• Title/Summary/Keyword: Interface engineering

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Effect of Interface Hole Shape on Dynamic Interface Crack propagation (계면에 존재하는 결함의 모양이 동적 계면균열전파에 미치는 영향)

  • 이억섭;윤해룡;조운기;황시원
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2000.11a
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    • pp.429-432
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    • 2000
  • The dynamic photoelasticity with the aid of Cranz-Shardin type high speed camera system is utilized to record the dynamically propagating behavior of the interface crack. This paper investigates the effects of the hole (existed along the path of the crack propagation) shape on the dynamic interface crack propagation behavior by comparing the experimental isochromatic fringes to the theoretical stress fields.

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Interface Development for the Point-of-care device based on SOPC

  • Son, Hong-Bum;Song, Sung-Gun;Jung, Jae-Wook;Lee, Chang-Su;Park, Seong-Mo
    • Journal of Information Processing Systems
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    • v.3 no.1
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    • pp.16-20
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    • 2007
  • This paper describes the development of the sensor interface and driver program for a point of care (POC) device. The proposed pac device comprises an ARM9 embedded processor and eight-channel sensor input to measure various bio-signals. It features a user-friendly interface using a full-color TFT-LCD and touch-screen, and a bluetooth wireless communication module. The proposed device is based on the system on a programmable chip (SOPC). We use Altera's Excalibur device, which has an ARM9 and FPGA area on a chip, as a test bed for the development of interface hardware and driver software.

Behaviour of interfacial layer along granular soil-structure interfaces

  • Huang, Wenxiong;Bauer, Erich;Sloan, Scott W.
    • Structural Engineering and Mechanics
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    • v.15 no.3
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    • pp.315-329
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    • 2003
  • As shear occurs along a soil-structure interface, a localized zone with a thickness of several grain diameters will develop in soil along the interface, forming an interfacial layer. In this paper, the behaviour of a soil-structure interface is studied numerically by modelling the plane shear of a granular layer bounded by rigid plates. The mechanical behaviour of the granular material is described with a micro-polar hypoplastic continuum model. Numerical results are presented to show the development of shear localization along the interface for shearing under conditions of constant normal pressure and constant volume, respectively. Evolution of the resistance on the surface of the bounding plate is considered with respect to the influences of grain rotation.

Transport Analysis of olefins & nitrogen through PDMS membranes

  • Kim, Jeong-Hoon;Shin, Hyo-Jin;Choi, Seung-Hak;Park, In-Jun;Lee, Soo-Bok
    • Proceedings of the Membrane Society of Korea Conference
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    • 2004.05a
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    • pp.195-198
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    • 2004
  • Annually, 60 millions tons of polyolefins including polyethylene and polypropylene, etc. are produced in the world. During the manufacturing process, 1-2wt% of olefin gases of total feedstock remains unreacted and incinerated into air. Because of high cost of olefins and hazardous emission of carbon dioxide and toxic gases in incineration process, it is of important to recover them efficiently.(omitted)

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Characterization of Interface in Hybrid Composites (혼성복합재료의 계면 특성 분석)

  • Ha, Chang-Sik;Ahn, Ki Youl;Cho, Won-Jei
    • Journal of Adhesion and Interface
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    • v.1 no.1
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    • pp.47-55
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    • 2000
  • In this article, the characterization of the interface of hybrid composites was discussed. Interfacial interaction in organic/inorganic hybrid composites, especially silica-containing hybrids can be characterized by fluorescence spectroscopy, small angle X-ray scattering (SAXS), scanning electron microscopy (SEM), atomic force microscopy (AFM), and $^{29}Si$ NMR spectroscopy measurements.

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Numerical Simulation of Electro-Mechanical Impedance Response in Cable-Anchor Connection Interlace

  • Nguyen, Khac-Duy;Kim, Jeong-Tae
    • Journal of the Korean Society for Nondestructive Testing
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    • v.31 no.1
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    • pp.11-23
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    • 2011
  • In this study, a finite element(FE) analysis on electro-mechanical impedance response of cable-anchor connection interface under various anchor force is presented. In order to achieve the objective, the following approaches are implemented. Firstly, an interface washer coupled with piezoelectric(PZT) material is designed for monitoring cable-force loss. The interface washer is a small aluminum plate on which a PZT patch is surface-bonded. Cable-force loss could be monitored by installing the interface washer between the anchor plate and the anchorage of cable-anchor connection and examining the changes of impedance of the interface washer. Secondly, a FE model for cable-anchor connection is established to examine the effect of cable-force on impedance response of interface washer. Also, the effects of geometrical and material properties of the interface washer on impedance responses under various cable-forces are investigated. Finally, validation of the FE analysis is experimentally evaluated by a lab-scale cable-anchor connection.

MPEG-U-based Advanced User Interaction Interface Using Hand Posture Recognition

  • Han, Gukhee;Choi, Haechul
    • IEIE Transactions on Smart Processing and Computing
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    • v.5 no.4
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    • pp.267-273
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    • 2016
  • Hand posture recognition is an important technique to enable a natural and familiar interface in the human-computer interaction (HCI) field. This paper introduces a hand posture recognition method using a depth camera. Moreover, the hand posture recognition method is incorporated with the Moving Picture Experts Group Rich Media User Interface (MPEG-U) Advanced User Interaction (AUI) Interface (MPEG-U part 2), which can provide a natural interface on a variety of devices. The proposed method initially detects positions and lengths of all fingers opened, and then recognizes the hand posture from the pose of one or two hands, as well as the number of fingers folded when a user presents a gesture representing a pattern in the AUI data format specified in MPEG-U part 2. The AUI interface represents a user's hand posture in the compliant MPEG-U schema structure. Experimental results demonstrate the performance of the hand posture recognition system and verified that the AUI interface is compatible with the MPEG-U standard.

Stress intensity factors for an interface crack between an epoxy and aluminium composite plate

  • Itou, S.
    • Structural Engineering and Mechanics
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    • v.26 no.1
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    • pp.99-109
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    • 2007
  • A cracked composite specimen, comprised of an epoxy and an aluminium plate, was fractured under a tensile load. In this paper, two crack configurations were investigated. The first was an artificial center crack positioned in the epoxy plate parallel to the material interface. The other was for two edge cracks in the epoxy plate, again, parallel to the interface. A tensile test was carried out by gradually increasing the applied load and it was verified that the cracks always moved suddenly in an outward direction from the interface. The d/a ratio was gradually reduced to zero, and it was confirmed that the maximum stress intensity factor value for the artificial center crack, $K_{{\theta}{\theta}}^{max}$, approached that of an artificial interface crack,$K_{{\theta}{\theta}}^{ifc\;max}$ (where: 2a is the crack length and d is the offset between the crack and interface). The same phenomenon was also verified for the edge cracks. Specifically, when the offset, d, was reduced to zero, the maximum stress intensity factor value, $K_{{\theta}{\theta}}^{max}$, approached that of an artificial interface edge crack.

Overview of Interface Engineering for Organic Solar Cells (유기태양전지 계면 기술 동향)

  • Kim, Gi-Hwan
    • Journal of Adhesion and Interface
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    • v.22 no.4
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    • pp.113-117
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    • 2021
  • Among the next-generation solar cells, organic solar cells using organic materials are a key energy production device for the future energy generation devices, and have recently been receiving a lot of attention with rapid growth. To improve the efficiency of organic solar cells, interfacial engineering technology has been widely applied. In particular, it is widely used to improve device efficiency through energy level control by using interface engineering on the anode and cathode, which are positive electrodes, and to ultimately utilize interface engineering for tandem organic solar cells to derive excellent electrical and optical performance to produce high-performance devices. In this article, we will summarize and introduce recent research trends on interfacial engineering used in organic solar cells, and discuss the method of manufacturing high-performance organic solar cells.