• Journal of the Korean Chemical Society
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• v.47 no.6
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• pp.659-662
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• 2003

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.2
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• pp.123-127
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• 2009

In order to get more higher integration density of devices, it is getting to be used more and more micro via interconnection lines for interconnecting layers or devices. However, it is very important to enhance the electrical characteristic by reducing the electrical resistivity of micro via interconnection line because it affects the reliability of packaging. In this paper, Micro vias were patterned with a diameter from 10 to 100 um by increasing the step of 10 um and 100 um height and were fabricated by micromachining technology to investigate the electrical characteristic of micro via interconnection lines. These micro vias were filled with copper by electroplating process with appling pulse current mode. And the electrical characteristics of micro via interconnection lines were measured. The measured value of electrical resistivity shows with a range from 20 to $26\;m{\Omega}$. This value from micro via interconnection lines fabricated by pulse current mode electroplating process shows better result than the resistivity from than micro via interconnection lines fabricated by DC mode ($31\;m{\Omega}$).

• Journal of Energy Engineering
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• v.8 no.1
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• pp.76-84
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• 1999

The demand of Small Self-generating System (SSS) including Small Cogeneration System (SCS) is constantly increasing with the need of electricity and/or thermal in office, hospital, hotel, and small factory, etc. It is especially recommended to operate SCS in the heat-following mode to maximize the efficiency of generator. In case of the heat-following mode SCS has got to be connected to distribution system so as to send surplus power to the utility or receive the short power from utility. But the interconnection of SSS with distribution system causes a few problems such as the bad power quality, and low security. If SSS is not promptly disconnected after faults occur (Islanding of SSS), it can not only damage equipment of utility and adjacent customers but also endanger life of human due to overvoltage or overcurrent. In this paper it has been deeply discussed if interconnection of engine self-generator/control system satisfies the protective requirement for SSS or not. 500 kW engine generator running in the Jodo island has been used to perform the analysis of interconnection.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.12 no.4
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• pp.357-364
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• 1987

In this paper we consider the performance Analysis of multistage interconnection network, which is major parts of multi-processor system. We review the Hardware configuration of STAR network system using base-line interconnection network and obtain the probability of clustering basing on analytical model. In addition, Instead of Baseline interconnection system, mentioned above, STAR network system using delta network is considered and TWO probability mentioned above is obtained, finally the comparative result is shown in the figure.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.4
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• pp.63-69
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• 2007

We investigated interconnection processes using Cu vias for MEMS sensor packages. Ag paste layer was formed on a glass substrate and used as a seed layer for electrodeposition of Cu vias after bonding a Si substrate with through-via holes. With applying electrodeposition current densities of $20mA/cm^2\;and\;30mA/cm^2$ at direct current mode to the Ag paste seed-layer, Cu vias of $200{\mu}m$ diameter and $350{\mu}m$ depth were formed successfully without electrodeposition defects. Interconnection processes for MEMS sensor packages could be accomplished with Ti/Cu/Ti line formation, Au pad electrodeposition, Sn solder electrodeposition and reflow process on the Si substrate where Cu vias were formed by Cu electrodeposition into through-via holes.

• Journal of the Korean Institute of Telematics and Electronics
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• v.24 no.4
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• pp.610-617
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• 1987

This thesis is concerned with fault-tolerance of a B-net (Beta-network) which is a kind of interconnection network in the multicomputer system. In this paper, a method for obtaining Maximal Tolerable Fault Set(MTFS) of link line connecting switching elements in the arbitrary B-net is presented. Using this method, it is seen that testing of DFA capability is possible when s-a-faults of link line occur, and criterion for determining degree of fault- tolerance of a B-net in terms of link line is introduced.

• Proceedings of the KIEE Conference
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• 2005.11b
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• pp.17-19
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• 2005

This paper illustrates the case studies of reliability evaluation for interconnecting power systems in the north east Asia by using the tie line constrained equivalent assisting generator model(TEAG), which has been already developed in the second project year. A reliability evaluation program, it is named, NEAREL. based on the TEAS model was made. The reliability evaluation results for the seven interconnection scenarios of the actual power systems of six countries in the north east Asia are introduced and compared. The reasonable capacity of the tie line for three countries interconnection senario is suggested from sensitivity analysis.

• Proceedings of the KIEE Conference
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• 2008.07a
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• pp.38-39
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• 2008

KEPCO conducted the project called the "Feasibility Study for the Han (Ghana) - Bobo Dioulasso (Burkina Faso) - Bamako (Mali) Interconnection Project" as its first African project. This paper deals with power system analysis and Transmission line and substation design of approximately 750 kilometers of the 225 kV single circuit transmission lines and six substations. The main contents of the power system analysis results and preliminary engineering design include power flow, transient stability, eigenvalue analysis, transmission line design, substation design and economic analysis.

• Proceedings of the KIEE Conference
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• 1998.07c
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• pp.1244-1246
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• 1998

This paper present a variety fault problem brought out with the multifunctional Battery Energy Storage System [MBESS] expected to be practical in the short future interconnected to power distribution system. Multifunctional BESS model and interconnection model to power system is simply configured, the problems of protection coordination and operation is studied. A line fault in the power distribution system are discussed such as line to ground and three phase fault in order to show the impact on power utilities, demand-side and BESS-side. In order to simulate a variable transient phenomenon due to 2 the BESS interconnection operation to power distribution system, in this paper, PSCAD/EMTDC simulation tools is used.

• Journal of Korean Vacuum Science & Technology
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• v.7 no.2
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• pp.39-44
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• 2003

Recent ULSI and multilevel structure trends in microelectronic devices minimize the line width down to a quarter micron and below, which results in the high current densities in thin film interconnections. Under high current densities, an EM(electromigration) induced failure becomes one of the critical problems in a microelectronic device. This study is to improve thin film interconnection materials by investigating the EM characteristics in PSG(phosphosilicate glass)/SiO$_2$ passivated Al-l%Si thin film interconnections. Straight line patterns, wide and narrow link type patterns, and meander type patterns, etc. were fabricated by a standard photholithography process. The main results are as follows. The current crowding effects result in the decrease of the lifetime in thin film interconnections. The electric field effects accelerate the decrease of lifetime in the double-layered thin film interconnections. The lifetime of interconnections also depends upon the current conditions of P.D.C.(pulsed direct current) frequencies applied at the same duty factor.