• Journal of Welding and Joining
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• 제15권4호
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• pp.90-98
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• 1997

A copper-tungsten sintered alloy(Cu-W) has been friction welded to a tough pitch copper in order to investigate the effect of friction pressure on bonding strength and a charicteristic of fracture. The tensile strength of the friction welded joint was increased up to 90% of the Cu base metal under the condition of friction time 1.2 sec, friction pressure 4.5kgf/$\textrm{mm}^2$ and upset pressure 10kgf/$\textrm{mm}^2$. From the results of fracture surface analysis, the increase of friction pressure could remarkably decrease the force and the time to be normally acted on weld interface. The W particles which were included in the plastic zone of Cu side could induce fracture adjacent to the weld interface because their existance in Cu induces a decrease in available section area and an increase in notch effect. Therefore, the tensile strength was decreased at high friction pressure (6kgf/$\textrm{mm}^2$) because the destruction of W was increased by an increase in mechanical force and crack was formed at weld interface.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회B
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• pp.2357-2362
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• 2008

LHP is different from a conventional heat pipes in design and heat and fluid flow passages. The situations of the former is much complex than the latter. In LHPs, evaporation occurs at the contact interface between the heating plate and the porous wick, so some micro channels machined at the contact interface serve to let the vapor flow out of the evaporator. This complexity of contact geometry was known to cause a high resistance to heat flow. The present work was to study the problem of heat passage across the contact surface for LHPs and determine those values contact resistance. For two cases of contact structures, the thermal contact resistances were examined experimentally, one being obtained through mechanical contact under pressure and the other through sintered bonding. Nickel powder wick and copper plate were used for specimens. The result showed that a substantial reduction of contact resistance of an order of degree could be obtainable by sintered bonding.

• 한국안전학회지
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• 제34권4호
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• pp.76-84
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• 2019

The precast pannels are used as formwork in Half-depth precast deck systems. Therefore, it has many advantages, including safe and convenient construction and reduced construction period compared to cast-in-place construction method. In half-depth precast deck systems, the bonding of precast pannels to cast-in place concrete is very important. To enhance the performance of half-depth precast deck system, it is necessary to improve the composite efficiency of the interface or increase the stiffness of the precast pannel to reduce deformation or stress on the interface. In this study, a flexural test of half-depth precast deck system was performed, in which the shear connecting reinforcement was applied to increase the bonding performance at the interface, and the rib shape precast panels were applied to improve stiffness. In addition, the safety and serviceability of these systems were evaluated. Test results show that all of specimens have the required flexural strength under the ultimate strength limit design. It was also evaluated to have sufficient safety for the serviceability of deflection and crack under the serviceability limit design.

• 열처리공학회지
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• 제34권6호
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• pp.309-314
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• 2021

Due to the superior corrosion resistance and mechanical properties of TiAl alloy at high temperature, it has been utilized as a turbine wheel of a turbocharger. The dissimilar metallic bonding is usually applied to combine the TiAl turbine wheel with the SCM440 structural steel which is used as a driving shaft. In this study, the TiAl and SCM440 joint were fabricated by using a friction welding technique. During bonding process, to suppress the martensitic transformation and the formation of cracks, which might reduce a strength of the joints, Cu was used as an insert metal to relieve stress. As a result, the intermetallic compounds (IMCs) layer was observed at TiAl/Cu interface while no IMC formation was formed at SCM440/Cu interface. Since understanding of the IMCs effects on the mechanical performance of welded joint is also essential for ensuring the reliability and integrity of the turbocharger system, we estimated the nanohardness of welded joint region through nanoindentation. The relation between the microstructural feature and its mechanical property is discussed in detail.

• 한국재료학회지
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• 제11권12호
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• pp.1009-1013
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• 2001

The effects of coupling agent on the interface characteristics between epoxy resin and natural zeolite were studied by SEM, optical microscope and universal testing machine (UTM). Epoxy resin as a matrix was diglycidyl ether of bisphenol A (DGEBA)/4,4'-methylene dianiline (MDA)/malononitrile (MN) system and natural zeolite as an inorganic fillet was produced in Korea. With the increment of zeolite content, tensile strength decreased and it was due to the different elastic moduli of two materials. When external stress was loaded on the composites, the stress concentrated on the weakly bonded interface and crack grew easily. To improve the interface characteristics, the surface of the natural zeolite was treated with the silane coupling agent and it was found that the tensile strength was increased. The morphology of the interface showed that the bonding characteristics were modified by coupling agent.

• 한국재료학회지
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• 제12권2호
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• pp.117-120
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• 2002

We investigated the possibility of direct bonding of the Si ∥SiO$_2$/Si$_3$N$_4$∥Si wafers for Oxide-Nitride-Oxide(ONO) gate oxide applications. 10cm-diameter 2000$\AA$-thick thermal oxide/Si(100) and 500$\AA$-Si$_3$N$_4$LPCVD/Si (100) wafers were prepared, and wet cleaned to activate the surface as hydrophilic and hydrophobic states, respectively. Cleaned wafers were premated wish facing the mirror planes by a specially designed aligner in class-100 clean room immediately. Premated wafer pairs were annealed by an electric furnace at the temperatures of 400, 600, 800, 1000, and 120$0^{\circ}C$ for 2hours, respectively. Direct bonded wafer pairs were characterized the bond area with a infrared(IR) analyzer, and measured the bonding interface energy by a razor blade crack opening method. We confirmed that the bond interface energy became 2,344mJ/$\m^2$ when annealing temperature reached 100$0^{\circ}C$, which were comparable with the interface energy of homeogenous wafer pairs of Si/Si.

• 대한치과교정학회지
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• 제24권2호
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• pp.433-445
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• 1994

Bonding of brackets is one of the essential factors for successful orthodontic treatment' so bond strength of orthodontic adhesives are very important. The purposes of this research were to compare shear bond strength of various orthodontic adhesives and to evaluate failure sites. One-hundred twenty extracted human first premolars were prepared for bonding and premolar brackets were bonded to prepared enamel surfaces with Super C Ortho, Mono-$Lok^2$, Transbond, and Super C Ortho after applying Fluorobond. After bonding of brackets, teeth specimens were divided into 3 groups. In group 1 specimens were stored at humidor $37^{\circ}C$ in 1 hour, in group 2 specimens were stored at humidor $37^{\circ}C$ in 24 hours, thermocycled 10 times and in group 3 specimens were stored at humidor $37^{\circ}C$ in 24 hours, thermocycled 1800 times. Then the universal testing machine Instron 6022, Instron Co., U.S.A. was used to test the shear bond strength of brackets to enamel. After debonding, brackets and enamel surfaces were examined under stereoscopic microscope to determine the failure sites The results were as follows : 1. Shear bond strength was significantly highest of using Super C Ortho after applying Fluorobond and Super C Ortho In group 1, was highest of using Super C Ortho in group 2, and was highest of using Mono-$Lok^2$ in group 3. 2. According to time and temperature change, in using Super C Ortho the group 2 had significantly highest strength and group 3 had lowest strength, in using Mono-$Lok^2$ the group 2 and had higher strength than group 1 and in using Super C Ortho after applying Fluorobond shear bond strength decreased constantly, 3. The failure sites were tooth-resin interface in Super C Ortho after applying Fluorobond, Mono $Lok^2$ and Transbond and were at almost same ratio bracket base-resin interface and tooth-resin interface in Super C Orth.

• Composites Research
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• 제21권4호
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• pp.7-14
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• 2008

접착제 이용 결합 조인트의 하중지지 능력 예측 기법은 점착제를 이용한 접합 조인트 설계에 있어서 가장 중요한 기술이다. 본 연구 계면 파괴역학을 이용하여 복합재료/금속 접착 조인트의 하중지시 능력을 예측하는 기법을 소개한다. 구체적으로 복합재료/탄소강 결합의 접착 강도를 계면 균열의 에너지 방출률과 계면 파괴인성치 개념을 사용하여 평가하는 방법을 제시 검증하였다. 계면 균열의 에너지 방출률은 유한요소해선 결과를 이용한 가상 균열 닫음 기법 (VCCT)을 사용하여 계산하였으며, 게면 파괴인성치는 이종재료 ENF (end-notched flexure) 시편을 고안하여 측정하였다. 고안된 이종 재료 ENF 시편을 사용하여 시편의 두께에 상관없이 일관된 Mode II 계면 파괴인성치를 측정할 수 있음과 양면 겹치기 접합 조인트의 특성 에너지 방출률이 측정된 계면 파괴인성치와 일치함을 확인하였다. 따라서 에너지 방출률에 근거한 계면 균열 진전 기준은 접착 조인트의 하중지지 능력을 신뢰성 있게 예측하는 실제적인 설계 도구로서 활용될 수 있다.

• 마이크로전자및패키징학회지
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• 제28권2호
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• pp.29-37
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• 2021

3 차원 패키징을 위한 저온 Cu-Cu직접 접합부의 계면접착에너지를 향상시키기 위해 Cu박막 표면에 대한 Ar/N₂ 2단계 플라즈마 처리 전, 후 Cu표면 및 접합계면에 대한 화학결합을 X-선 광전자 분광법(X-ray photoelectron spectroscopy)을 통해 정량화한 결과, 2단계 플라즈마 처리로 인해 Cu표면에 Cu₄N이 형성되어 Cu산화를 효과적으로 억제하는 것을 확인하였다. 2단계 플라즈마 처리하지 않은 Cu-Cu시편은 표면 산화막의 영향으로 접합이 제대로 되지 않았으나 2단계 플라즈마 처리한 시편은 효과적인 표면 산화방지효과로 인해 양호한 Cu-Cu접합을 형성하였다. Cu-Cu직접접합 계면의 정량적 계면접착에너지를 double cantilever beam 시험방법 및 4점 굽힘(4-point bending, 4-PB) 시험방법을 통해 비교한 결과, 각각 1.63±0.24, 2.33±0.67 J/m²으로 4-PB 시험의 계면접착에너지가 더 크게 측정되었다. 이는 계면파괴역학의 위상각(phase angle)에 따른 계면접착에너지 증가 거동으로 설명할 수 있는데 즉, 4-PB의 계면균열선단 전단응력성분 증가로 인한 계면거칠기의 효과에 기인한 것으로 판단된다.

• 한국정밀공학회지
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• 제31권10호
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• pp.865-871
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• 2014

Paradigm shift to 3-D chip stacking in electronic packaging has induced a lot of integration challenges due to the reduction in wafer thickness and pitch size. This study presents a hybrid bonding technology by self-alignment effect in order to improve the flip chip bonding accuracy with ultra-thin wafer. Optimization of Cu pillar bump formation and evaluation of various factors on self-alignment effect was performed. As a result, highly-improved bonding accuracy of thin wafer with a $50{\mu}m$ of thickness was achieved without solder bridging or bump misalignment by applying reflow process after thermo-compression bonding process. Reflow process caused the inherently-misaligned micro-bump to be aligned due to the interface tension between Si die and solder bump. Control of solder bump volume with respect to the chip dimension was the critical factor for self-alignment effect. This study indicated that bump design for 3D packaging could be tuned for the improvement of micro-bonding quality.