• 한국재료학회지
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• 제25권10호
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• pp.571-576
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• 2015

The effects of coating thickness on the delamination and fracture behavior of thermal barrier coating (TBC) systems were investigated with cyclic flame thermal fatigue (FTF) and thermal shock (TS) tests. The top and bond coats of the TBCs were prepared by electron beam-physical vapor deposition and low pressure plasma spray methods, respectively, with a thickness ratio of 2:1 in the top and bond coats. The thicknesses of the top coat were 200 and $500{\mu}m$, and those of the bond coat were 100 and $250{\mu}m$. FTF tests were performed until 1140 cycles at a surface temperature of $1100^{\circ}C$ for a dwell time of 5 min. TS tests were also done until more than 50 % delamination or 1140 cycles with a dwell time of 60 min. After the FTF for 1140 cycles, the interface microstructures of each TBC exhibited a sound condition without cracking or delamination. In the TS, the TBCs of 200 and $500{\mu}m$ were fully delaminated (> 50 %) within 171 and 440 cycles, respectively. These results enabled us to control the thickness of TBC systems and to propose an efficient coating in protecting the substrate in cyclic thermal exposure environments.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2000년도 춘계학술발표대회 논문집
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• pp.175-183
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• 2000

The internal residual stresses within the multilayered structure with shan interface induced by the difference in thermal expansion coefficient between the materials of adjacent layers often provide the source of failure such as delamination of interfaces and etc. Recent development of the multilayered structure with functionally graded interface would be the solution to prevent this kind of failure. However a systematic thermo-mechanical analysis is needed fur the customized structural design of multilayered structure. In this study, theoretical model for the thermo-mechanical analysis is developed for multilayered structures of the Al-$SiC_p$ functionally graded composite for electronic packaging. The evolution of curvature and internal stresses in response to temperature variations is presented for the different combinations of geometry. The resultant analytical solutions are used for the optimal design of the multilayered structures with functionally graded interface as well as with sharp interface.

• 대한기계학회논문집A
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• 제28권6호
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• pp.709-716
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• 2004

In order to prevent the interface delamination of an plastic IC package in the infrared (IR) soldering process, we tried to reduce stress by parameterization, sensitivity analysis and unconstraint optimization. The design variables of dimensions and material properties are determined among all the possible variables from the parametric study. Their optimized values are determined by applying the unconstraint optimization to the parameterized IC package. The maximum von-Mises stress value decreases greatly by optimum design.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2009년도 춘계학술대회 논문집
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• pp.349-352
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• 2009

In this study, the relation between the performance degradation of SOFC single cell and the increase of polarization resistance for the cathode is investigated. $Pr_{0.3}Sr_{0.7}Co_{0.3}Fe_{0.7}O_3$(PSCF3737, $19.4{\times}10^{-6}K^{-1}$) and $Gd_{0.1}Ce_{0.9}O_2$ (CGO91, $12{\times}10^{-6}K^{-1}$) are used as a cathode and an electrolyte, respectively. The polarization resistance of cathode is increased due to the delamination caused by thermal expansion coefficient difference. The voltage drop with 10%/1000h decline rate occurs during long-term, when the interface between the cathode and the electrolyte is delaminated due to TEC difference.

• 한국콘크리트학회:학술대회논문집
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• 한국콘크리트학회 2005년도 봄학술 발표회 논문집(I)
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• pp.243-246
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• 2005

This paper focuses on the flexural behavior of RC beams externally reinforced using Carbon Fiber Reinforced Plastics plates (CFRP). A non-linear finite element (FE) analysis is proposed in order to complete the experimental analysis of the flexural behaviour of the beams. This paper is a part of a complete program aiming to set up design formulate to predict the strength of CFRP strengthened beams, particularly when premature failure through plates-end shear or concrete cover delamination occurs. An elasto-plastic behaviour is assumed for reinforced concrete and interface elements are used to model the bond and slip.

• 대한치과기공학회지
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• 제33권1호
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• pp.15-23
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• 2011

Purpose: Thy yttria tetragonal zirconia polycrystalline(Y-TZP) is a good structural ceramic for dental restoration. But it have a problem that delamination of veneering ceramic from the Y-TZP core materials. The problem generally occur at the interface, thus this study was conducted to evaluate the interface of Y-TZP using scanning electron microscopy(SEM). Methods: To investigate this aspect, high-resolution SEM observations were made of polished and etched (HF content gel) cross-sections of the interface area. Dry and moist veneering porcelain powders were built up on the zirconia base. Results: The extent of this surface faceting is dependent upon the moisture content of the porcelain powder and the firing temperature. More moisture and higher final heating temperature accelerates the observed faceting of the Y-TZP grains at the interface to the veneering ceramic. Conclusion: These changes of the Y-TZP grains indicate that destabilization of the tetragonal phase of zirconia occurs at the interface during veneering with ceramic. It may result in a reduction of the stability of the zirconia and interface.

• 마이크로전자및패키징학회지
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• 제18권2호
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• pp.29-33
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• 2011

솔더와 PCB Cu 패드와 솔더 경계면에서 발생하는 수직응력과 수평응력을 분석하여 PGA 패키지의 신뢰성 향상을 위한 리드핀의 형상설계에 대한 연구를 수행하였다. 이와 같은 연구를 위해 리드핀의 $20^{\circ}$ 각도 굽힘 변형과 50 ${\mu}m$ 인장조건에서 4인자 3수준의 다구찌 최적설계와 유한요소해석을 수행하였다. 해석결과에 의하면 리드핀의 헤드곡면과 PCB Cu 패드가 접촉하는 폭(d2)이 솔더에서 발생하는 응력감소에 가장 큰 영향을 미치는 인자로 계산되었다. 또한, 다 구찌법의 파라메타 설계에 의해 기존 리드핀 형상모델에 비해 약 18.7%의 등가 von Mises 응력이 감소하는 형상을 도출하였다. 한편, 최대 수직응력이 발생하는 위치가 PCB의 Cu 패드와 솔더의 외곽이 접촉하는 위치이고 최대 수평응력이 발생하는 위치가 SR 층과 솔더의 외곽표면이 접촉하는 위치임을 파악하여, PGA 패키지의 박리 불량은 솔더의 외곽부터 발생하여 내부로 진행될 것으로 예측되었다.

• 대한금속재료학회지
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• 제47권9호
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• pp.573-579
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• 2009

Titanium/aluminum/stainless steel(Ti/Al/STS) clad materials have received much attention due to their high specific strength and corrosion-resisting properties. However, it is difficult to fabricate these materials, because titanium oxide is easily formed on the titanium surface during heat treatment. The aim of the present study is to derive optimized cladding conditions and thereupon obtain the stable quality of Ti/Al/STS clad materials. Ti sheets were prepared with and without pre-heat treatment and Ti/Al/STS clad materials were then fabricated by cold rolling and a post-heat treatment process. Microstructure of the Ti/Al and STS/Al interfaces was observed using a Scanning Electron Microscope(SEM) and an Energy Dispersed X-ray Analyser(EDX) in order to investigate the effects of Ti pre-heat treatment on the bond properties of Ti/Al/STS clad materials. Diffusion bonding was observed at both the Ti/Al and STS/Al interfaces. The bonding force of the clad material with non-heat treated Ti was higher than that with pre-heat treated Ti before the cladding process. The bonding force decreased rapidly beyond $400^{\circ}C$, because the formed Ti oxide inhibited the joining process between Ti and Al. Bonding forces of STS/Al were lower than those of Ti/Al, because brittle $Fe_3Al$, $Al_3Fe$ intermetallic compounds were formed at the interface of STS/Al during the cladding process. In addition, delamination of the clad material with pre-heat treated Ti was observed at the Ti/Al interface after a cupping test.

• 콘크리트학회지
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• 제9권3호
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• pp.137-147
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• 1997

신구콘크리트 계면(접합부)의 전단강도 측정을 목적으로 보시험체를 사용한 정하중 및 피로하중의 재하실험이 수행되었다. 총 13개의 시험체중에서 정적재하실험을 통하여 5개 시험체의 전단강도를 측정하였고, 8개의 시험체는 2,000,000회 또는 3,000,000회의 반복하중을 가력한 후 전단강도를 측정하였다. 실험변수는 접합부거칠기, 전단보강철근 및 시구콘크리트간 부착력의 유무이었다. 정적재하실험에서, 접합부가 거칠면서 콘크리트간 부착력이 존재한 시험체의 경우, 평균전단강도는 $61kgf/cm^2$이었다. 유사한 조건의 시험체의 3,000,000회의 전단하중을 가력한 피로하중실험에서 접착부의 열화현상은 나타나지 않았다. 이 때 반복가력된 최대전단응력은 $20kgf/cm^2$으로 전단강도의 약 1/3수준이었다. 접합부가 거칠게 처리되지 않은 시험체와 접합부는 거칠지만 콘크리트간 부착력이 인위적으로 제거된 시험체의 경우에는 전단보강철근을 사용하여도 피로하중에 의한 접합부의 열화현상이 나타났다.

• 반도체디스플레이기술학회지
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• 제14권1호
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• pp.1-5
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• 2015

This paper deals with the residual stresses developed in an epoxy film deposited on Si wafer. First, chemically induced residual stresses due to the volumetric shrinkage in cross-linking resins during polymerization are treated. The curvature measurement method is employed to investigate the residual stresses. Then, thermally induced stresses are investigated along the interface between the epoxy film and Si wafer. The boundary element method is employed to investigate the whole stresses in the film. The singular stress is observed near the interface corner. Such residual stresses are large enough to initiate interface delamination to relieve the residual stresses.