• Journal of Welding and Joining
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• 제19권2호
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• pp.208-214
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• 2001

In this study, we constructed a visual sensor system for weld seam tracking in real time in GMA welding. A sensor part consists of a CCD camera, a band-pass filter, a diode laser system with a cylindrical lens, and a vision board for inter frame process. We used a commercialized robot system which includes a GMA welding machine. To extract the weld seam we used a inter frame process in vision board from that we could remove the noise due to the spatters and fume in the image. Since the image was very reasonable by using the inter frame p개cess, we could use the simplest way to extract the weld seam from the image, such as first differential and central difference method. Also we used a moving average method to the successive position data or weld seam for reducing the data fluctuation. In experiment the developed robot system with visual sensor could be able to track a most popular weld seam. such as a fillet-joint, a V-groove, and a lap-joint of which weld seam include planar and height directional variation.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2002년도 하계종합학술대회 논문집(2)
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• pp.45-48
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• 2002

This paper discusses the surface roughness of negative chemically amplified resists, SAL601 exposed by I-beam direct writing. system. Surface roughness, as measured by atomic force microscopy, have been simulated and compared to experimental results. Molecular-scale simulator predicts the roughness dependence on material properties and process conditions. A chemical amplification is made to occur in the resists during PEB process. Monte-Carlo and exposure simulations are used as the same program as before. However, molecular-scale PEB simulation has been remodeled using a two-dimensional molecular lattice representation of the polymer matrix. Changes in surface roughness are shown to correlate with the dose of exposure and tile baking time of PEB process. The result of simulation has a similar tendency with that of experiment.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2000년도 추계학술대회 논문집
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• pp.643-646
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• 2000

In this study, we constructed a preview-sensing visual sensor system for weld seam tracking in real time in GMA welding. A sensor part consists of a CCD camera, a band-pass filter, a diode laser system with a cylindrical lens, and a vision board for inter frame process. We used a commercialized robot system which includes a GMA welding machine. To extract the weld seam we used a inter frame process in vision board from that we could remove the noise due to the spatters and fume in the image. Since the image was very reasonable by using the inter frame process, we could use the simplest way to extract the weld seam from the image, such as first differential and central difference method. Also we used a moving average method to the successive position data of weld seam for reducing the data fluctuation. In experiment the developed robot system with visual sensor could be able to track a most popular weld seam, such as a fillet-joint, a V-groove, and a lap-joint of which weld seam include planar and height directional variation.

• 한국전기전자재료학회논문지
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• 제14권7호
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• pp.557-561
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• 2001

Chemical mechanical polishing (CMP) process has been widely used to planarize dielectric layers, which can be applied to the integraded circuits for sub-micron technology. Despite the increased use of CMP process, it is difficult to accomplish the global planarization of in the defect-free inter-level dielectrics (ILD). Especially, defects such as micro-scratch lead to severe circuit failure which affect yield. CMP slurries can contain particles exceeding 1㎛ in size, which could cause micro-scratch on the wafer surface. The large particles in these slurries may be caused by particles agglomeration in slurry supply line. To reduce these defects, slurry filtration method has been recommended in oxide CMP. In this work, we have studied the effects of filtration and the defect trend as a function of polished wafer count using various filters in inter-metal dielectrics(IMD)-CMP process. The filter installation in CMP polisher could reduce defects after IMD-CMP process. As a result of micro-scratch formation, it is shown that slurry filter plays an important role in determining consumable pad lifetime. The filter lifetime is dominated by the defects. We have concluded that slurry filter lifetime is fixed by the degree of generating defects.

• Journal of Electrical Engineering and information Science
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• 제2권6호
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• pp.212-216
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• 1997

A new metal tip fabrication process for low voltage operation is reported in this paper. The key element of the fabrication process is that isotropic silicon etching and oxidation process used in silicon tip fabrication is utilized for gate hole size reduction and gate oxide layer. A metal FEA with 625 tips was fabricated in order to demonstrate the validity of the new process and submicron gate apertures were successfully obtained from originally 1.7$\mu\textrm{m}$ diameter mask. The emission current above noise level was observed at the gate bias of 50V. The required gate voltage to obtain the anode current of 0.1${\mu}\textrm{A}$/tip was 74V and the emission current was stable above 2${\mu}\textrm{A}$/tip without any disruption. The local field conversion factor and the emitting area were calculated as 7.981${\times}$10\ulcornercm\ulcorner and 3.2${\times}$10\ulcorner$\textrm{cm}^2$/tip, respectively.

• 상하수도학회지
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• 제33권4호
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• pp.281-289
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• 2019

Desalination plants are generally studied with higher operating costs compared to water supply facilities. This study was conducted to reduce the cost of water production and to preserve existing water resources. Therefore, the purpose of this study was to utilize the control valves to increase maximum efficiency, thereby reducing the power of the pumps and operating costs. Specific energy consumption was shown to reduce the process operating power by up to 1.7 times from 6.17 to $3.55kWh/m^3$ based on seawater reverse osmosis 60 bar. In addition, the water intake process was divided into pre, inter, and post-according to the use method of blasting, and the water treatment process was divided into pre, inter, and post blending. In order to reduce power consumption, the blending process was combined to operate the facility, which resulted in the reduction of power consumption in the order post > pre-inter> inter blending.

• 한국경영과학회:학술대회논문집
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• 대한산업공학회/한국경영과학회 1990년도 춘계공동학술대회논문집; 한국과학기술원; 28 Apr. 1990
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• pp.326-334
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• 1990

A monitoring process of a communication network with two links is analyzed. The Markov process is introduced to compute busy and idle portions of monitoring processor and monitored rate of each link. Inter-idle times and inter-monitoring ties of monitoring processor between two links are respectively computed. A recursive formula is introduced to make the computational procedure rigorous.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 춘계학술대회 논문집 반도체재료
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• pp.30-33
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• 2001

Chemical mechanical polishing(CMP) process has been widely used to planarize dielectrics, which can apply to employed in integrated circuits for sub-micron technology. Despite the increased use of CMP process, it is difficult to accomplish the global planarization of free-defects in inter-level dielectrics (ILD). Especially, defects like micro-scratch lead to severe circuit failure, and affects yield. CMP slurries can contain particles exceeding $1{\mu}m$ size, which could cause micro-scratch on the wafer surface. The large particles in these slurries may be caused by particle agglomeration in slurry supply line. To reduce these defects, slurry filtration method has been recommended in oxide CMP. In this work, we have studied the effects of filtration and the defect trend as a function of polished wafer count using various filters in inter-metal dielectric(IMD)-CMP. The filter installation in CMP polisher could reduce defect after IMD-CMP. As a result of micro-scratches formation, it shows that slurry filter plays an important role in determining consumable pad lifetime.

• Journal of Korea Trade
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• 제23권2호
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• pp.14-33
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• 2019

Purpose - This paper aims to articulate determinants of inter-organizational cooperation based on to the extent to which inter-organizational tasks are related to product development and production processes. Design/Methodology - This research conducted OLS regression analysis based on the data acquired from questionnaire survey in Korean auto industry. Findings - Our analysis has verified that complementary and compatible resources, as well as physical and human asset specificities, positively affect inter-organizational product development cooperation. Conversely, in the production process, only complementary resources positively affect inter-organizational cooperation, whereas compatible resources and physical asset specificity have a negative influence. The changing characteristics of compatible resources (with IT innovations and AI), and physical asset specificity (influenced by a rising need to reduce production costs), cause inter-organizational cooperation in production to decrease. Originality/value - This research attempts to expound upon these determining factors of inter-organizational cooperation by considering both complementary-compatible resources and asset specificity in product development and production simultaneously. The reason why the impact of complementary-compatible resources and asset specificity on inter-organizational cooperation is critical in understanding the determinants of inter-organizational cooperation is that the attributes of complementary-compatible resources and asset specificity in production have changed drastically due to the continuing diffusion of IT innovations and AI (Artificial Intelligence).

• JSTS:Journal of Semiconductor Technology and Science
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• 제10권1호
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• pp.45-48
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• 2010

An inter-pin skew compensation scheme is proposed, which minimizes the inter-pin skew of parallel interface induced by unequal trace length and loading of printed circuit board (PCB). The proposed scheme measures the inter-pin skew and compensates during power-up with simple hardware. The proposed scheme is applied to 3.2-Gb/s/pin DDR4 SDRAM and implemented in a 0.18 m CMOS process. The inter-pin skew is compensated in 324-cycles of 400-MHz clock and the skew is compensated to be less than 24-ps.