Proceedings of the Korean Society For Composite Materials Conference (한국복합재료학회:학술대회논문집)
- 2001.10a
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- Pages.153-157
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- 2001
Interfacial Properties and Microfailure Mechanisms of Electrodeposited Carbon Fiber/epoxy-PEI Composites by Microdroplet and Surface Wettability Tests
Microdroplet 시험법과 Surface Wettability 측정을 이용한 전기증착된 탄소섬유 강화 Epoxy-PEI 복합재료의 계면물성과 미세파괴 메카니즘
- Kim, Dae-Sik (Department of Polymer Science and Engineering, Research Center for Aircraft Parts Technology, Gyeongsang National University) ;
- Kong, Jin-Woo (Department of Polymer Science and Engineering, Research Center for Aircraft Parts Technology, Gyeongsang National University) ;
- Park, Joung-Man (Department of Polymer Science and Engineering, Research Center for Aircraft Parts Technology, Gyeongsang National University) ;
- Kim, Minyoung (Department of Chemical Engineering, Pusan National University) ;
- Kim, Wonho (Department of Chemical Engineering, Pusan National University) ;
- Park, In-Seo (Agency for Defense Development(ADD))
- Published : 2001.10.01
Abstract
Interfacial properties and microfailure modes of electrodeposition (ED) treated carbon fiber reinforced polyetherimide (PEI) toughened epoxy composite were investigated using microdroplet test and the measurement of surface wettability. As PEI content increased, Interfacial shear strength (IFSS) increased due to enhanced toughness and plastic deformation of PEI. In the untreated case, IFSS increased with adding PEI content, and IFSS of pure PEI matrix showed the highest. On the other hand, for ED-treated case IFSS increased with PEI content with rather low improvement rate. The work of adhesion between fiber and matrix was not directly proportional to IFSS for both the untreated and ED-treated cases. The matrix toughness might contribute to IFSS more likely than the surface wettability. Interfacial properties of epoxy-PEI composite can be affected efficiently by both the control of matrix toughness and ED treatment.
Keywords
- fracture toughness;
- microdroplet test;
- wettability;
- electrodeposition (ED);
- microfailure mode;
- interfacial shear strength (IFSS)