• Title/Summary/Keyword: Interface resistance

Search Result 885, Processing Time 0.036 seconds

A Study on the Two-Dimensional Phase Change Problem in a Rectangular Mold with Air-Gap Resistance to Heat Flow (공기층 저항을 고려한 사각형 주형내에서의 2차원 상변화문제에 관한 연구)

  • 여문수;손병진;김우승
    • Transactions of the Korean Society of Mechanical Engineers
    • /
    • v.16 no.6
    • /
    • pp.1205-1215
    • /
    • 1992
  • The solidification rate is of special importance in determining the casting structures and properties. The heat transfer characteristics at the interface between the mold and the casting is one of the major factors that control the solidification rate. The thermal resistance exists due to the air-gap formation at the mold/casting interface during the freezing process. In this study two-dimensional Stefan problem with air-gap resistance in the rectangular mold is considered and the heat transfer characteristics is numerically examined by using the enthalpy method. The effects of the major parameters, such as mold geometry, thermal conductivity, heat transfer coefficient, and initial temperature of casting, on the thermal characteristics are investigated.

A Study on the Reduction the Thermal Contact Resistances at the Interface Between a Porous Metal Wick and Solid Heating Plate for a Circular Plate LHP (원판형 LHP 증발부의 소결 금속 윅에서의 접촉 저항에 관한 연구)

  • Jo, Jung-Rae;Choi, Jee-Hoon;Sung, Byung-Ho;Ki, Jae-Hyung;Ryoo, Seong-Ryoul;Kim, Chul-Ju
    • Proceedings of the KSME Conference
    • /
    • 2008.11b
    • /
    • pp.2357-2362
    • /
    • 2008
  • LHP is different from a conventional heat pipes in design and heat and fluid flow passages. The situations of the former is much complex than the latter. In LHPs, evaporation occurs at the contact interface between the heating plate and the porous wick, so some micro channels machined at the contact interface serve to let the vapor flow out of the evaporator. This complexity of contact geometry was known to cause a high resistance to heat flow. The present work was to study the problem of heat passage across the contact surface for LHPs and determine those values contact resistance. For two cases of contact structures, the thermal contact resistances were examined experimentally, one being obtained through mechanical contact under pressure and the other through sintered bonding. Nickel powder wick and copper plate were used for specimens. The result showed that a substantial reduction of contact resistance of an order of degree could be obtainable by sintered bonding.

  • PDF

Impact of Interface Charges on the Transient Characteristics of 4H-SiC DMOSFETs

  • Kang, Min-Seok;Bahng, Wook;Kim, Nam-Kyun;Ha, Jae-Geun;Koh, Jung-Hyuk;Koo, Sang-Mo
    • Journal of Electrical Engineering and Technology
    • /
    • v.7 no.2
    • /
    • pp.236-239
    • /
    • 2012
  • In this paper, we study the transient characteristics of 4H-SiC DMOSFETs with different interface charges to improve the turn-on rising time. A physics-based two-dimensional mixed device and circuit simulator was used to understand the relationship between the switching characteristics and the physical device structures. As the $SiO_2$/SiC interface charge increases, the current density is reduced and the switching time is increased, which is due primarily to the lowered channel mobility. The result of the switching performance is shown as a function of the gate-to-source capacitance and the channel resistance. The results show that the switching performance of the 4H-SiC DMOSFET is sensitive to the channel resistance that is affected by the interface charge variations, which suggests that it is essential to reduce the interface charge densities in order to improve the switching speed in 4H-SiC DMOSFETs.

InGaAs/InP HPT's with ITO Transparent Emitter Contacts (ITO 에미터 투명전극을 갖는 InGaAs/InP HPT의 연구)

  • Han, Kyo-Yong
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.20 no.3
    • /
    • pp.268-272
    • /
    • 2007
  • A fully integrable InP/InGaAs HPT with an ITO emitter contact was first fabricated by employing a $SiO_2$ passivation layer. The electrical and the optical characteristics of the HPT with a passivation layer were measured and compared with those of the HPT without a passivation layer. The only noticeable difference was the increased emitter series resistance of the HPT with a passivation layer. AES analysis was performed to explain the reason of the increased emitter series resistance. Results show that PECVD $SiO_2$ deposition and annealing processes cause the diffusion of oxygen to the interface and the depletion of tin at the interface, which may be responsible for the increase of the series resistance.

Analysis of Shear Resistance Characteristics in Pile-Soil Interface using Large-Scale Direct Shear Test (대형직접전단시험을 통한 말뚝과 지반 경계면의 전단특성 분석)

  • You, Seung-Kyong;Hong, Gigwon
    • Journal of the Korean Geosynthetics Society
    • /
    • v.21 no.3
    • /
    • pp.61-69
    • /
    • 2022
  • In this study, a large-scale direct shear test was performed to evaluate the shear characteristics of the pile-soil interface according to the fines content and confining pressure conditions as a reasonable evaluation method of the pullout resistance performance of pile considering the soil conditions. It was found that the shear stress was greatly generated under the conditions of high normal stress and low fines content. In addition, the maximum shear stress was found to be rather large under the conditions of the same normal stress and fines content, when pile surface had high roughness. The internal friction angle decreased at the pile-soil interface, when the fines content in the ground increased. On the other hand, the cohesion decreased under the condition of high fines content. And the internal friction angle and cohesion were large regardless of the fines content in the model ground, when the roughness of the pile surface was high.

Characteristics and Fabrication of ZTO/Ag/ ZTO Multilayer Transparent Conducting Electrode

  • Cho, Se-Hee;Yang, Jeong-Do;Wei, Chang-Hwan;Pandeyd, Rina;Byun, Dong-Jin;Choia, Won-Kook
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • 2013.02a
    • /
    • pp.339-339
    • /
    • 2013
  • We study on the optical and electrical properties of indium-free ZTO(ZnSnO)/Ag/ZTO (ZAZ) multilayer electrodes for the low-cost transparent electrode. In the first step, each single layer was deposited using rf magnetron in-line sputter with various working pressure based on $O_2$/$Ar+O_2$ ratio (0~3%) and power at room temperature. Secondly, we studied the optical and electrical properties by analyzing the refractive index, extinction coefficient, transmittance and resistivity of each layer. Finally, we optimized the thickness of each layer using macleod simulation program based on the analyzed optical properties and fabricated the multilayer electrode. As a result, We achieved a low sheet resistance of $11{\Omega}$/sq and anaverage transmittance of 80% in the visible region of light (380~780 nm). This indicates that indium-free ZAZ multilayer electrode is a promising low-cost and low-temperature processing electrode scheme.

  • PDF

Temperature Dependent Behavior of Thermal and Electrical Contacts during Resistance Spot Welding

  • Kim, E.
    • International Journal of Korean Welding Society
    • /
    • v.2 no.1
    • /
    • pp.1-10
    • /
    • 2002
  • The thermal contact conductance at different temperatures and with different electrode forces and zinc coating morphology was measured by monitoring the infrared emissions from the one dimensionally simulated contact heat transfer experiments. The contact heat transfer coefficients were presented as a function of the harmonic mean temperature of the two contacting surfaces. Using these contact heat transfer coefficients and experimentally measured temperature profiles, the electrical contact resistivities both for the faying interface and electrode-workpiece interface were deduced from the numerical analyses of the one dimension simulation welding. It was found that the average value of the contact heat transfer coefficients for the material with zinc coating (coating weight from 0 g/$mm^2$to 100 g/$mm^2$) ranges from 0.05 W/$mm^2$$^{\circ}C$ to 2.0 W/$mm^2$$^{\circ}C$ in the temperature range above 5$0^{\circ}C$ harmonic mean temperature of the two contacting surfaces. The electrical contact resistivity deduced from the one dimension simulation welding and numerical analyses showed that the ratio of electrical contact resistivity at the laying interface to the electrical contact resistivity at the electrode interface is smaller than one far both bare steel and zinc coated steel.

  • PDF

High Temperature Fiber Fragmentation Characteristics of SiC Single-Fiber Composite With Titanium Matrices

  • Matikas, Theodore E.
    • Advanced Composite Materials
    • /
    • v.17 no.1
    • /
    • pp.75-87
    • /
    • 2008
  • Aerospace structural applications, along with high performance marine and automotive applications, require high-strength efficiency, which can be achieved using metal matrix composites (MMCs). Rotating components, such as jet-engine blades and gas turbine parts, require materials that maximize strength efficiency and metallurgical stability at elevated temperatures. Titanium matrix composites (TMCs) are well suited in such applications, since they offer an enhanced resistance to temperature effects as well as corrosion resistance, in addition to optimum strength efficiency. The overall behavior of the composite system largly depends on the properties of the interface between fiber and matrix. Characterization of the fiber.matrix interface at operating temperatures is therefore essential for the developemt of these materials. The fiber fragmentation test shows good reproducibility of results in determining interface properties. This paper deals with the evaluation of fiber fragmentation characteristics in TMCs at elevated temperature and the results are compared with tests at ambient temperature. It was observed that tensile testing at $650^{\circ}C$ of single-fiber TMCs led to limited fiber fragmentation behavior. This indicates that the load transfer from the matrix to the fiber occurs due to interfacial friction, arising predominantly from mechanical clamping of the fiber by radial compressive residual and Poisson stresses. The present work also demonstrates that composite processing conditions can significantly affect the nature of the fiber.matrix interface and the resulting fragmentation of the fiber.

Shear transfer mechanism in connections involving concrete filled steel columns under shear forces

  • De Nardin, Silvana;El Debs, Ana Lucia H.C.
    • Steel and Composite Structures
    • /
    • v.28 no.4
    • /
    • pp.449-460
    • /
    • 2018
  • This paper reports the experimental results of three through bolt beam-column connections under pure shear forces using modified push-out tests. The investigated specimens include extended end-plates and six through-bolts connecting square concrete-filled steel tubular column (S-CFST) to steel beams. The main goal of this study is to investigate if and how the mechanical shear connectors, such as steel angles and stud bolts, contribute to the shear transfer mechanisms in the steel-concrete interface of the composite column. The contribution of shear studs and steel angles to improve the shear resistance of steel-concrete interface in through-bolt connections was investigated using tests. The results showed that their contribution is not significant when the beam-column connection is included in the push-out tests. The specimens failed by pure shear of the long bolts, and the ultimate load can be predicted using the shear resistance of the bolts under shear forces. The predicted values of load allowed obtaining a good agreement with the tests results.

Comparison of Electrical Properties between Sputter Deposited Au and Cu Schottky Contacts to n-type Ge

  • Kim, Hogyoung;Kim, Min Kyung;Kim, Yeon Jin
    • Korean Journal of Materials Research
    • /
    • v.26 no.10
    • /
    • pp.556-560
    • /
    • 2016
  • Using current-voltage (I-V) and capacitance-voltage (C-V) measurements, the electrical properties of Au and Cu Schottky contacts to n-Ge were comparatively investigated. Lower values of barrier height, ideality factor and series resistance were obtained for the Au contact as compared to the Cu contact. The values of capacitance showed strong dependence on the bias voltage and the frequency. The presence of an inversion layer at the interface might reduce the intercept voltage at the voltage axis, lowering the barrier height for C-V measurements, especially at lower frequencies. In addition, a higher interface state density was observed for the Au contact. The generation of sputter deposition-induced defects might occur more severely for the Au contact; these defects affected both the I-V and C-V characteristics.