained structures through retardation of grain growth and recrystallization due to Zener pinning effect. This led to the enhanced yield strength and tensile strength of ~646 and ~855 MPa, respectively. The microstructures annealed above 800℃ demonstrated single FCC phase, and fully-recrystallized single FCC microstructure resulted in a slight increase in ductility with a considerable decrease in strength. The evolution of mechanical properties, such as strength, ductility, and strain hardening exponent, will be discussed.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.2
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• pp.1-8
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• 2018

In the soldering industry, a variety of lead-free solders have been developed as a part of restricting lead in electronic packaging. Sn-Ag-Cu (SAC) lead-free solder is regarded as one of the most superior candidates, owing to its low melting point and high solderability as well as the mechanical property. On the other hand, the mechanical property of SAC solder is directly influenced by intermetallic compounds (IMCs) in the solder joint. Although IMCs in SAC solder play an important role in bonding solder joints and impart strength to the surrounding solder matrix, a large amount of IMCs may cause poor strength, due to their brittle nature. In other words, the mechanical properties of SAC solder are of some concern because of the formation of large and brittle IMCs. As the IMCs grow, they may cause poor device performance, resulting in the failure of the electronic device. Therefore, new solder technologies which can control the IMC growth are necessary to address these issues satisfactorily. There are an advanced nanotechnology for microstructural refinement that lead to improve mechanical properties of solder alloys with nanoparticle additions, which are defined as nano-reinforced solders. These nano-reinforced solders increase the mechanical strength of the solder due to the dispersion hardening as well as solderability of the solder. This paper introduces the nano-reinforced solders, including its principles, types, and various properties.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.3 s.32
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• pp.47-53
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• 2004

Eutectic Au-20Sn(compositions are all in weight percent unless specified otherwise) solder alloys were soldered on the Ni substrate with various time and temperature. The composition, phase identification and morphology of intermetallic compounds(IMC) at the interface were examined using Scanning Electron Microscopy(SEM). There were two types of IMCs, $(Au,Ni)_3Sn_2$ and $(Au,Ni)_3Sn$ at the interface. The transition in morphology of $(Au,Ni)_3Sn_2$ has been observed at $300{\~}400^{\circ}C$. The morphology transition of $(Au,Ni)_3Sn_2$ is due to the decrease of enthalpy of formation of $(Au,Ni)_3Sn_2$ phase and has been explained well by Jackson's parameter with temperature. Because the number of diffusion channel is different at each soldering temperature, IMC thickness is nearly same at all temperature.

• Korean Journal of Materials Research
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• v.28 no.4
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• pp.195-200
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• 2018

This study investigated the effects of the post annealing temperatures on the electrical and interfacial properties of a metal-semiconductor-metal photodetector(MSM-PD) device. The interdigitate type MSM-PD devices had the structure Al(500 nm) / Ti(200 nm) / poly-Si(500 nm). Structural analyses of the MSM-PD devices were performed by employing X-ray diffraction(XRD), scanning electron microscopy(SEM) and transmission electron microscope(TEM). Electrical characteristics of the MSM-PD were also examined using current-voltage(I-V) measurements. The optimal post annealing condition for the Schottky contact of MSM-PD devices are $350^{\circ}C$-30minutes. However, as the annealing temperature and time are increased, electrical characteristics of MSM-PD device are degraded. Especially, for the annealing conditions of $400^{\circ}C$-180minutes and $500^{\circ}C$-30minutes, the I-V measurement itself was impossible. These results are closely related to the solid phase reactions at the interface of MSM-PD device, which result in the formation of intermetallic compounds such as $Al_3Ti$ and $Ti_7Al_5Si_{12}$.

• Journal of Welding and Joining
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• v.33 no.3
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• pp.19-24
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• 2015

Joint properties of electric control unit (ECU) module using Sn-Cu-(X)Al(Si) lead-free solder alloy were investigated for automotive electronics module. In this study, Sn-0.5Cu-0.01Al(Si) and Sn-0.5Cu-0.03Al(Si) (wt.%) lead-free alloys were fabricated as bar type by doped various weight percentages (0.01 and 0.03 wt.%) of Al(Si) alloy to Sn-0.5Cu. After fabrications of lead-free alloys, the ball-type solder alloys with a diameter of 450 um were made by rolling and punching. The melting temperatures of 0.01Al(Si) and 0.03Al(Si) were 230.2 and $230.8^{\circ}C$, respectively. To evaluation of properties of solder joint, test printed circuit board (PCB) finished with organic solderability perseveration (OSP) on Cu pad. The ball-type solders were attached to test PCB with flux and reflowed for formation of solder joint. The maximum temperature of reflow was $260^{\circ}C$ for 50s above melting temperature. And then, we measured spreadability and shear strength of two Al(Si) solder materials compared to Sn-0.7Cu solder material used in industry. And also, microstructures in solder and intermetallic compounds (IMCs) were observed. Moreover, thickness and grain size of $Cu_6Sn_5$ IMC were measured and then compared with Sn-0.7Cu. With increasing the amounts of Al(Si), the $Cu_6Sn_5$ thickness was decreased. These results show the addition of Al(Si) could suppress IMC growth and improve the reliability of solder joint.