• Journal of the Korean Ceramic Society
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• v.48 no.5
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• pp.373-378
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• 2011

The composite added with surface-coated chopped carbon fiber showed the microstructure of a 3 dimensional discretional arrangements. The fiber reinforced reaction bonded silicon carbide composite, containing the 50 vol% carbon fiber, showed the porosity of < 1 vol%, 3-point bending strength value of 250MPa and fracture toughness of 4.5 $MPa{\cdot}m^{1/2}$. As the content of carbon fiber was increased from 0 vol% to 50 vol% in the composite, fracture strength was decreased due to the increase of carbon fiber, which has a less strength than SiC and molten Si. On the other hand, the fracture toughness was increased with increasing the amount of carbon fiber. According to the polished microstructure, carbon fiber was shown to have a random 3 dimensional arrangement. Moreover, the fiber pull-out phenomenon was observed with the fractured surface, which can explain the increased fracture toughness of the composite containing high content of carbon fiber.

• Corrosion Science and Technology
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• v.22 no.4
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• pp.287-296
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• 2023

Li-ion batteries have been gaining increasing importance, driven by the growing utilization of renewable energy and the expansion of electric vehicles. To meet market demands, it is essential to ensure high energy density and battery safety. All-solid-state batteries (ASSBs) have attracted significant attention as a potential solution. Among the advantages, they operate with an ion-conductive solid electrolyte instead of a liquid electrolyte therefore significantly reducing the risk of fire. In addition, by using high-capacity alternative electrode materials, ASSBs offer a promising opportunity to enhance energy density, making them highly desirable in the automotive and secondary battery industries. In ASSBs, Li metal can be used as the anode, providing a high theoretical capacity (3860 mAh/g). However, challenges related to the high interfacial resistance between Li metal and solid electrolytes and those concerning material degradation during charge-discharge cycles need to be addressed for the successful commercialization of ASSBs. This review introduces and discusses the interfacial reactions between Li metal and solid electrolytes, along with research cases aiming to improve these interactions. Additionally, future development directions in this field are explored.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.129.2-129.2
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• 2013

Electron injection enhancement at OLED (organic light-emitting diodes) cathode side has mostly been achieved by insertion of a low work function layer between metal electrode and emissive layer. We investigated the interfacial chemical reactions and electronic structures of alkaline-earth metal (Ca, Ba)/Alq3 [tris(8-hydroxyquinolinato)aluminium] and Ca/BaF2/Alq3 using in-situ X-ray & ultraviolet photoelectron spectroscopy. The alkaline-earth metal deposited on Alq3 generates two energetically separated gap states in sequential manner. This phenomenon is explained by step-by-step charge transfer from alkali-earth metal to the lowest unoccupied molecular orbital (LUMO) states of Alq3, forming new occupied states below Fermi level. The BaF2 interlayer initially prevents from direct contact between Alq3 and reactive Ca metal, but it is dissociated into Ba and CaF2. However, as the Ca thickness increases, the Ca penetrates the interlayer to directly participate in the reaction with underlying Alq3. The influence of the multiple gap state formation by the interfacial chemical reaction on the OLED performance will be discussed.

• Journal of Korea Foundry Society
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• v.13 no.3
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• pp.276-284
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• 1993

The interfacial phenomena between intermetallic compounds and Al matrix have been studied at $680^{\circ}C$ for various holding time under argon atmosphere. Model experiments were performed using Fe, Ni and Ti wire to observe the interfacial phenomena. The interfacial phenomena between intermetallic compounds and Al matrix were analysed by optical microscope, SEM and EDX. The results of EDX and XRD showed that the interfacial zones of intermetallic compounds/Al matrix were composed of several intermetallic layers. The reaction layer was varied with holding time and heating temperature. The investigation of interfacial zones in the specimen as a function of heat treatment time at $680^{\circ}C$ indicated that the best heat treatment condition for squeeze casting was $680^{\circ}C$ for 5min.

• Journal of the Korean Ceramic Society
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• v.36 no.8
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• pp.805-812
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• 1999

• Journal of the Korean institute of surface engineering
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• v.31 no.6
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• pp.379-388
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• 1998

The iron-zinc interfacial reaction and corrosin properties in galvanizing bath containning Ni have been intestigated. The substrate steel plates were galvanized in Zn or Zn-0.018Al baths with various Ni contents. The corrosion resistance of galvanized specimens was also evaluated by $60^{\circ}$bending test for galvannealing speaaimens. The corrosion resistance was improved with Ni addition in pure Zn bath, while deteriorated with Ni addition in Zn-0.18Al bath. The anti-powdering property, on thhe otherhand, was improved with Ni addition in Zn-0.18Al bath, while deteriorated with Ni addition in pure Zn. It was found that the anti-powdering property was improved with increasing $\xi$ phase ratio in reaction layer.

• Transactions of Materials Processing
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• v.8 no.3
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• pp.289-289
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• 1999

This paper describes the investment casting of TiAl alloys. The effects of mold material and mold preheating temperature for the investment casting of TiAl on metal-mold interfacial reaction were investigated by means of optical micrography, hardness profiles and an electron probe microanalyzer. The mold materials examined were colloidal silica bonded ZrO₂, ZrSiO₄, A1₂O₃and CaO stabilized ZrO₂. When compared with conventional titanium a1loy, the high aluminum concentration of TiAl alloys helps to lower their reactivity in the molten state. The A1₂O₃mold is a promising mold material for the investment casting of TiAl in terms of the thermal stability, formability and cost. Special attention need to be paid to thermal stability and mold preheating when developing the investment calling of TiAl alloys.

• Journal of the Korean institute of surface engineering
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• v.32 no.4
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• pp.547-554
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• 1999

The interfacial reaction, spangle and coating thickness of galvanized steel in Ni added Zn-0.18Al bath have been investigated. The size of spangle and thickness of reaction layer were observed under an optical microscope, SEM and EDS. Analysing the experimental results concerning spangle size of galvanized steel it was found that Ni addition in Zn-0.18Al bath tended to be minimized spangle size. For Zn-0.18Al bath, addition of 0.1Ni suppressed the formation of Fe-Zn intermetallic compounds but increased with Ni content above 0.1%. The coating thickness of galvanized steel was reduced with Ni addition in Zn-0.18Al bath, especially in Zn-0.18Al-0.05Ni bath. Addition of Al in Ni containing bath resulted in forming the Al-Ni intermetallic compounds such as $Al_3$Ni$_2$ and $Al_2$Ni which consist most of top precipitates.

• Journal of Korea Foundry Society
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• v.22 no.2
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• pp.89-96
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• 2002

This study examined the effects of adding Zn to Sn-3.5Ag solder on the microstructure changes and behavior of interface reaction of the solder joint with Cu substrate. The solder/Cu joints were examined with microscope to observe the characteristics of microstructure changes and interfacial reaction layer with aging treatment for up to 120 days at $150^{\circ}C$. Results of the microstructure changes showed that the microstructures were coarsened with aging treatment, while adding 1%Zn suppresses coarsening microstructures. The Sn-3.5Ag/Cu had a fast growth rate of the reaction layer in comparison with the Sn-3.5Ag-1Zn at the aging temperature of $150^{\circ}C$. Through the SEM/EDS analysis of solder joint, it was proved that intermetallic layer was $Cu_6Sn_5$ phase and aged specimens showed that intermetallic layer grew in proportion to $t^{1/2}$, and the precipitate of $Ag_3Sn$ occur to both inner layer and interface of layer and solder. In case of Zn-containing composite solder, $Cu_6Sn_5$ phase formed at the side of substrate and Cu-Zn-Sn phase formed at the other side in double layer. It seems that Cu-Zn-Sn phase formed at solder side did a roll of banrier to suppress the growth of the $Cu_6Sn_5$ layer during the aging treatment.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.73-79
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• 2022

In this study, a reaction study between Ga, which has recently been spotlighted as a low-temperature bonding material, and Cu, a representative electrode material, was conducted to investigate information necessary for low-temperature soldering applications. Interfacial reaction and intermetallic compound (IMC) growth were observed and analyzed by reacting Ga and Cu/Au substrates in the temperature range of 80-200℃. The main IMC growing at the reaction interface was CuGa₂ phase, and AuGa₂ IMC with small particle sizes was formed on the upper part and Cu₉Ga₄ IMC with a thin band shape on the lower part of the CuGa₂ layer. CuGa₂ particles showed a scallop shape, and the particle size increased without significant shape change as the reaction time increased, similar to the case of Cu₆Sn₅ growth. As a result of analyzing the CuGa₂ growth mechanism, the time exponent was calculated to be ~3.0 in the temperature range of 120-200℃, and the activation energy was measured to be 17.7 kJ/mol.