• Title/Summary/Keyword: Interface Edge

Search Result 245, Processing Time 0.031 seconds

Effective Hand Region Detection for Natural Augmented Reality Interface (자연스러운 증강현실 인터페이스를 위한 효과적인 손 검출)

  • Choi, Jun-Yeong;Han, Jae-Hyek;Seo, Byung-Kuk;Park, Jong-Il
    • Proceedings of the Korean Society of Broadcast Engineers Conference
    • /
    • 2009.11a
    • /
    • pp.367-370
    • /
    • 2009
  • 증강현실에서 자연스럽고 인간 친화적인 인터페이스로는 비전 기반의 손동작을 이용한 인터페이스가 가장 각광받고 있다. 그러나 복잡한 배경에서 손을 찾고 손동작을 인식하는 것은 여전히 어려운 문제로 남아 있다. 특히, 배경에 살색을 가진 물체가 많이 있다면 이 문제는 더욱 해결하기 어려워진다. 이 논문은 손 영역을 정확하게 검출 하는 방법에 초점이 맞춰져 있으며, 효과적인 방법을 제안한다. 제안하는 방법은 기본적으로 손과 팔을 포함하는 영역이 다른 피부색 영역과 다른 밝기를 가지고 있다고 가정한다. 구체적으로 제안하는 방법은 밝기 차이를 이용하여 피부색 영역으로부터 손과 팔을 포함하는 영역을 검출한다. 본 논문에서는 밝기 차이를 구분하는 방법으로 �o지(edge) 영상을 이용한다. 그 다음 손과 팔의 기하학적 특징을 이용하여 손목을 찾고 손을 포함하는 사각형 영역을 검출한다. 마지막으로 사각형 영역으로부터 손을 찾아낸다. 손을 찾는 방법 또한 약간 다르지만 비슷한 밝기 기반의 추출 방법을 사용한다. 우리는 간단한 손동작 기반의 증강현실 인터페이스를 구현함으로써 제안한 방법의 효용성을 검증한다.

  • PDF

Automatic Collecting of Natural Language Expressions of Relations for Natural Language Interface (자연어 인터페이스를 위한 관계에 대한 자연어 표현 자동 수집 방법)

  • Han, Yong-Jin;Park, Se-Young;Park, Seong-Bae
    • Proceedings of the Korean Information Science Society Conference
    • /
    • 2011.06a
    • /
    • pp.221-224
    • /
    • 2011
  • 관계에 대한 다양한 자연어 표현을 다루는 것은 구조 정보에 대한 자연어 질의 인터페이스 연구의 중요한 문제 중에 하나이다. 이러한 문제를 해결하기 위한 기존의 연구들은 자연어 질의 인터페이스를 대상 분야에 적합하게 구축하기 위한 수작업에 의존하였다. 이러한 접근은 소규모 구조 정보에 대한 자연어 질의 인터페이스 구축 시 효율적으로 적용될 수 있다. 하지만 최근에는 RDF와 OWL과 같은 그래프 구조 정보가 다양한 분야에서 대량으로 생성되고 있다. 수작업에 의존하는 접근을 통해 이러한 대량의 그래프 구조 정보에 대한 자연어 인터페이스를 구축하기에는 어려움이 있다. 본 논문은 자연어 인터페이스에 대한 자연어 표현의 다양성 문제를 해결하기 위해 자동으로 관계에 대한 자연어 표현을 수집하는 방법을 제안한다. 그래프 구조 정보에서 관계는 두 객체를 연결하는 유일한 에지(edge)로 표현된다. 제안한 방법은 주어진 에지로 연결되는 서로 다른 객체 쌍을 말뭉치(corpus)에서 검색하고 검색된 객체 쌍 주변에서 빈번하게 등장하는 자연어 표현을 수집한다. 자동으로 수집한 자연어 질의 표현을 자연어 인터페이스에 적용한 결과 수작업에 의존하는 기존 연구들과 비교할 만한 실험 결과를 보였다.

CHARACTERIZATION AND ANALYSIS OF SHEAR TEST WITH TESTING CONDITIONS ON BGA PACKAGE

  • Koo, Ja-Myeong;Kim, Dae-Up;Jung, Seung-Boo
    • Proceedings of the KWS Conference
    • /
    • 2002.10a
    • /
    • pp.463-468
    • /
    • 2002
  • This study investigates the variations of shear force, displacement, and fracture surface with the shear speed and the number of reflows. The experimental data of shear tests indicate that the shear force increases as increasing the number of reflows and the shear speed due to the formation of a kind of intermetallic compound, Ni$_3$Sn$_4$, on Au/Ni/Cu pad, and the work-hardening. However, general trends show that the shear force decreases due to increasing the thickness of the intermetallic compound over 4x reflow. It is observed that the intermetallic compound which is formed between solder and pad increases according to increasing the number of reflows, and the growth rate of the intermetallic compound at central region on the interface is faster than one at edge part. The general tendencies of shear force and displacement with different shear speeds are almost identical as an increase of the number of reflows.

  • PDF

Computer Simulations on the Thermal Behaviors of a Friction Pad in High-Speed Train Disk Brakes

  • Kim, Chung Kyun
    • KSTLE International Journal
    • /
    • v.1 no.2
    • /
    • pp.95-100
    • /
    • 2000
  • The thermal behaviors of disk-pad braking models has been analyzed for a high-speed train brake system using the coupled thermal-mechanical analysis technique. The temperature distribution, thermal distortion, and contact stress in the disk-pads contact model have been investigated as functions of the convective heat transfer rate. The FEM results indicate that multiple spot type pads show more stabilized thermal characteristics compared with those of the flat type pads for the increased convective heat transfer rate. The maximum contact stress for a friction pad loaded against a rubbing disk was occurred on the edge of the pad at the disk-pad interface.

  • PDF

A Study on the Channel-Width Dependent Hot-Carrier Degradation of nMOSFET with STI (STI구조를 갖는 nMOSFET의 채널 너비에 따른 Hot-Carrier 열화 현상에 관한 연구)

  • 이성원;신형순
    • Journal of the Institute of Electronics Engineers of Korea SD
    • /
    • v.40 no.9
    • /
    • pp.638-643
    • /
    • 2003
  • Channel width dependence of hot-carrier effect in nMOSFET with shallow trench isolation is analyzed. $I_{sub}$- $V_{G}$ and $\Delta$ $I_{ㅇ}$ measurement data show that MOSFETs with narrow channel-width are more susceptible to the hot-carrier degradation than MOSFETs with wide channel-width. By analysing $I_{sub}$/ $I_{D}$, linear $I_{D}$- $V_{G}$ characteristics, thicker oxide-thickness at the STI edge is identified as the reason for the channel-width dependent hot-carrier degradation. Using the charge-pumping method, $N_{it}$ generation due to the drain avalanche hot-carrier (DAHC) and channel hot-electron (CHE) stress are compared. are compared.

New degradation mechanism of GaAs HBT induced by Hot carriers (핫 캐리어에 의한 GaAs HBT의 새로운 열화 메카니즘)

  • 권재훈;김도현;송정근
    • Journal of the Korean Institute of Telematics and Electronics D
    • /
    • v.34D no.11
    • /
    • pp.30-36
    • /
    • 1997
  • AlGaAs/GaAs HBTs are developed well enough to be commercialized as an active device in optical transmission system, but there remains the unanswered questions about reliability. In this paper we applied the reverse constant current stress at the high voltage in avalanche region for a long time to find out a new degradation mechanism of junctrion I-V. The unction off-set voltage at which the current vanishes to zero was shifted to the negative direction of applied bias due to the increment of leakage current as the stress time increases. It was identified that the degradation was induced by the hot carriers which were generated at space charge region and trapped at the interface between GaAs base and the passivation nitride enhancing the electric field across the nesa edge.

  • PDF

Singular Stress Field Analysis and Strength Evaluation in Ceramic/Metal Joints (세라믹/금속접합제의 응력특이장 해석 및 강도평가)

  • 박영철;한근조;허선철;강재욱
    • Proceedings of the Korean Society of Precision Engineering Conference
    • /
    • 1997.04a
    • /
    • pp.470-474
    • /
    • 1997
  • Since the ceramic/metal joints is joined at high temperature, the residual stress will develop during when cooled from bonding temperature due to remarkable difference of thermal expansion coefficient between creamic and metal. Moreover, the edge of jointed interface makes singular stress field in the ceramic/metal joints and this singular stress field much influences on the strength of joints. In this study, The influence of residual stress, mechanical load and repeat thermal sysle was estimated in the ceramic/metal joints. According to this influence, the change of singular stress field was analyed and then strength test, X-ray measurement are performed.

  • PDF

A VLSI implementation of image processor for facsimile and digital copier (팩시밀리 및 디지털 복사기를 위한 고속 영상 처리기의 VLSI구현)

  • 박창대;정영훈;김형수;김진수;권오준;홍기상;장동구;박기용;김윤수
    • Journal of the Korean Institute of Telematics and Electronics S
    • /
    • v.35S no.1
    • /
    • pp.105-113
    • /
    • 1998
  • A new image processor is implemented for high-speed digital copiers and facsimiles. The imgage processor performs CCD and CIS interface, pre-processing, enlargement andreduction of gray level image, and various halftoning algorithms. Implemented halftoning algorithms are simple thresholding, fuzzy based mixed mode thresholding, dithering, and edge enhanced error diffusion. The result of binarization is transferred to a printer with serial or paralel output ports. Line by line pipelined data prodessing architecture is employed with time sharing access of the external memory. In receiving mode, it converts the resolution of received binary image for compatibility with conventional facsimile. In copy mode, a line of A3 paper with 400 dpi is processed with in 2.5 ms. The prototype of image processor was implemented usig Laser Programmable Gate Array (LPGA) with 0.8.mu.m technology.

  • PDF

Prediction of crack propagation path in IC package by BEM (경계요소법에 의한 반도체 패키지의 균열진전경로 예측)

  • Song, Chun-Ho;Chung, Nam-Yong
    • Proceedings of the KSME Conference
    • /
    • 2001.06a
    • /
    • pp.286-291
    • /
    • 2001
  • Applications of bonded dissimilar materials such as IC package, ceramic/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edges in bonded joints of dissimilar materials. In orer to understand the package crack emanating from the edge of Die pad and Resin, fracture mechanics of bonded dissimilar materials and material properties are obtained. In this paper, the thermal stress and its singularity index for the IC package were analyzed using 2-dimensional elastic boundary element method. Crack propagation angle and path by thermal stress were numerically simulated with boundary element method.

  • PDF

An Implementation of Smooth laser image using universal joint (유니버셜 관절을 이용한 유연 레이저 영상 구현)

  • 김태강;이건영
    • 제어로봇시스템학회:학술대회논문집
    • /
    • 2000.10a
    • /
    • pp.347-347
    • /
    • 2000
  • Nowadays, the Laser image is used to realize multi-media show for events, an advertising media and 3D simulation, realization of video image and so on. It is a hot issue to realize the laser image like computer graphic image. The image used in laser projector is vector graphic image that is described by linking point to point. A computer makes this continuous vector graphic images so that the image shows as an animation. A control signal converted by a computer makes the laser projector draw image. Two motors and universal joint are used to realize 2D laser image in this study. Developing a controller applied Look-ahead algorithm and software to interface with personal computer, This study is the chief aim of improving difference of moving velocity that is appeared from edge of vector graphic image and disparity of graphic density.

  • PDF