• 제목/요약/키워드: Interface temperature

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냉수가 수평유입되는 열저장탱크의 중간 경계면 부근에서의 열성층 효과 (Thermal Stratification Effects Near an Interface by Horizontal Inflow of Cold Water in Thermal Storage Tank)

  • 황성일;박이동
    • 태양에너지
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    • 제8권2호
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    • pp.46-56
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    • 1988
  • This investigation concerns thermal stratification of the water due to the temperature difference (${\Delta}T=T_{\infty}-T_i$) between the mean temperature of the water in the test tank (1m wide, 1m high, 2.1m long) and the temperature of the inflow water into the tank; flow rate of circulating water and height of the sink diffuser in the test tank. The additional objectives was to observe a stratification phenomena near an interface by measuring the velosities and the temperature difference and investigate an availabilities of the better effective hot water through establishing thermocline near an interface around the bottom of the tank. Following results were obtained through the experiments. 1. When the flow rate was constant and the temperature difference (${\Delta}T=T_{\infty}-T_i$) between the mean temperature of the flow in the test tank and the temperature of the inflow water increased by 5.6, 9.5, 13.5($^{\circ}C$), obtained the better effective advantage of hot water and the stress near an interface increased gradually. 2. When the ${\Delta}T=T_{\infty}-T_i$ was constant and flow rate increased by 4.0, 4.8, 6.4, 8.0 (LPM), obtained the better effective advent age of hot water and the mean stress near an interface increased gradually. 3. When the height of the sink diffuser was 25cm from tank bottom in comparison with 50cm, obtained the better effective advantage of hot water and the mean stress near an interface increased.

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Effect of Interface Roughness on Exchange Bias of an Uncompensated Interface: Monte Carlo Simulation

  • Li, Ying;Moon, Jung-Hwan;Lee, Kyung-Jin
    • Journal of Magnetics
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    • 제16권4호
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    • pp.323-327
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    • 2011
  • By means of Monte Carlo simulation, we investigate the effects of interface roughness and temperature on the exchange bias and coercivity in ferromagnetic (FM)/antiferromagnetic (AFM) bilayers. Both exchange bias and coercivity are strongly dependent on interface roughness. For a perfect uncompensated interface a domain wall is formed in the AFM system during FM reversal, which results in a very small exchange bias. However, a finite interface roughness leads to a finite value of the exchange bias due to the existence of pinned spins at the AFM surface adjacent to the mixed interface. It is observed that the exchange bias decreases with increasing temperature, consistent with the experimental results. It is also observed that a bump in coercivity occurs around the blocking temperature.

Compensation of temperature effect on impedance responses of PZT interface for prestress-loss monitoring in PSC girders

  • Huynh, Thanh-Canh;Kim, Jeong-Tae
    • Smart Structures and Systems
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    • 제17권6호
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    • pp.881-901
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    • 2016
  • In this study, a method to compensate the effect of temperature variation on impedance responses which are used for prestress-loss monitoring in prestressed concrete (PSC) girders is presented. Firstly, an impedance-based technique using a mountable lead-zirconate-titanate (PZT) interface is presented for prestress-loss monitoring in the local tendon-anchorage member. Secondly, a cross-correlation-based algorithm to compensate the effect of temperature variation in the impedance signatures is outlined. Thirdly, lab-scale experiments are performed on a PSC girder instrumented with a mountable PZT interface at the tendon-anchorage. A series of temperature variation and prestress-loss events are simulated for the lab-scale PSC girder. Finally, the feasibility of the proposed method is experimentally verified for prestress-loss monitoring in the PSC girder under temperature-varying conditions and prestress-loss events.

Relaxation of Singular Stress in Adhesively Bonded Joint at High Temperature

  • Lee, Sang Soon
    • 반도체디스플레이기술학회지
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    • 제17권1호
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    • pp.35-39
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    • 2018
  • This paper deals with the relaxation of singular stresses developed in an epoxy adhesive at high temperature. The interface stresses are analyzed using BEM. The adhesive employed in this study is an epoxy which can be cured at room temperature. The adhesive is assumed to be linearly viscoelastic. First, the distribution of the interface stresses developed in the adhesive layer under the uniform tensile stress has been calculated. The singular stress has been observed near the interface corner. Such singular stresses near the interface corner may cause epoxy layer separated from adherent. Second, the interfacial thermal stress has been investigated. The uniform temperature rise can relieve the stress level developed in the adhesive layer under the external loading, which can be viewed as an advantage of thermal loading. It is also obvious that temperature rise reduces the bonding strength of the adhesive layer. Experimental evaluation is required to assess a trade-off between the advantageous and deleterious effects of temperature.

Temperature Dependent Behavior of Thermal and Electrical Contacts during Resistance Spot Welding

  • Kim, E.
    • International Journal of Korean Welding Society
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    • 제2권1호
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    • pp.1-10
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    • 2002
  • The thermal contact conductance at different temperatures and with different electrode forces and zinc coating morphology was measured by monitoring the infrared emissions from the one dimensionally simulated contact heat transfer experiments. The contact heat transfer coefficients were presented as a function of the harmonic mean temperature of the two contacting surfaces. Using these contact heat transfer coefficients and experimentally measured temperature profiles, the electrical contact resistivities both for the faying interface and electrode-workpiece interface were deduced from the numerical analyses of the one dimension simulation welding. It was found that the average value of the contact heat transfer coefficients for the material with zinc coating (coating weight from 0 g/$mm^2$to 100 g/$mm^2$) ranges from 0.05 W/$mm^2$$^{\circ}C$ to 2.0 W/$mm^2$$^{\circ}C$ in the temperature range above 5$0^{\circ}C$ harmonic mean temperature of the two contacting surfaces. The electrical contact resistivity deduced from the one dimension simulation welding and numerical analyses showed that the ratio of electrical contact resistivity at the laying interface to the electrical contact resistivity at the electrode interface is smaller than one far both bare steel and zinc coated steel.

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열간단조시 계면열전달계수의 신뢰성 향상에 관한 연구 (A study on the improvement of interface heat transfer coefficient for hot forging)

  • 권진욱;이정환;이영선;권용남;배원병
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2004년도 추계학술대회논문집
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    • pp.226-229
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    • 2004
  • The temperature difference between die and workpiece has been frequently caused to various surface defects. The distribution and change for the temperature of forged part should be analyzed to prevent the generation of various defects related with the temperature. The surface temperature changes were mainly affected by the interface heat transfer coefficient. Therefore, the coefficient is necessary to predict the temperature changes of die and workpiece. The temperature calculated by FEM result might be well compared with the measured temperature. However, it is impossible to measure directly the temperature distribution of forged part. Therefore, the comparisons between measured temperature and predicted values are preformed by the microstructure in various temperature. Since the differences of microstructure could be obvious, the temperature criteria is set near by the incipient melting temperature. The predicted temperatures are well coincided with the measured values.

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분자동역학법을 이용한 기액계면현상에 관한 연구 (A Study on the Phenomena at a Liquid-Vapor Interface by the Molecular Dynamics Method)

  • 최현규;송치성;김혜민;이정혜;최순호
    • 대한기계학회논문집B
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    • 제29권1호
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    • pp.159-168
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    • 2005
  • In recent studies, it was reported that there existed the temperature discontinuity at a liquid-vapor interface in an equilibrium state. However, from the viewpoint of the classical thermodynamics, it is highly questionable result although considering that the experiments related with a boundary layer is very difficult due to the extremely thin thickness of it. To clarify whether the temperature discontinuity over a liquid-vapor interface really exists, the computer simulations were performed. From the simulation results, it could be concluded that the misconception in a temperature calculation might result in non-uniform temperature distributions over an interface under an equilibrium state.

Characterizations of Interface-state Density between Top Silicon and Buried Oxide on Nano-SOI Substrate by using Pseudo-MOSFETs

  • Cho, Won-Ju
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제5권2호
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    • pp.83-88
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    • 2005
  • The interface-states between the top silicon layer and buried oxide layer of nano-SOI substrate were developed. Also, the effects of thermal treatment processes on the interface-state distributions were investigated for the first time by using pseudo-MOSFETs. We found that the interface-state distributions were strongly influenced by the thermal treatment processes. The interface-states were generated by the rapid thermal annealing (RTA) process. Increasing the RTA temperature over $800^{\circ}C$, the interface-state density considerably increased. Especially, a peak of interface-states distribution that contributes a hump phenomenon of subthreshold curve in the inversion mode operation of pseudo-MOSFETs was observed at the conduction band side of the energy gap, hut it was not observed in the accumulation mode operation. On the other hand, the increased interface-state density by the RTA process was effectively reduced by the relatively low temperature annealing process in a conventional thermal annealing (CTA) process.

Effects of Condensation Heat Transfer Model in Calculation for KNGR Containment Pressure and Temperature Response

  • Eoh, Jae-Hyuk;Park, Shane;Jeun, Gyoo-Dong;Kim, Moo-Hwan
    • Nuclear Engineering and Technology
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    • 제33권2호
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    • pp.241-253
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    • 2001
  • Under severe accidents, the pressure and temperature response has an important role for the integrity of a nuclear power plant containment. The history of the pressure and temperature is characterized by the amount and state of steam/air mixture in a containment. Recently, the heat transfer rate to the structure surface is supposed to be increased by the wavy interface formed on condensate film. However, in the calculation by using CONTAIN code, the condensation heat transfer on a containment wall is calculated by assuming the smooth interface and has a tendency to be underestimated for safety. In order to obtain the best- estimate heat transfer calculation, we investigated the condensation heat transfer model in CONTAIN 1.2 code and adopted the new forced convection correlation which is considering wavy interface. By using the film tracking model in CONTAIN 1.2 code, the condensate film is treated to consider the effect of wavy interface. And also, it was carried out to investigate the effect of the different cell modelings - 5-cell and 10-cell modeling - for KNGR(Korean Next Generation Reactor) containment phenomena during a severe accident. The effect of wavy interface on condensate film appears to cause the decrease of peak temperature and pressure response . In order to obtain more adequate results, the proper cell modeling was required to consider the proper flow of steam/air mixture.

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임베디드 서모커플 센서 제조 및 미끄럼 마찰 계면온도 측정에 관한 실험적 연구 (Fabrication of Embedded Thermocouple Sensor and Experimental Study on Measurement of Interface Temperature for Dry Friction)

  • 장범택;임영헌;김석삼
    • Tribology and Lubricants
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    • 제29권6호
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    • pp.372-377
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    • 2013
  • This study investigated the interface temperatures for the sliding friction of three types of pins fabricated with thermocouple wires by the suction casting method. Optical microscopy was used to examine the surrounding material state at the bonding interface with the thermocouple wires. Friction tests were performed under dry sliding conditions against stainless steel 304 at nominal stresses of 1.42-4.25 MPa and sliding speeds of 0.5-1.25 m/s. Tribological data were collected using a custom-made pin-on-disk apparatus that measured the interface temperature and corresponding friction coefficient. Static tests were performed to demonstrate the functionality and reliability of the thermocouple wires-combined temperature sensor (TCTS). Each TCTS showed good linearity and sensitivity and very similar response times for the thermocouple and critical temperature during sliding friction.