• Transactions of the Korean Society of Mechanical Engineers A
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• v.25 no.7
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• pp.1055-1063
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• 2001

When the interfacial crack of isotropic/orthotropic bi-materials is propagated with constant velocity along the interface, stress and displacement components are derived in this research. The dynamic photoelastic experimental hybrid method for the bimaterial is introduced. It is assured that stress components and dynamic photoelastic hybrid developed in this research are valid. Separating method of stress components is introduced from only dynamic photoelastic fringe patterns. Crack propagating velocity of interfacial crack is 69∼71% of Rayleigh wave velocity of epoxy resin. The near-field stress components of bonded interface of bimaterial are similar with those of pure isotopic material and two dissimilar isotropic bimaterials under static or dynamic loading, but very near-field stress components of bonded interface of bimaterial are different from those.

• Journal of Surface Science and Engineering
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• v.48 no.6
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• pp.275-282
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• 2015

The cost for maintenance (replacement cost) of Ni-superalloy components in plant industry is very expensive because of high unit price of INCONEL 718. A development of repairing technology using kinetic spray process can be very helpful for reducing the maintenance cost. However, it is very difficult to produce well-deposited INCONEL 718 layer showing high interfacial bond strength via kinetic spraying. Thus, INCONEL 718 was deposited on SCM 440 substrate and the interfacial properties were investigated, in order to elucidate the cause of hindrance to the bonding between INCONEL 718 layer and SCM 440 substrate. As a result, it was revealed that the dominant obstacle to the interfacial bonding was excessive compressive residual stress accumulated in the coating layer, resulting from low plastic-deformation susceptibility of INCONEL 718. Nevertheless, the bonding state was enhanced by the post heat-treatment through relieving the residual stress and generating a diffusion/metallurgical bonding between the INCONEL 718 deposit and SCM 440 substrate.

• Composites Research
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• v.13 no.4
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• pp.67-74
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• 2000

The general solution of the anti-plane shear problem for the curved interfacial crack between viscoelastic foam and composites was investigated with the complex variable displacement function. Kelvin-Maxwell three parameter model is used to present viscoelasticity and the Laplace transform was applied to treat the viscoelastic characteristics of foam in the analysis. The stress intensity factor near the interfacial crack tip was predicted by considering both anisotropic and viscoelastic properties of two different materials. The results showed that the stress intensity factor increased with increasing the curvature of the curved interfacial crack and it also increased and eventually converged to a specific value with increasing time. The stress intensity factor increased with increasing the ratio of stiffness coefficients between foam and composites and the effect of fiber orientation on the stress intensity factor decreased with increasing the ratio of stiffness coefficients between foam and composites.

• Journal of the Korean Ceramic Society
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• v.44 no.12
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• pp.710-714
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• 2007

LSGM$(La_{0.8}Sr_{0.2}Ga_{0.8}Mg_{0.2}O_{3-{\delta}})$ is the very promising electrolyte material for lower-temperature operation of SOFCs, especially when realized in anode-supported cells. But it is notorious for reacting with other cell components and resulting in the highly resistive reaction phases detrimental to cell performance. LDC$(La_{0.4}Ce_{0.6}O_{1.8})$, which is known to keep the interfacial stability between LSGM electrolyte and anode, was adopted in the anode-supported cell, and its effect on the interfacial reactivity and electrochemical performance of the cell was investigated. No severe interfacial reaction and corresponding resistive secondary phase was found in the cell with LDC buffer layer, and this is due to its ability to sustain the La chemical potential in LSGM. The cell exhibited the open circuit voltage of 0.64V, the maximum power density of 223 $mW/cm^2$, and the ohmic resistance of $0.17{\Omega}cm^2$ at $700^{\circ}C$. These values were much improved compared with those from the cell without any buffer layer, which implies that formation of the resistive reaction phases in LSGM and then deterioration of the cell performance is resulted mainly from the La diffusion from LSGM electrolyte to anode.

• Journal of Adhesion and Interface
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• v.13 no.1
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• pp.24-30
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• 2012

Morphological changes of polyarylate (PAR) fiber treated with formic acid and ultraviolet (UV) were observed by using a scanning electron microscope (SEM) and an atomic force microscope (AFM). The results were analysed by using root mean square (RMS) roughness. In addition, the chemical changes of surface was investigated using contact angle and the interfacial adhesive strength between PAR fiber and PEN (Polyethylene naphthalate) matrix was calculated using the Pull-out test results. As the acid treatment concentration and UV irradiation time increased, cracks and pores were produced on the PAR fiber surface. Due to the roughness increased, the contact angle was decreased. For this reason, RMS roughness of PAR fiber was increased and the interfacial adhesive strength between the PAR fiber and PEN matrix was improved. The increase of interfacial adhesive strength was responsible for the increase of surface area which have cracks and pores.

• Journal of the Korean Electrochemical Society
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• v.4 no.4
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• pp.176-181
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• 2001

This article covers the fundamentals of underpotential deposition (UPD), focussing on the importance of UPD in interfacial electrochemistry. Firstly, this article described the basic concepts of UPD, including underpotential shift and electrosorption valency. Secondly, the present article explained UPD of hydrogen, followed by hydrogen evolution or hydrogen absorption, giving special attention to the adsorption sites of hydrogen on metal surface and the absorption mechanism into Pd. Finally, this article briefly presented the important factors associated with UPD in various fields of interfacial electrochemistry from practical viewpoints.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2001.10a
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• pp.153-157
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• 2001

Interfacial properties and microfailure modes of electrodeposition (ED) treated carbon fiber reinforced polyetherimide (PEI) toughened epoxy composite were investigated using microdroplet test and the measurement of surface wettability. As PEI content increased, Interfacial shear strength (IFSS) increased due to enhanced toughness and plastic deformation of PEI. In the untreated case, IFSS increased with adding PEI content, and IFSS of pure PEI matrix showed the highest. On the other hand, for ED-treated case IFSS increased with PEI content with rather low improvement rate. The work of adhesion between fiber and matrix was not directly proportional to IFSS for both the untreated and ED-treated cases. The matrix toughness might contribute to IFSS more likely than the surface wettability. Interfacial properties of epoxy-PEI composite can be affected efficiently by both the control of matrix toughness and ED treatment.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.10
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• pp.873-877
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• 2007

In order to apply a complex multilayer chip LC filter, this study has estimated the interfacial reaction and coupling properties of dielectric materials $Pb(Fe_{1/2}Nb_{1/2})O_3$ and Ni-Zn-Cu ferrite materials through low-temperature co-sintering (LTCS). PFN powders were fabricated using double calcinated at $700^{\circ}C$ and then $850^{\circ}C$. While the perovskite phase rate was found to be 91 %, after heat treatment at $900^{\circ}C$ for 6h, the perovskite phase rate and density exhibited a value of 100 % and 7.46$g/cm^3$, respectively. The PFN/Ni-Zn-Cu ferrite, PFN/CUO (or $Pb_2Fe_2O_5$) and ferrite/CuO (or $Pb_2Fe_2O_5$) were mechanically coupled through interfacial reactions after the specimen was co-sintered at $900^{\circ}C$ for 6 h. No intermediate layer exists for the mutual coupling reaction. This result indicates the possibility of low-temperature co-sintering without any interfacial reaction layer for a multilayer chip LC filter.

• Korean Journal of Materials Research
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• v.17 no.4
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• pp.215-221
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• 2007

The effect of $CF_4$ plasma treatment condition on the interfacial adhesion energy of inkjet printed Ag/polyimide system is evaluated from $180^{\circ}$ peel test by calculating the plastic deformation energy of peeled metal films. Interfacial fracture energy between Ag and as-received polyimide was 5.5 g/mm. $CF_4$ plasma treatment on the polyimide surface enhanced the interfacial fracture energy up to 17.6 g/mm. This is caused by the increase in the surface roughness as well as the change in functional group of the polyimide film due to $CF_4$ plasma treatment on the polyimide surface. Therefore, both the mechanical interlocking effect and the chemical bonding effect are responsible for interfacial adhesion improvement in ink jet printed Ag/polyimide systems.

• Advances in materials Research
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• v.6 no.3
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• pp.257-278
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• 2017

A simple closed-form solution to calculate the interfacial shear and normal stresses of retrofitted concrete beam strengthened with thin composite plate under mechanical loads including the creep and shrinkage effect has been presented in this paper. In such plated beams, tensile forces develop in the bonded plate, and these have to be transferred to the original beam via interfacial shear and normal stresses. Consequently, debonding failure may occur at the plate ends due to a combination of high shear and normal interfacial stresses. These stresses between a beam and a soffit plate, within the linear elastic range, have been addressed by numerous analytical investigations. Surprisingly, none of these investigations has examined interfacial stresses while taking the creep and shrinkage effect into account. In the present theoretical analysis for the interfacial stresses between reinforced concrete beam and a thin composite plate bonded to its soffit, the influence of creep and shrinkage effect relative to the time of the casting, and the time of the loading of the beams is taken into account. Numerical results from the present analysis are presented both to demonstrate the advantages of the present solution over existing ones and to illustrate the main characteristics of interfacial stress distributions.