• 마이크로전자및패키징학회지
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• 제20권2호
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• pp.17-22
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• 2013

본 연구에서는 Sn-58Bi 솔더를 이용한 경성 인쇄 회로 기판 (Rigid printed circuit board, RPCB)과 연성 인쇄회로 기판 (Flexible printed circuit board, FPCB) 간의 열압착 접합 시, 접합 조건에 따른 기계적 특성에 대하여 연구하였다. 접합 온도와 접합 시간을 변수로 열압착 접합을 실시하여 $90^{\circ}$ 필 테스트(Peel test)를 통해 접합 강도를 측정하고, 단면과 파단면을 관찰하였다. 접합 온도가 증가할수록 접합 강도가 증가하였으며, 접합 시간에 따른 접합 강도의 변화 또한 관찰할 수 있었다. 접합 시간이 증가하면서 접합부의 파괴에 영향을 미치는 요인이 솔더 층에서 금속간 화합물(Intermetallic compound, IMC) 층으로 변화하는 것을 관찰할 수 있었다. 필 테스트 과정의 F-x(Force-distance) curve를 통해 파괴 에너지를 계산하여 금속간 화합물이 접합 강도에 미치는 영향을 평가하였으며, 본 연구에서 $195^{\circ}C$, 7초 조건이 접합 강도와 파괴 에너지가 가장 높게 나타나는 최적 접합 조건으로 도출되었다.

• 마이크로전자및패키징학회지
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• 제10권3호
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• pp.37-42
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• 2003

전자 패키징에 사용되는 솔더합금에 납을 함유됨으로써 인하여 야기되는 환경적 문제와 인체 유해성 때문에 Pb-Sn 합금계를 대체할 수 있는 새로운 무연 솔더 재료의 필요성이 대두되고 있다. 새로운 솔더합금의 개발에 있어서 솔더 조인트의 신뢰성이 가장 중요한 문제라고 할 수 있는데, 솔더 조인트의 신뢰성은 솔더와 기판 사이의 계면 반응 형태와 그 정도에 의해서 크게 영향을 받기 때문에 솔더와 기판 사이의 계면 현상에 관한 더 깊은 이해가 필요하게 된다 솔더링 동안 기판/솔더 계면에서 가장 먼저 생성되는 금속간 화합물의 상을 예측하기 위한 열역학적인 방법이 제안되었다. 계면 에너지와 석출 구동력의 함수로 표현되는 각각의 금속간 화합물에 대한 핵생성 활성화 에너지를 비교함으로써 활성화 에너지가 가장 낮은 금속간 화합물이 가장 먼저 생성된다고 예측하였다. 거기에 더해 에너지를 기반으로 한 계산을 통하여 솔더 조인트에서 금속간 화합물의 입자 형상을 설명하였다. 울퉁불퉁한 계면을 가진 금속간 화합물의 Jackson의 parameter 값은 2보다 작은 반면 평평한 입자의 경우 2보다 크게 된다.

• 열처리공학회지
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• 제23권2호
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• pp.96-103
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• 2010

$Ni_3Al$ is known as a good high temperature structural material because of high yield strength at ambient temperature. However, it is too brittle to use as a structural material because of their weak grain boundary. In this work, orientation measurement and related mechanical properties of directionally solidified NiAl/$Ni_3Al$ two-phase alloys with various compositions (Ni-23~27 at.%Al) were investigated for developing multi-phase DS-processed alloys with the growth rates of 10, 50 and 100 ${\mu}m/s$ in a modified Bridgeman type furnace. It was found that the multi-phase microstructures such as the $\gamma$ dendrite +${\gamma}'$ matrix duplex microstructure was formed in the hypoeutectic composition of 23 at.%Al, $\beta$ dendrite +${\gamma}'$ matrix duplex microstructure in the hypereutectic composition of 26 and 27 at.%Al. And ${\gamma}'$ single phase was formed in the composition of 24.5 and 25 at.%Al. The hypoeutectic alloy including $\gamma$ dendrites with ${\gamma}'$ matrix showed a large elongation of over 70% at room temperature. However, the room-temperature tensile elongation decreased with increasing Al contents because the volume fraction of brittle $\beta$ dendrites in the ductile ${\gamma}'$ matrix increased.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2002년도 제5회 압출 및 인발가공 심포지엄
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• pp.43-49
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• 2002

A7003 alloy has characteristics of their excellent weldability, high corrosion resistance and superior plastic working however the broadening of application for the alloy has been hampered by the lower extrudability associated by Mg content. For improvement of extrudability and enhanced recovery efficiency during Al scrap recyeling, it has been generally practiced to reduce Mg content in A7003 alloy. Therefore, it is necessary to investigate the influence of Mg content on mechanical strength and extrudability of A7003 alloy. For efficient material processing which has small amounts, life cycle assessment in material processing(MLCA) is evaluated. The quantitative analysis of energy requirements and $CO_2$ emission for production of A7003 extruded bar are estimated with different Mg content and billet pre-heating process (heating source by light oil or LPG). In particular, the estimation of energy requirements was performed within shipping and gating range (except the mining and extraction stages)to investigate the influence of the variables on energy requirements and $CO_2$ emission in detail. As Mg content increased, the flow stress and the extrusion pressure for A7003 alloy increased. It has been thought that an increment in extrusion pressure with increasing Mg content is caused by the solid solution hardening of Mg atoms in the matrix and increment in volume fraction of intermetallic compound, $Mg_2Si$. The extrudability and the tensile strength are equal to, or above that of conventional A 7003 alloy even the content of Mg varied from $1.1wt.\%\;to\;0.5wt.\%$ alloy. This means that minimizing the content of Mg in A7003 alloy can enhance recovery efficiency during Al scrap recycling. It can be quoted that rather than Mg content energy source for billet heating is a prime factor to determine the atmospheric $CO_2$ emission.

• Journal of Welding and Joining
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• 제23권3호
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• pp.61-67
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• 2005

Since lead (Pb)-free solders for electronics have higher melting points than that of eutectic Sn-Pb solder, they need higher soldering temperatures. In order to decrease the soldering temperature we tried to coat Sn-Bi layer on $Sn-3.5\%Ag$ solder by electroplating, which applies the mechanism of transient liquid phase bonding to soldering. During heating Bi will diffuse into the $Sn-3.5\%Ag$ solder and this results in decreasing soldering temperature. As bonding samples, the 1608 capacitor electroplated with Sn, and PCB, its surface was finished with electroless-plated Ni/Au, were selected. The $Sn-95.7\%Bi$ coated Sn-3.5Ag was supplied as a solder between the capacitor and PCB land. The samples were reflowed at $220^{\circ}C$, which was lower than that of normal reflow temperature, $240\~250^{\circ}C$, for the Pb-free. As experimental result, the joint of $Sn-95.7\%Bi$ coated Sn-3.5Ag showed high shear strength. In the as-reflowed state, the shear strength of the coated solder showed 58.8N, whereas those of commercial ones were 37.2N (Sn-37Pb), 31.4N (Sn-3Ag-0.5Cu), and 40.2N (Sn-8Zn-3Bi). After thermal shock of 1000 cycles between $-40^{\circ}C$ and $+125^{\circ}C$, shear strength of the coated solder showed 56.8N, whereas the previous commercial solders were in the range of 32.3N and 45.1N. As the microstructures, in the solder $Ag_3Sn$ intermetallic compound (IMC), and along the bonded interface $Ni_3Sn_4$ IMC were observed.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2006년도 춘계 학술대회 개요집
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• pp.30-32
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• 2006

The interfacial reaction and reliability of eutectic Sn-Pb and Pb-free eutectic Sn-Ag ball-grid-array (BGA) solders with an immersion Ag-plated Cu substrate were evaluated following isothermal aging at $150^{\circ}C$. During reflowing, the topmost Ag layer was dissolved completely into the molten solder, leaving the Cu layer exposed to the molten solder for both solder systems. A typical scallop-type Cu-Sn intermetallic compound (IMC) layer was formed at both of the solder/Cu interfaces during reflowing. The thickness of the Cu-Sn IMCs for both solders was found to increase linearly with the square root of isothermal aging time. The growth of the $Cu_3Sn$ layer for the Sn-37Pb solder was faster than that for the Sn-3.5Ag solder, In the case of the Sn-37Pb solder, the formation of the Pb-rich layer on the Cu-Sn IMC layer retarded the growth of the $Cu_6Sn_5$ IMC layer, and thereby increased the growth rate of the $Cu_3Sn$ IMC layer. In the ball shear test conducted on the Sn-37Pb/Ag-plated Cu joint after aging for 500h, fracturing occurred at the solder/$Cu_6Sn_5$ interface. The shear failure was significantly related to the interfacial adhesion strength between the Pb-rich and $Cu_6Sn_5$ IMC layers. On the other hand, all fracturing occurred in the bulk solder for the Sn-3.5Ag/Ag-plated Cu joint, which confirmed its desirable joint reliability.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2010년도 춘계학술발표대회 초록집
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• pp.82-82
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• 2010

표면실장 공법을 통해 CSP 패키지를 보드에 실장 하는데 있어 무연솔더 접합부의 신뢰성에 영향을 미치는 인자 중 가장 중요한 것은 접합부에 형성되는 IMC (Intermetallic compound, 금속간화합물)인 것으로 알려져 있다. 접합부의 칩 부분에는 솔더와 칩의 UBM (Under bump metalization)이 접합하여 IMC가 형성되나, 보드 부분에는 솔더와 보드의 UBM 뿐만 아니라 그 사이에 솔더 페이스트가 함께 접합되어 IMC가 형성된다. 본 연구에서는 패키지의 신뢰성 연구를 위해 솔더 페이스트의 유무 및 두께에 따른 무연 솔더 접합부의 미세조직의 변화를 분석하였다. 본 실험에서는 Sn-3.0(Wt.%)Ag-0.5Cu 조성과 본 연구진에 의해 개발된 Sn-Ag-Cu-In 조성의 직경 $450{\mu}m$ 솔더 볼을 사용하였으며, 솔더 페이스트는 상용 Sn-3.0Ag-0.5Cu (ALPHA OM-325)를 사용하였다. 칩은 ENIG (Electroless nickel immersion gold) finish pad가 형성된 CSP (Chip scale package)를, 보드는 OSP (Organic solderability preservative)/Cu finish pad가 형성된 것을 사용하였다. 실험 방법은 보드를 솔더 페이스트 없이 플라즈마 처리 한 것, 솔더 페이스트를 $30{\mu}m$ 두께로 인쇄한 것, $120{\mu}m$의 두께로 인쇄한 것, 이렇게 3가지 조건으로 준비한 후, 솔더 볼이 bumping된 칩을 mounting하여, $242^{\circ}C$의 peak 온도 조건의 oven(1809UL, Heller)에서 reflow를 실시하여 패키지를 형성하였다. 이후 시편은 정밀 연마한 후, OM(Optical Microscopic)과 SEM(scanning electron microscope) 및 EDS(energy dispersive spectroscope)를 사용하여 솔더 접합부 IMC의 미세조직을 관찰, 분석하였다.

• Journal of Welding and Joining
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• 제32권3호
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• pp.60-67
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• 2014

The ability of electronic packages and assemblies to resist solder joint failure is becoming a growing concern. This paper reports on a study of high speed shear energy of Sn-4.0wt%Ag-0.5wt%Cu (SAC405) solder with different electroless Ni-P thickness, with $HNO_3$ vapor's status, and with various pre-conditions. A high speed shear testing of solder joints was conducted to find a relationship between the thickness of Ni-P deposit and the brittle fracture in electroless Ni-P deposit/SAC405 solder interconnection. A focused ion beam (FIB) was used to polish the cross sections to reveal details of the microstructure of the fractured pad surface with and without $HNO_3$ vapor treatment. A scanning electron microscopy (SEM) and an energy dispersive x-ray analysis (EDS) confirmed that there were three intermetallic compound (IMC) layers at the SAC405 solder joint interface: $(Ni,Cu)_3Sn_4$ layer, $(Ni,Cu)_2SnP$ layer, and $(Ni,Sn)_3P$ layer. The high speed shear energy of SAC405 solder joint with $3{\mu}m$ Ni-P deposit was found to be lower in pre-condition level#2, compared to that of $6{\mu}m$ Ni-P deposit. Results of focused ion beam and energy dispersive x-ray analysis of the fractured pad surfaces support the suggestion that the brittle fracture of $3{\mu}m$ Ni-P deposit is the result of Ni corrosion in the pre-condition level#2 and the $HNO_3$ vapor treatment.

• Journal of Advanced Marine Engineering and Technology
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• 제28권2호
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• pp.300-308
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• 2004

The formation mechanism of anodic oxide films on Mg alloys when anodized in NaOH solution. was investigated by focusing on the effects of anodizing potential. Al content. and anodizing time. Pure Mg and Mg-Al alloys were anodized for 10 min at various potentials in NaOH solutions. $Mg(OH)_2$ was generated by an active dissolution reaction at the surface. and the product was affected by temperature. The intensity ratio of $Mg(OH)_2$ in the XRD analysis decreased with increasing applied potential. while that of MgO increased. The anti-corrosion properties of anodized specimens at each constant potential were better than those of non-anodized specimens. The specimen anodized at an applied potential of 3 V had the best anti-corrosion property. And the intensity ratio of $Mg_{17}Al_{12}$/Mg increased with aluminum content in Mg-Al alloys. During anodizing. the active dissolution reaction occurred preferentially in ${\beta}\;phase(Mg_{17}Al_{12})$ until about 4 mins. and then the current density increased radually until 7 mins. The dissolution reaction progressed in a phase(Mg) which not formed the intermetallic compound. which had a lower Al content. In the anodic polarization test of $0.017\;mol{\cdot}dm^-3$ NaCl and $0.1\;mol{\cdot}dm^-3\;Na_2SO_4$ at 298 K. the current density of Mg-15 mass% Al alloy anodized for 10 mins increased. since the anodic film that forms on the a phase is a non-compacted film. The anodic film on the phase for 30 mins was a compact film as compared with that for 10 mins.

• 한국재료학회지
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• 제5권7호
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• pp.869-879
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• 1995

TiAi intermetallic compound has been extensively studied for possible high temperature structural applications because of its high specific strength at high temperature, high creep resistance, and good oxidation resistance at elevated temperatures. In addition to its good properties, an economic manufacturing routes should be developed for this material to be used more extensively. One of the promising route in manufacturing TiAl intermetallics is the Self-propagating High-temperature Synthesis (SHS) method. Thus in this study, an attempt was made to study the mechanism of the SHS process in TiAl synthesis. The composition of the sample was Ti-(45, 50, 53)at% Al and the microstuctures of the products were analyzed using optical microscope and scanning electron microscope. When the phases formed at the main SHS reaction of whicyh combustion temperature is higher than the melting temperature of aluminum were identified as TiAl and Ti$_3$Al ; Ti$_3$Al cores surrounded by TiAl phase. In order to increase the combustion temperature, carbon was added 5 and 10at.%. When the carbon content was 10at.%, the heat of the reaction was large enough to melt the phase formed and that is consistent with the theoretical calculation results of the adiabatic temperature. The combution temperatue, which was measured by a computer data acquisition system, increased with the carbon content. The phases formed from the reaction involving the carbon added were indentified as TiAl and Ti$_2$AlC using XRD. The vickers hardness of the reaction product increased with the carbon content.