• Proceedings of the KSME Conference
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• 2008.11b
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• pp.2357-2362
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• 2008

LHP is different from a conventional heat pipes in design and heat and fluid flow passages. The situations of the former is much complex than the latter. In LHPs, evaporation occurs at the contact interface between the heating plate and the porous wick, so some micro channels machined at the contact interface serve to let the vapor flow out of the evaporator. This complexity of contact geometry was known to cause a high resistance to heat flow. The present work was to study the problem of heat passage across the contact surface for LHPs and determine those values contact resistance. For two cases of contact structures, the thermal contact resistances were examined experimentally, one being obtained through mechanical contact under pressure and the other through sintered bonding. Nickel powder wick and copper plate were used for specimens. The result showed that a substantial reduction of contact resistance of an order of degree could be obtainable by sintered bonding.

• Journal of the Korean Society of Safety
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• v.34 no.4
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• pp.76-84
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• 2019

The precast pannels are used as formwork in Half-depth precast deck systems. Therefore, it has many advantages, including safe and convenient construction and reduced construction period compared to cast-in-place construction method. In half-depth precast deck systems, the bonding of precast pannels to cast-in place concrete is very important. To enhance the performance of half-depth precast deck system, it is necessary to improve the composite efficiency of the interface or increase the stiffness of the precast pannel to reduce deformation or stress on the interface. In this study, a flexural test of half-depth precast deck system was performed, in which the shear connecting reinforcement was applied to increase the bonding performance at the interface, and the rib shape precast panels were applied to improve stiffness. In addition, the safety and serviceability of these systems were evaluated. Test results show that all of specimens have the required flexural strength under the ultimate strength limit design. It was also evaluated to have sufficient safety for the serviceability of deflection and crack under the serviceability limit design.

• Journal of the Korean Society for Heat Treatment
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• v.34 no.6
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• pp.309-314
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• 2021

Due to the superior corrosion resistance and mechanical properties of TiAl alloy at high temperature, it has been utilized as a turbine wheel of a turbocharger. The dissimilar metallic bonding is usually applied to combine the TiAl turbine wheel with the SCM440 structural steel which is used as a driving shaft. In this study, the TiAl and SCM440 joint were fabricated by using a friction welding technique. During bonding process, to suppress the martensitic transformation and the formation of cracks, which might reduce a strength of the joints, Cu was used as an insert metal to relieve stress. As a result, the intermetallic compounds (IMCs) layer was observed at TiAl/Cu interface while no IMC formation was formed at SCM440/Cu interface. Since understanding of the IMCs effects on the mechanical performance of welded joint is also essential for ensuring the reliability and integrity of the turbocharger system, we estimated the nanohardness of welded joint region through nanoindentation. The relation between the microstructural feature and its mechanical property is discussed in detail.

• Korean Journal of Materials Research
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• v.11 no.12
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• pp.1009-1013
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• 2001

The effects of coupling agent on the interface characteristics between epoxy resin and natural zeolite were studied by SEM, optical microscope and universal testing machine (UTM). Epoxy resin as a matrix was diglycidyl ether of bisphenol A (DGEBA)/4,4'-methylene dianiline (MDA)/malononitrile (MN) system and natural zeolite as an inorganic fillet was produced in Korea. With the increment of zeolite content, tensile strength decreased and it was due to the different elastic moduli of two materials. When external stress was loaded on the composites, the stress concentrated on the weakly bonded interface and crack grew easily. To improve the interface characteristics, the surface of the natural zeolite was treated with the silane coupling agent and it was found that the tensile strength was increased. The morphology of the interface showed that the bonding characteristics were modified by coupling agent.

• Korean Journal of Materials Research
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• v.12 no.2
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• pp.117-120
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• 2002

We investigated the possibility of direct bonding of the Si ∥SiO$_2$/Si$_3$N$_4$∥Si wafers for Oxide-Nitride-Oxide(ONO) gate oxide applications. 10cm-diameter 2000$\AA$-thick thermal oxide/Si(100) and 500$\AA$-Si$_3$N$_4$LPCVD/Si (100) wafers were prepared, and wet cleaned to activate the surface as hydrophilic and hydrophobic states, respectively. Cleaned wafers were premated wish facing the mirror planes by a specially designed aligner in class-100 clean room immediately. Premated wafer pairs were annealed by an electric furnace at the temperatures of 400, 600, 800, 1000, and 120$0^{\circ}C$ for 2hours, respectively. Direct bonded wafer pairs were characterized the bond area with a infrared(IR) analyzer, and measured the bonding interface energy by a razor blade crack opening method. We confirmed that the bond interface energy became 2,344mJ/$\m^2$ when annealing temperature reached 100$0^{\circ}C$, which were comparable with the interface energy of homeogenous wafer pairs of Si/Si.

• The korean journal of orthodontics
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• v.24 no.2
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• pp.433-445
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• 1994

Bonding of brackets is one of the essential factors for successful orthodontic treatment' so bond strength of orthodontic adhesives are very important. The purposes of this research were to compare shear bond strength of various orthodontic adhesives and to evaluate failure sites. One-hundred twenty extracted human first premolars were prepared for bonding and premolar brackets were bonded to prepared enamel surfaces with Super C Ortho, Mono-$Lok^2$, Transbond, and Super C Ortho after applying Fluorobond. After bonding of brackets, teeth specimens were divided into 3 groups. In group 1 specimens were stored at humidor $37^{\circ}C$ in 1 hour, in group 2 specimens were stored at humidor $37^{\circ}C$ in 24 hours, thermocycled 10 times and in group 3 specimens were stored at humidor $37^{\circ}C$ in 24 hours, thermocycled 1800 times. Then the universal testing machine Instron 6022, Instron Co., U.S.A. was used to test the shear bond strength of brackets to enamel. After debonding, brackets and enamel surfaces were examined under stereoscopic microscope to determine the failure sites The results were as follows : 1. Shear bond strength was significantly highest of using Super C Ortho after applying Fluorobond and Super C Ortho In group 1, was highest of using Super C Ortho in group 2, and was highest of using Mono-$Lok^2$ in group 3. 2. According to time and temperature change, in using Super C Ortho the group 2 had significantly highest strength and group 3 had lowest strength, in using Mono-$Lok^2$ the group 2 and had higher strength than group 1 and in using Super C Ortho after applying Fluorobond shear bond strength decreased constantly, 3. The failure sites were tooth-resin interface in Super C Ortho after applying Fluorobond, Mono $Lok^2$ and Transbond and were at almost same ratio bracket base-resin interface and tooth-resin interface in Super C Orth.

• Composites Research
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• v.21 no.4
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• pp.7-14
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• 2008

Prediction of the load-bearing capacity of an adhesive-bonded Joint is of practical importance for engineers. This paper introduces interface fracture mechanics approach to predict the load-bearing capacity of composite metal bonded joints. The adhesion strength of composite/steel bonding is evaluated in terms of the energy release rate of an interfacial crack and the fracture toughness of the interface. Virtual track closure technique (VCCT) is used to calculate energy release rates, and hi-material end-notched flexure (ENF) specimens are devised to measure the interfacial fracture toughness. Bi-material ENF specimens gave consistent mode II fracture toughness $(G_{IIc})$ values of the composite/steel interface regardless of the thickness of specimens. The critical energy release rates of double-lap joints showed a good agreement with the measured fracture toughness. Therefore. the energy-based interfacial fracture characterization can be a practical engineering tool for predicting the load-bearing capacity of bonded joints.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.29-37
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• 2021

The effect of Ar/N₂ two-step plasma treatment on the quantitative interfacial adhesion energy of low temperature Cu-Cu bonding interface were systematically investigated. X-ray photoelectron spectroscopy analysis showed that Ar/N₂ 2-step plasma treatment has less copper oxide due to the formation of an effective Cu4N passivation layer. Quantitative measurements of interfacial adhesion energy of Cu-Cu bonding interface with Ar/N₂ 2-step plasma treatment were performed using a double cantilever beam (DCB) and 4-point bending (4-PB) test, where the measured values were 1.63±0.24 J/m² and 2.33±0.67 J/m², respectively. This can be explained by the increased interfacial adhesion energy according phase angle due to the effect of the higher interface roughness of 4-PB test than that of DCB test.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.10
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• pp.865-871
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• 2014

Paradigm shift to 3-D chip stacking in electronic packaging has induced a lot of integration challenges due to the reduction in wafer thickness and pitch size. This study presents a hybrid bonding technology by self-alignment effect in order to improve the flip chip bonding accuracy with ultra-thin wafer. Optimization of Cu pillar bump formation and evaluation of various factors on self-alignment effect was performed. As a result, highly-improved bonding accuracy of thin wafer with a $50{\mu}m$ of thickness was achieved without solder bridging or bump misalignment by applying reflow process after thermo-compression bonding process. Reflow process caused the inherently-misaligned micro-bump to be aligned due to the interface tension between Si die and solder bump. Control of solder bump volume with respect to the chip dimension was the critical factor for self-alignment effect. This study indicated that bump design for 3D packaging could be tuned for the improvement of micro-bonding quality.

• Proceedings of the KIEE Conference
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• 1998.07g
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• pp.2501-2503
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• 1998

In this paper, the silicon-nitride membrane structure for IR sensor was fabricated through the etching and the direct bonding. The PTO layer as a IR detection layer was deposited on the membrane and its characteristics were measured. The attack of PTO layer during the etching of silicon wafer as well as the thermal isolation of the IR detection layer can be solved through the method of bonding/etching of silicon wafer. Because the PTO layer of c-axial orientation raised thermal polarization without polling, the more integration capability can be achieved. The surface roughness of the membrane was measured by AFM, the micro voids and the non-contacted area were inspected by IR detector, and the bonding interface was observed by SEM. The polarization characteristics and the dielectric characteristics of the PTO layer were measured, too.