• Journal of Korean Society of Environmental Engineers
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• v.22 no.3
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• pp.485-494
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• 2000

According to the worldwide interest in controlling $CO_2$ which contributes to green house effect. new techniques of reducing $CO_2$ are under development. We have developed new technique for reducing $CO_2$. In low $CO_2$ concentration. the chemical absorption method is useful. In this study. the kinetics of the reaction between $CO_2$ and the sterically hindered amine solution with piperazine. have been investigated from measurements of the rate of absorption of $CO_2$ in the stirred vessel that has a horizontal liquid-gas interface, in the temperature range $30{\sim}70^{\circ}C$. The experiments were carried out in the range 10.130~20.260 kPa of partial pressure of $CO_2$, and in aqueous $2.0kmol/m^3$ AMP solution with $0{\sim}0.4kmol/m^3$ piperazine The experimental results are as follows: 1) The absorption rate of $CO_2$ into aqueous AMP + piperazine solution is gett ng faster than that of aqueous AMP absorbents with temperature. Because the activation energy of piperazine 57.147 kJ/mol is higher than that of AMP 41.7kJ/mol. therefore the effect of piperazine on absorption rate increases with temperature. 2) Compared with aqueous AMP solution. the absorption rate of $CO_2$ into AMP + piperazine solution increases from 6.33% at $30^{\circ}C$ to 12% at $70^{\circ}C$, so AMP + piperazine solution is thought to be a better than AMP solution, 3) The reaction rate constants of piprazine in aqueous AMP solution with $CO_2$ have been determined as 217.21, 420.46, 707.00 and $3162.167m^3/kmol{\cdot}s$ respectively at 30, 40, 50 and $70^{\circ}C$ but these results are higher than those of Xu which were 186.7. 367.32. 693.01. $2207.65m^3/kmol{\cdot}s$ at 30, 40, 55, $70^{\circ}C$in aqueous MDEA solution. So the regression analysis of the data has led to the following equation In $k_p$ =28.324-6934.7/T.

• Korean Journal of Materials Research
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• v.5 no.1
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• pp.42-54
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• 1995

$Ta_2O_5$ thin film IS a promising material for the high dielectrics of ULSI DRAM. In this study, $Ta_2O_5$ thin film was grown on p-type( 100) Si wafer by thermal metal organic chemical vapo deposition ( MCCVD) method and the effect of operating varialbles including substrate temperature( $T_s$), bubbler temperature( $T_ \sigma$), reactor pressure( P ) was investigated in detail. $Ta_2O_5$ thin film were analyzed by SEM, XRD, XPS, FT-IR, AES, TEM and AFM. In addition, the effect of various anneal methods was examined and compared. Anneal methods were furnace annealing( FA) and rapid thermal annealing( RTA) in $N_{2}$ or $O_{2}$ ambients. Growth rate was evidently classified into two different regimes. : (1) surface reaction rate-limited reglme in the range of $T_s$=300 ~ $400 ^{\circ}C$ and (2: mass transport-limited regime in the range of $T_s$=400 ~ $450^{\circ}C$.It was found that the effective activation energies were 18.46kcal/mol and 1.9kcal/mol, respectively. As the bubbler temperature increases, the growth rate became maximum at $T_ \sigma$=$140^{\circ}C$. With increasing pressure, the growth rate became maximum at P=3torr but the refractive index which is close to the bulk value of 2.1 was obtained in the range of 0.1 ~ 1 torr. Good step coverage of 85. 71% was obtained at $T_s$=$400 ^{\circ}C$ and sticking coefficient was 0.06 by comparison with Monte Carlo simulation result. From the results of AES, FT-IR and E M , the degree of SiO, formation at the interface between Si and TazO, was larger in the order of FA-$O_{2}$ > RTA-$O_{2}$, FA-$N_{2}$ > RTA-$N_{2}$. However, the $N_{2}$ ambient annealing resulted in more severe Weficiency in the $Ta_2O_5$ thin film than the TEX>$O_{2}$ ambient.

• Journal of the Korean earth science society
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• v.44 no.1
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• pp.13-35
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• 2023

Ocean currents play the most important role in causing and controlling global climate change. The water depth of the Yellow Sea is very shallow compared to the East Sea, and the circulation and currents of seawater are quite complicated owing to the influence of various wind fields, ocean currents, and river discharge with low-salinity seawater. The Yellow Sea Warm Current (YSWC) is one of the most representative currents of the Yellow Sea in winter and is closely related to the weather of the southwest coast of the Korean Peninsula, so it needs to be treated as important in secondary-school textbooks. Based on the 2015 revised national educational curriculum, secondary-school science and earth science textbooks were analyzed for content related to the YSWC. In addition, a questionnaire survey of secondary-school science teachers was conducted to investigate their perceptions of the temporal variability of ocean currents. Most teachers appeared to have the incorrect knowledge that the YSWC moves north all year round to the west coast of the Korean Peninsula and is strong in the summer like a general warm current. The YSWC does not have strong seasonal variability in current strength, unlike the North Korean Cold Current (NKCC), but does not exist all year round and appears only in winter. These errors in teachers' subject knowledge had a background similar to why they had a misconception that the NKCC was strong in winter. Therefore, errors in textbook contents on the YSWC were analyzed and presented. In addition, to develop students' and teachers' data literacy, class materials on the YSWC that can be used in inquiry activities were developed. A graphical user interface (GUI) program that can visualize the sea surface temperature of the Yellow Sea was introduced, and a program displaying the spatial distribution of water temperature and salinity was developed using World Ocean Atlas (WOA) 2018 oceanic in-situ measurements of water temperature and salinity data and ocean numerical model reanalysis field data. This data visualization materials using oceanic data is expected to improve teachers' misunderstandings and serve as an opportunity to cultivate both students and teachers' ocean and data literacy.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.3
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• pp.19-27
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• 2003

Surface finishes of PCB laminates are important in the solder joint reliability of flip chip package because the types and thicknesses of intermetallic compound(IMC), and compositions and hardness of solders are affected by them. In this study, effects of surface finishes of PCB on the low cycle fatigue resistance of Sn-based lead-free solders; Sn-3.5Ag, Sn-3.5Ag-XCu(X=0.75, 1.5), Sn-3.5Ag-XBi(X=2.5, 7.5) and Sn-0.7Cu were investigated for the Cu and Au/Ni surface finish treatments. Displacement controlled room temperature lap shear fatigue tests showed that fatigue resistance of Sn-3.5Ag-XCu(X=0.75, 1.5), Sn-3.5Ag and Sn-0.7Cu alloys were more or less the same each other but much better than that of Bi containing alloys regardless of the surface finish layer used. In general, solder joints on the Au/Ni finish showed better fatigue resistance than those on the Cu finish. Cross-sectional fractography revealed microcracks nucleation inside of the interfacial IMC near the solder mask edge, more frequently on the Cu than the Au/Ni surface finish. Macro cracks followed the solder/IMC interface in the Bi containing alloys, while they propagated in the solder matrix in other alloys. It was ascribed to the Bi segregation at the solder/IMC interface and the solid solution hardening effect of Bi in the $\beta-Sn$ matrix.

• Journal of the Korean Institute of Telematics and Electronics
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• v.26 no.2
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• pp.94-101
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• 1989

Transport properties of 2DEG at AlGaAs/GaAs interface such as average electron energy, flight distance, each valley occupancy ratio, average electron velocity for various fields are investigated by MONTE-CARLO method. As the electric field increases, more electrons transit drastically from (000) valley to (000) upper valley. This phenomenon shows the nonstationary effect such as velocity overshoot. The duration of the transient decreases from about 1.4 psec for electric field E = 7KV/cm to about 0.7 psec for 12KV/cm. The average electron velocity during transient transport in 2DEG is about 8 times the steady-state velocity for E = 12KV/cm at room temperature. In comparison with bulk GaAs the peak velocity in the 2DEG is higher than that in even pure bulk GaAs at electric field E = 7 KV/cm. On the basis of the fact that the electrons in the 2DEG have larger peak velocity and shorter transient time of velocity than those in the bulk GaAs, it is suggested that the device with 2DEG may obtain higher mobility than that with bulk GaAs.

• Restorative Dentistry and Endodontics
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• v.28 no.1
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• pp.89-99
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• 2003

The purpose of this study was to investigate the bonding of resin- based root canal sealer, AH26 when the sealer was applied as a thin layer between dentine and gutta-percha surface. In this study forty non-caries extracted human molars and resin-based root canal sealer(AH 26, DeTrey/Dentsply, Germany) were used. Disks of gutta-percha, 6mm in diameter.6mm thick (Diadent/Dentsply, Korea) for thermoplastic obturation were used and dentin surfaces were treated with 2% NaOCl(Group 1) or 2%NaOCl+17% EDTA(Group 3). Disks of gutta-Percha, 6mm in diameter.6mm thick (Diadent/Dentsply, Korea) for conventional obturation were used and dentin surface were treated with 2% NaOCl(Group 2) or 2%NaOCl+17% EDTA(Group 4). Enamel was removed by a horizontal section 1mm below the deepest portion of the central occlusal groove by using a watercooled low speed diamond saw. A second horizontal section was done around cementoenamel junction. Exposed dentin surface was cut to approximately $8{\times}8{\;}mm$ rectangular shape and was ground against 320, 400, 600 grade silicon carbide abrasive paper serially. After grinding, the dentine surface were soaked in a solution of 2% NaOCl for 30 minutes and twenty of specimens were treated with 17% EDTA solution for 1 minute. The treated specimens were washed and dried, Root canal sealer, AH26 was prepared according to the manufacture's instructions The Gutta-percha and dentin surface were coated with a thin layer of the freshly mixed seal or. The specimens were left overnight at room temperature. After their initial set, they were transferred to an incubator at $37$^{\circ}C$ for 72 h. After 72 hours, resin blocks were made. The resin block was serially sectioned vertically into stick of $1{\cdot}1mm$. Twenty sticks were prepared from each group. After that, tensile bond strength f3r each stick was measured with Microtensile Tester Failure patterns of the specimens at the interface between gutta-percha and dentin were observed under the SEM(x1000) and Stereomicroscope (LEICA M42O, Meyer Inst., TX U.S.A) at 1.25 x25 magnification. The results were statistically analysed by using a One-way ANOVA and Tukey's test. The results were as follows; 1. Tensile bond strengths($mean{\pm}SD$) were expressed with ascending order as follows: Group 1, $3.09{\pm}$ 1.05Mpa : Group 2, $6.23{\pm}1.16MPa$ : Group 3, $7.12{\pm}1.07MPa$ : Group 4, $10.32{\pm}2.06MPa$. 2. Tensile bond strengths of the group 2 and 4 used disks of gutta-percha for conventional obturation were significantly higher than that of the group 1 and 3 used fir thermoplastic obturation. (p < 0.05). 3. Tensile bond strengths of the group 3 and 4 treated with 2% NaOC1+17% EDTA were significantly higher than that of the group 1 and 2 treated with 2% NaOCl. (p < 0.05). 4. In analysis of failure patterns at the interface between sealer and gutta-percha, there were observed 49 (61%)cases of adhesive failure patterns and 31 (39%) cases of mixed failures patterns.

• Restorative Dentistry and Endodontics
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• v.22 no.1
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• pp.1-33
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• 1997

The objective of this study was to analyze the in vitro and in vivo corrosion products of low and high copper amalgams. The four different types of amalgam alloy used in this study were Fine cut, Caulk spherical, Dispersalloy, and Tytin. After each amalgam alloy and Hg were triturated according to the directions of the manufacturer by means of the mechanical amalgamator(Amalgam mixer. Shinhung Co. Korea), the triturated mass was inserted into a cylindrical metal mold which was 12mm in diameter and 10mm in height. The mass was condensed by 150Kg/cm compressive force. The specimen was removed from the mold and aged at room temperature for about seven days. The standard surface preparation was routinely carried out by emery paper polishing under running water. In vitro amalgam specimens were potentiostatically polarized ten times in a normal saline solution at $37^{\circ}C$(potentiostat : HA-301. Hukuto Denko Corp. Japan). Each specimen was subjected to anodic polarization scan within the potential range -1700mV to+400mV(SCE). After corrosion tests, anodic polarization curves and corrosion potentials were obtained. The amount of component elements dissolved from amalgams into solution was measured three times by ICP AES(Inductive Coupled Plasma Atomic Emission Spectrometry: Plasma 40. Perkim Elmer Co. U.S.A.). The four different types of amalgam were filled in occlusal and buccal class I cavities of four human 3rd molars. After about five years the restorations were carefully removed after tooth extraction to preserve the structural details including the deteriorated margins. The occlusal surface, amalgam-tooth interface and the fractured surface of in vivo amalgam corrosion products were analyzed. In vivo and in vitro amalgam specimens were examined and analyzed metallographically by SEM(Scanning Electron Microscope: JSM 840. Jeol Co. Japan) and EDAX(Energy Dispersive Micro X-ray Analyser: JSM 840. Jeol Co. Japan). 1. The following results are obtained from in vitro corrosion tests. 1) Corrosion potentials of all amalgams became more noble after ten times passing through the in vitro corrosion test compared to first time. 2) After times through the test, released Cu concentration in saline solution was almost equal but highest in Fine cut. Ag and Hg ion concentration was highest in Caulk spherical and Sn was highest in Dispersalloy. 3) Analyses of surface corrosion products in vitro reveal the following results. a)The corroded surface of Caulk spherical has Na-Sn-Cl containing clusters of $5{\mu}m$ needle-like crystals and oval shapes of Sn-Cl phase, polyhedral Sn oxide phase. b)In Fine cut, there appeared to be a large Sn containing phase, surrounded by many Cu-Sn phases of $1{\mu}m$ granular shapes. c)Dispersalloy was covered by a thick reticular layer which contained Zn-Cl phase. d)In Tytin, a very thin, corroded layer had formed with irregularly growing Sn-Cl phases that looked like a stack of plates. 2. The following results are obtained by an analysis of in vivo amalgam corrosion products. 1) Occlusal surfaces of all amalgams were covered by thick amorphous layers containing Ca-P elements which were abraded by occlusal force. 2) In tooth-amalgam interface, Ca-P containing products were examined in all amalgams but were most clearly seen in low copper amalgams. 3) Sn oxide appeared as a polyhedral shape in internal space in Caulk spherical and Fine cut. 4) Apical pyramidal shaped Sn oxide and curved plate-like Sn-Cl phases resulted in Dispersalloy. 5) In Tytin, Sn oxide and Sn hydroxide were not seen but polyhedral Ag-Hg phase crystal appeared in internal space which assumed a ${\beta}_l$ phase.

• Korean Journal of Crystallography
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• v.7 no.1
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• pp.8-19
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• 1996

Cholestryl Methyl and Propyl Carbonate(CH3OCOOC27H45, C3H7OCOOC27H45) are monoclinic, space group P21, with a=17.014(1), b=7.682(1), c=10.612(1)Å, β=103.05(1)°, Z=2, V=1351.16Å3, Dc=1.09 g/cm3 for methyl carbonate, and with a=13.683(1), b=11.864(2), c=18.904(2)Å, β=106.30(1)°, Z=4, V=2945.4Å3, Dc=1.06 g/cm3, Dm=1.06 g/cm3 for propyl carbonate. The intensity data were collected on an Enraf-Nonius CAD-4 diffractometer with a graphite monochromated Cu-Kα radiation. The structure was solved by direct methods and refined by full matrix least-squares methods. The final R factor was 0.051 for 2323 observed reflections for methyl carbonate and 0.074 for 3323 observed reflections for propyl carbonate. Compared with other cholesteryl derivatives, the cholesteryl ring and tail region of the molecules are normal. The molecules are stacked in clearly separated layers. At center of the layer, there are cholesteryl-C(17) side chain interactions. The interface region between layers is occupied by the loosely packed methyl carbonate chains. The structure of cholesteryl propyl carbonates have two propyl carbonates have two molecules(A, B) that are not related by crystal symmetry and have their tetracyclic system almost parallel to each other. Cholesteryl-cholesteryl interactions between symmetry related A-molecules, and cholesteryl-C(17) side chain interactions between symmetry related B-molecules occur at the center of the layers and these molecules stack along 2₁ screw axes. There are also C(17)chain-carbonate chain and C(17)chain-C(17)chain interactions in the interface region between layers. There is efficient packing between cholesteryl ring systems in propyl carbonates. Temperature ranges of cholesteric mesophases of cholesteryl alkyl cargonates are narrow for methyl, pentyl and hexyl carbonates, and rather broader for ethyl and propyl carbonates. Cholesteryl-isotropic transitions change very little with chain length.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2008.05a
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• pp.105-110
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• 2008

We have proposed a new structure of poly-silicon thin film transistor(TFT) which was fabricated the LDD region using doping oxide with graded spacer by etching shape retio. The devices of n-channel poly-si TFT's hydrogenated by $H_2$ and $HT_2$/plasma processes are fabricated for the devices reliability. We have biased the devices under the gate voltage stress conditions of maximum leakage current. The parametric characteristics caused by gate voltage stress conditions in hydrogenated devices are investigated by measuring /analyzing the drain current, leakage current, threshold voltage($V_{th}$), sub-threshold slope(S) and transconductance($G_m$) values. As a analyzed results of characteristics parameters, the degradation characteristics in hydrogenated n-channel polysilicon TFT's are mainly caused by the enhancement of dangling bonds at the poly-Si/$SiO_2$ interface and the poly-Si Brain boundary due to dissolution of Si-H bonds. The structure of novel proposed poly-Si TFT's are the simplity of the fabrication process steps and the decrease of leakage current by reduced lateral electric field near the drain region.

• Korean Journal of Materials Research
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• v.12 no.10
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• pp.814-819
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• 2002

TiN and TaN films as electrode materials of reactive sputtered $Ta_2$$O_{5}$ were prepared by sputtering to compare their thermal stabilities with $Ta_2$$O_{5}$ The microstructural change of $Ta_2$$O_{5}$ films with annealing was also investigated. As- deposited $Ta_2$$O_{5}$ film on $SiO_2$ was amorphous and annealing of 80$0^{\circ}C$ for 30 min made it transform to $\beta$-Ta$_2$O$_{5}$ crystalline which contains amorphous particles with the size of a few nm. Crystallization temperature of Ta$_2$Ta_2$$O_{5}$ on TaN is higher than that on TiN electrode. The interface between TaN and Ta$_2$O$_{5}$ maintained stably even after vacuum annealing up to $800^{\circ}C$ for 1 hr, but TiN interacted with $Ta_2$$_O{5}$ and so interdiffusion between TiN and $Ta_2$$O_{5}$ occurred by vacuum annealing of 80$0^{\circ}C$ for 1 hr. It indicates that TaN is thermally more stable with $Ta_2$$O_{5}$ than TiN.N.