• Title/Summary/Keyword: Integration Module

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A Design and Implementation of Monitoring Applications using Shipboard Integration Network Communication Library (선박 통합 네트워크의 통신 라이브러리를 이용한 모니터링 어플리케이션의 설계 및 구현)

  • Kim, Tae-Jong;Hwang, Hun-Gyu;Lee, Seong-Dae;Lee, Jang-Se;Jang, Kil-Woong;Park, Hyu-Chan
    • Journal of Advanced Marine Engineering and Technology
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    • v.35 no.8
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    • pp.1085-1091
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    • 2011
  • This paper describes a design and implementation of monitoring applications on shipboard integration network. A wrapping module is designed to reuse pre-developed communication library of shipboard integration network. By using the wrapping module, monitoring applications are also designed to display several kinds of shipboard data. They are implemented and tested on general PC and embedded PC to verify that they can be applicable to different platforms.

A study on the Characteristics of RF switch module on 1${\sim}$3 GHz Band (1${\sim}$3 GHz 대역의 GMS Type Switch Module 특성에 관한 연구)

  • Kim, In-Sung;Song, Jae-Sung;Suh, Young-Suk
    • Proceedings of the KIEE Conference
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    • 2004.07c
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    • pp.1673-1675
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    • 2004
  • The design, modeling and measurement of RF switch module for GSM applications is presented in this paper. RF switch module is constructed using a LTCC multi-layer switching circuit and integrated low pass filter. Insertion and return loss of the low pass filter were designed less than 0.3 dB and better than 12.7 dB at 900 MHz. The RF switch module contained 10 embedded passives and 3 surface mount components integrated on $4.6{\times}4.8{\times}1.2$ mm, 6-layer multi-layer integrated circuit. The insertion loss of switch module was measured at 900 MHz was 11 dB.

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Design Optimization of a Heat Sink for Mobile Telecommunication Module Satisfying Temperature Limits (온도 제한조건을 고려한 이동통신 모듈의 히트싱크 최적설계)

  • Jeong, Seung-Hyun;Jeong, Hyun-Su;Lee, Yong-Bin;Choi, Dong-Hoon
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.35 no.2
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    • pp.183-190
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    • 2011
  • As the number of mobile subscribers has increased recently, the demand for more number of base stations has increased. However, because of the shortage of sites for constructing base stations, a mobile communication module needs to be small in size. To minimize the size of the module, the size of the heat sink attached to the outside of the module should be minimized. Furthermore, the temperature of each electronic component of the module should be lower than the allowable temperature so that thermal stability can be maintained. A commercial PIDO (process integration and design optimization) tool PIAnO and a commercial CFD (computational fluid dynamics) tool FLOTHERM are used to minimize the size of the module while the constraints on the temperatures of the twelve electronic components are satisfied. As a result of design optimization, the volume of the heat sink is reduced by 41.9% while all the constraints on the temperature of the twelve electronic components of the module are satisfied.

SOP (System-on-Packaging) for Mega-Function System Integration

  • 윤종광
    • Ceramist
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    • v.8 no.6
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    • pp.46-52
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    • 2005
  • 본 논문에서는 Mega-Function System Integration을 추구하는 SOP기술의 필요성과 10가지 요소기술에 대하여 개략적으로 언급하였고, SOP 기술은 SOC, SIP 및 기타 부품 집적기술과는 경쟁관계가 아닌 융합 발전할 수 있는 기술이 라는 점을 강조하였다. 또한, System Level Integration 을 위한 SOP 요소기술들은 단순히 부품 혹은 Module level에 필요한Design, 공정, 재료기술만이 아니라, System의 전반적인 차원에서 분석, 해결되어야 하는 것을 알 수 있겠다. 따라서, 이제는 모든 요소기술을 종합적, 유기적으로 개발할 수 있는 연구개발전략이 매우 중요한 과제이다.

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Development of an Adobe Connect Meeting Moodle Module (Adobe Connect Meeting 무들 모듈 개발)

  • Park, Jong-Dae;Jang, Jin-Hoon
    • The Journal of Natural Sciences
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    • v.19 no.1
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    • pp.11-25
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    • 2008
  • An Adobe Connect Meeting Moodle activity module was developed for the Pai-Chai Moodle virtual learning environment. Professors can create online meeting room directly from their courses by using the Adobe Connect Meeting module. The web services from the server was utilized for the application integration.

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Improvement of Memory Module Test Signal Integrity Using High Frequency Socket (High Frequency Socket 개발을 통한 Memory Module Test Signal Integrity 향상)

  • Kim, Min-Su;Kim, Su-Ki
    • Proceedings of the IEEK Conference
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    • 2008.06a
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    • pp.491-492
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    • 2008
  • According to high-speed large scale integration trend of Memory module product, many type of noises, such a reflection, cross-talk simultaneous switching noise, occur on the Package PCB and they make the deterioration of memory module's performance and reliability. As module products have more high efficiency, Hardware of test board and socket has to be considered In test of the high-speed Memory Module. we mainly focused on improvement of Signal integrity Using the High Frequency Test socket that we invented

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Voice Portal based on SMS Authentication at CTI Module Implementation by Speech Recognition (SMS 인증 기반의 보이스포탈에서의 음성인식을 위한 CTI 모듈 구현)

  • Oh, Se-Il;Kim, Bong-Hyun;Koh, Jin-Hwan;Park, Won-Tea
    • Annual Conference of KIPS
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    • 2001.04b
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    • pp.1177-1180
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    • 2001
  • 전화를 통해 인터넷 정보를 들을 수 있는 보이스 포탈(Voice Portal) 서비스가 인기를 얻고 있다. Voice Portal 서비스란 알고자 하는 정보를 Speech Recognition System에 음성으로 명령하면 전화를 통해 음성으로 원하는 정보를 듣는 서비스이다. Authentication의 절차를 수행하는 SMS (Short Message Service) 서버 Module, PSTN과 Database 서버사이의 Interface를 제공하는 CTI (Computer Telephony Integration) Module, CTI 서버와 WWW (World Wide Web) 사이의 Voice XML Module, 정보를 검색하기 위한 Searching Module들이 필요하다. 본 논문은 Speech Recognition technology를 기반으로 한 CTI Module 설계를 구현하였다. 또한 인정 방식으로 Random한 일회용 password를 기반으로 한 SMS Authentication을 택하므로 더욱 더 안정된 서비스 제공을 목적으로 하였다.

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Experimental Analysis of Ventilation Effect on the Performance of Building-Integrated PV Solar Roof (건물통합형 PV Solar Roof의 통풍효과 실험분석)

  • Kim, Jin-Hee;Lee, Kang-rock;Kim, Jun-Tae
    • Journal of the Korean Solar Energy Society
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    • v.26 no.1
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    • pp.73-79
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    • 2006
  • The integration of PV modules into building facades or roof could raise PV module temperature that results in the reduction of electrical power generation. Lowering operating temperature of PV module is important in this respect, and PV module temperature should be considered more accurately, for building-integrated PV(BIPV) systems in predicting their performance. This paper describes a BIPV solar roof design and verifies its performance through experiment In relation to the effect of ventilation in space between PV module and roof surface. The results showed that the ventilation in the space had a positive effect in lowering the module temperature of the BIPV solar roof that enhanced the performance of its electricity generation.

Development of a Data Bus Analyzer for Avionics Interfaces of Various Types (다종 항공전자 인터페이스를 위한 데이터 버스 분석 장비 개발)

  • Kim, Min-Su
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.44 no.9
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    • pp.825-832
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    • 2016
  • This paper describes the development of a data bus analyzer for use in avionics systems integration test. The data bus analyzer is equipped with MIL-STD-1553B, CAN and Ethernet interface cards which is incorporated in a majority of the avionics systems to accommodate a variety of interfaces. It has an individual hardware for a capture engine and a analyzing engine in order to perform the collection and the analysis of the bus data at the same time efficiently. It provides a data display function of the grid, 2-dimensional and 3-dimensional form to increase the data analysis efficiency. Verification of the data bus analyzer was carried out module unit testing and inter-module integration testing on the basis of the test procedures. Verification of interlocking requirement and usefulness of developed equipment was confirmed through an integration test result performed on a system integration laboratory of aircraft which is an actual testing environment.

A Study on the Development of a Low Cost Inverter Integration Module with a Protection Circuit of Source Harmonics (전원 고조파 방지 회로를 내장한 low-cost 인버터 통합 모듈 개발에 관한 연구)

  • Kim, Tae-Kue;Choi, Hyun-Eui;Ahn, Ho-Kyun;Yoon, Tae-Sung
    • Proceedings of the KIEE Conference
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    • 2008.07a
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    • pp.930-931
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    • 2008
  • This study is on the development of a low cost inverter module with Power Factor Correction(PFC) circuit which satisfies the international harmonic current standard such as IEC61000-3-2. In this study, the performances of the PFC circuit applying a new control method are simulated and verified by Matlab/Simulink. Also, the inverter module with the designed PFC circuit is implemented and the experimental results for the module are presented. Finally, through an analysis for the results of the simulation and the experiment, the merits obtainable by applying the PFC circuit when designing an inverter module are discussed and presented.

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