• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.26 no.1
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• pp.32-37
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• 2014

The thermal contact resistance (TCR) is one of the important resistance components in cryogenic systems. Cryogenic measurement devices using a cryocooler can be affected by TCR because the device has to consist of several metal components that are in contact with each other for heat transfer to the specimen without a cryogen. Therefore, accurate measurement and understanding of TCR is necessary for the design of cryogenic measurement devices using a cryocooler. The TCR occurs at the interface between metals and it can be affected by variable factors, such as the roughness of the metal surface, the contact area and the contact pressure. In this study, we designed a TCR measurement system at variable temperature using a cryocooler as a heat sink. Copper was selected as a specimen in the experiment because it is widely used as a heat transfer medium in cryogenic measurement devices. We measured the TCR between Cu and Cu for various temperatures and contact pressures. The effect of the interfacial materials on the TCR was also investigated.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.151-155
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• 2003

The requirements for harsh environment electronic controllers in automotive applications have been steadily becoming more and more stringent. Electronic substrate technologists have been responding to this challenge effectively in an effort to meet the performance, reliability and cost requirements. An effect of the plasma cleaning at the alumina substrate and the IMC layer between $Sn-37wt\%Pb$ solder and Ag-Pd thick film conductor after reflow soldering has been studied. Organic residual carbon layer was removed by the substrate plasma cleaning. So the interfacial adhesive strength was enhanced. As a result of AFM measurement, Ag-Pd conductor pad roughness were increased from 304nm to 330nm. $Cu_6Sn_5$ formed during initial ref]ow process at the interface between TiWN/Cu UBM and solder grew by the succeeding reflow process so the grains had a large diameter and dense interval. A cellular-shaped $Ag_3Sn$ was observed at the interface between Ag-Pd conductor pad and solder. The diameters of the $Ag_3Sn$ grains ranged from about $0.1\~0.6{\mu}m$. And a needle-shaped $Ag_3Sn$ was also observed at the inside of the solder.

• Composites Research
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• v.22 no.5
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• pp.8-14
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• 2009

Interfacial evaluation of glass fiber reinforced carbon nanotube (CNT)-epoxy nanocomposite was investigated by micromechanical technique in combination with wettability test. The contact resistance of the CNT-epoxy nanocomposite was measured using a gradient specimen, containing electrical contacts with gradually-increasing spacing. The contact resistance of CNT-epoxy nanocomposites was evaluated by using the two-point method rather than the four-point method. Due to the presence of hydrophobic domains on the heterogeneous surface, the static contact angle of CNT-epoxy nanocomposite was about $120^{\circ}$, which was rather lower than that for super-hydrophobicity. For surface treated-glass fibers, the tensile strength decreased dramatically, whereas the tensile modulus exhibited little change despite the presence of flaws on the etched fiber surface. The interfacial shear strength (IFSS) between the etched glass fiber and the CNT-epoxy nanocomposites increased due to the enhanced surface energy and roughness. As the thermodynamic work of adhesion, $W_a$ increased, both the mechanical IFSS and the apparent modulus increased, which indicated the consistency with each other.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.2
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• pp.41-48
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• 2018

The quantitative interfacial adhesion energy measurement method of copper redistribution layer and WPR dielectric interface were investigated using $90^{\circ}$ peel test, 4-point bending test, double cantilever beam (DCB) measurement for FOWLP Applications. Measured interfacial adhesion energy values of all three methods were higher than $5J/m^2$, which is considered as a minimum criterion for reliable Cu/low-k integration with CMP processes without delamination. Measured energy values increase with increasing phase angle, that is, in order of DCB, 4-point bending test, and $90^{\circ}$ peel test due to increasing roughness-related shielding and plastic energy dissipation effects, which match well interfacial fracture mechanics theory. Considering adhesion specimen preparation process, phase angle, measurement accuracy and bonding energy levels, both DCB and 4-point bending test methods are recommended for quantitative adhesion energy measurement of RDL interface depending on the real application situations.

• Polymer(Korea)
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• v.37 no.3
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• pp.373-378
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• 2013

The interfacial adhesion strength is very important in $SiO_x$ deposited PC film for the barrier enhanced polycarbonate (PC) flexible substrate. In this study, PC films were treated by undercoating, UV/$O_3$ and low temperature plasma and then the effect of physical and chemical surface modifications on the interfacial adhesion strength between PC film and $SiO_x$ barrier layer were studied. It was found that untreated PC film shows significantly low interfacial adhesion strength due to the smooth surface and low surface free energy of PC. Low temperature plasma treatments resulted in the increase of both surface roughness and surface free energy due to etching and the appearance of polar molecules on the PC surface. However, UV/$O_3$ treatment only shows the increase of surface free energy by developed polar molecules on the surface. These surface modifications caused the enhancement of surface interfacial strength between PC film and $SiO_x$ barrier. In the case of undercoating, it was found that the increase of surface interfacial strength was achieved by adhesion between various acrylic acid on acrylate coated surface and $SiO_x$ without increase of polar surface energy. In addition, the barrier property is also improved by organic-inorganic hybrid multilayer structure.

• Journal of the Korea Concrete Institute
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• v.28 no.6
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• pp.637-646
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• 2016

In this study, slant shear tests for the prism specimens strengthened with ultra-high performance fiber reinforced concrete (UHPFRC), normal- and high-strength concrete were performed to evaluate the interfacial shear strength between old and new concrete substrate. Test parameters are the roughness of surface, concrete strength, and fiber volume fraction of UHPFRC. The surface of the concrete was roughened by shot blasting. Test results showed that the adhesion bond resistance of the specimen with a roughened surface was very large compared to that of the specimen with a smooth surface. In addition, the interfacial shear strength appeared to be affected by the concrete strength rather than the fiber volume fraction. For the roughened surface by shot-blasting method, interfacial shear resistance exceeded the upper limit which is presented in current design codes even if the shear-friction reinforcements are not provided. Based on the test results, it is applicable to use the current concrete design codes to achieve the shear-friction design for the interface between conventional concrete and UHPFRC. However, for the surface which is not processed, it would be appropriate to provide additional shear-friction reinforcement.

• Journal of the Korean Society of Radiology
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• v.12 no.1
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• pp.101-106
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• 2018

Multilayer mirrors have widely been used for monochromatization of X-ray with high reflection efficiency. The reflected X-ray energy or wavelength is determined by the d-spacing of a multilayer mirror and the incidence angle. The reflectivity critically depends on the number of bilayers and surface roughness on each interface. The multilayer mirror has a structure of alternative deposition of high and low Z-elements on the substrate. Each interface should be considered in the calculation of reflectivity. In this paper, we examine the degradation of reflectivity by the inter-diffusion combined with surface roughness on each interface for a W/Si multilayer mirror. In the depth-graded W/Si multilayer mirror, the FWHMs for angle and energy were larger than them of the uniform multilayer mirror. Inter-diffusion considerable gave rise to the degradation of reflectivity. To obtain measured reflectivity closed to the expected reflectivity, the inter-diffusion on W-Si and Si-W interfaces should be considered.

• Journal of Ceramic Processing Research
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• v.19 no.5
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• pp.361-368
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• 2018

We investigated the interfacial properties of fluorocarbon self-assembled monolayers (FC-SAMs) with different alkyl chain lengths. It was found that the substrate characteristics were changed rapidly with the fabrication time and temperature of the SAM. FC-3SAM, which has the shortest alkyl chain in this study, showed a contact angle of $54.1^{\circ}$ when it was fabricated in an electric oven at $60^{\circ}C$ for the first minute. The FC-3SAM showed a contact angle of up to $76.9^{\circ}$ when it was fabricated in an electric oven at the same temperature condition for 180 minutes. FC-10SAM, which has the longest alkyl chain in this study, showed a contact angle of $64.7^{\circ}$ when it was fabricated at a temperature condition of $60^{\circ}C$ for 1 minute, and a contact angle of $98.7^{\circ}C$ at a temperature condition of $60^{\circ}C$ for 180 minutes. It was found that the FC-10SAM shows an increased contact angle and hydrophobic properties due to a well-aligned molecular structure resulting from a strong van der Waals force. In contrast, the FC-3SAM shows a small contact angle due to the intermolecular disorder resulting from a weak van der Waals force. The average roughness of FC-SAMs was investigated using AFM. The surface roughness of FC-SAMs, which verifies the results of contact angle, was confirmed. At a fabrication time of 120 minutes, the FC-10SAM showed an improvement in average roughness by 62% compared to that of FC-3SAM due to its good alignment.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.439-442
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• 2002

The interface between two different materials in the insulation systems is the weak-link in the underground power transmission systems, In this paper, Optimum conditions of the interface between Epoxy and EPDM is studied. The variation factor condition of interface is roughness of surface, spreading of oils, interfacial pressure and temperature. The breakdown times under the constant voltage below the breakdown voltage were also gained. The breakdown voltage at the after laying time equivalent to is calculated by the V-t characteristic and the inverse power law. When this is done, the characteristic life exponent n is used and the long time breakdown voltage can be evaluated.

• Progress in Superconductivity and Cryogenics
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• v.15 no.2
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• pp.48-51
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• 2013

The thermal contact resistance (TCR) is one of the important components in the cryogenic systems. Especially, cryogenic measurement devices using a cryocooler can be affected by TCR because the systems have to consist of several metal components in contact with each other for heat transferring to the specimen without cryogen. Therefore, accurate measurement and understanding of TCR is necessary for the design of cryogenic measurement device using a cryocooler. The TCR occurs at the interface between metals and it can be affected by variable factors, such as roughness of metal surface, contact area and contact pressure. In this study, we designed TCR measurement system at various temperatures using a cryocooler as a heat sink and used steady state method to measure the TCR between metals. The copper is selected as a specimen in the experiment because it is widely used as a heat transfer medium in the cryogenic measurement devices. The TCR between Cu and Cu is measured for various temperatures and contact pressures. The effect of the interfacial materials on the TCR is also investigated.