• KIEE International Transaction on Electrical Machinery and Energy Conversion Systems
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• v.11B no.3
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• pp.112-118
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• 2001

In the near future, the voltage of power system for passenger vehicle will be changed to 42V from existing 14V./ Because of increasing power and voltage ratings used in the vehicle the motor drive system has high switching dv/dt and it generates electromagnetic interference (EMI) To solve these problems multi-level inverter system may be used The feature of multi-level inverter is the output voltage to be synthesized from several levels of voltage Because of this feature high switching dv/dt and EMI can be reduced in the multi-level inverter system But as the number of level is increased manufacturing cost is getting expensive and system size is getting large. Because of these disadvantages the application of multi-level inverter has been restricted only to high power drives. The method to reduce manufacturing cost and system size is to integrate circuit of multi-level inverter into a few chips But isolated power supply and signal isolation circuit using transformer or opto-coupler for drive circuit are obstacles to implement the integrated circuit (IC) In this paper a drive circuit of 4-level inverter suitable for integration to hybrid or one chip is proposed In the proposed drive circuit DC link voltage is used directly as the power source of each gate drive circuit NPN transistors and PNP transistors are used to isolate to transfer the control signals. So the proposed drive circuit needs no transformers and opto-couplers for electrical isolation of drive circuit and is constructed only using components to be implemented on a silicon wafer With th e proposed drive circuit 4- level inverter system will be possible to be implemented through integrated circuit technology Using the proposed drive circuit 4- level inverter system is constructed and the validity and characteristics of the proposed drive circuit are proved through the experiments.

• Korean Chemical Engineering Research
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• v.47 no.1
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• pp.1-10
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• 2009

As a demand for the portable device requiring smaller size and better performance is in hike, reducing the size of conventionally used planar 2 dimensional chip cannot be a solution for the enhancement of the semiconductor chip technology due to an increase in RC delay among interconnects. To address this problem, a new technology - "3 dimensional (3D) IC chip stack" - has been emerging. For the integration of the technology, several new key unit processes (e.g., silicon through via, wafer thinning and wafer alignment and bonding) should be developed and much effort is being made to achieve the goal. As a result of such efforts, 4 and 8 chip-stacked DRAM and NAND structures and a system stacking CPU and memory chips vertically were successfully developed. In this article, basic theory, configurations and key unit processes for the 3D IC chip integration, and a current tendency of the technology are explained. Future opportunities and directions are also discussed.

• Journal of the Institute of Electronics Engineers of Korea TE
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• v.37 no.5
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• pp.48-55
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• 2000

Recently due to rapid improvement of integrated circuit design environment, size of IC design is to become large to possible design System on Chip(SoC) that one chip with multi function enclosed. Also cause to this rapid change, consumption market is require to spend smallest time for new product development. In this paper to propose a methodology can design a large size IC for save time and applied to design of MPEG Layer 2 decoder to can use audio receiver in digital broadcast system. The digital broadcast audio decoder in this paper is pointed to save hardware size as optimizing algorithm. MPEG Layer 2 decoder algorithm is include MAC to can have an effect on hardware size. So coefficients are using sign digit expression. It is for hardware optimization. If using this method can design MAC without multiplier. The designed audio decoder is using 14,000 gates hardware size and save 22% (4000 gates) hardware usage than using multiplier. Also can design MPEG Layer 2 decoder usable digital broadcast receiver for short time.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.21 no.2
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• pp.143-149
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• 2021

BLDC motors are getting better performance due to the improvement of material technology including high performance of permanent magnets, advancement of driving IC technology with high integration and high functionality, and improvement of assembly technology such as high point ratio. While having the advantage of such a square wave driven BLDC motor, interest in the design and development of a square wave driven BLDC permanent magnet motor and development of a position detection circuit and driver is increasing in order to more meet the needs of users. However, in spite of the cost and functional advantages due to reduced efficiency, switching loss and vibration, noise, etc., the application is somewhat limited. Therefore, in this paper, we study a position detection circuit that generates a sinusoidal signal in proportion to the magnetic flux of a BLDC motor rotor using a Hall Effect Sensor that generates a sinusoidal wave to increase the efficiency of the motor, reduce ripple, and drive a sinusoidal current with excellent speed and torque characteristics.

• Journal of Electrical Engineering and Technology
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• v.11 no.3
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• pp.644-652
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• 2016

This paper presents an improved single-stage ac-dc LED-drive flyback converter using the transformer-coupled lossless (TCL) snubber. The proposed converter is derived from the integration of a full-bridge diode rectifier and a conventional flyback converter with a simple TCL snubber. The TCL snubber circuit is composed of only two diodes, a capacitor, and a transformer-coupled auxiliary winding. The TCL snubber limits the surge voltage of the switch and regenerates the energy stored in the leakage inductance of the transformer. Also, the switch of the proposed converter is turned on at a minimum voltage using a formed resonant circuit. Thus, the proposed converter achieves high efficiency. The proposed converter utilizes only one general power factor correction (PFC) control IC as its controller and performs both PFC and output power regulation, simultaneously. Therefore, the proposed converter provides a simple structure and an economic implementation and achieves a high power factor without the need for any separate PFC circuit. In this paper, the operational principle of the proposed converter is explained in detail and the design guideline of the proposed converter is briefly shown. Experimental results for a 40-W prototype are shown to validate the performance of the proposed converter.

• Journal of Applied Reliability
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• v.11 no.3
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• pp.251-265
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• 2011

Low-noise amplifier(LNA) is a component that amplifies the signal while lowering the noise figure of high-frequency signal. LNA holds a very important position in RF system so that it is widely used for telecommunication. Electro static discharge(ESD) is the most common cause of malfunction for low-powered components, such as Large Scale Integration and IC type LNA is weak in ESD. This thesis studies static effect of communication LNA. It analyzes ESD effect, which occurs within LNA circuit, and describes testing standard and methods. In order to find out LNA's susceptiblity to electro static, two well-recognized communication IC type LNA models were selected to be tested. Then static-induced malfunction was carefully analyzed and it suggests architectural problem and improvement from the LNA's ESD point of view.

• Journal of Information Display
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• v.4 no.4
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• pp.4-7
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• 2003

The world largest 21.3" LTPS LCD has been successfully developed using SLS crystallization technology. Integration of gate circuit, transmission gate and level shifter was successfully performed in a large area display. Uniform and high performance of high quality grains of SLS technology make it possible to realize a uniform large size LTPS TFT-LCD with half the number of data driver IC's that is typically used in a-Si LCD. High aperture ratio of 65 % was achieved using an organic inter insulating method which lead to a high brightness of 500 cd/$cm^2$.

• Design & Manufacturing
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• v.18 no.2
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• pp.9-16
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• 2024

Recently, there has been extensive research conducted on the miniaturization of semiconductors and the improvement of their integration to achieve high-quality and high-performance electronic devices. To integrate and miniaturize multiple semiconductors, thin and precise wafers are essential. The backgrinding process, which involves high-precision processing, is necessary to achieve this. The backgrinding system is used to grind and polish the back side of the wafer to reduce its thickness to ㎛ units. This enables the high integration and miniaturization of semiconductors and a flattening process to allow for detailed circuit design, ultimately leading to the production of IC chips. As the backgrinding system performs precision processing at the ㎛ unit, it is crucial to determine the stability of the equipment's rigidity. Additionally, the flatness and surface roughness of the processed wafer must be checked to confirm the processability of the backgrinding system. IIn this paper, the goal is to verify the processability of the back grinding system by analyzing the natural frequency and resonance frequency of the equipment through computer simulation and measuring and analyzing the flatness and surface roughness of wafers processed with backgrinding system. It was confirmed whether processing damage occurred due to vibration during the backgrinding process.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.6 no.1
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• pp.32-37
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• 1981

The novel design method of ternary rate multiplier is proposed. This paper sugests the new implementation technique of multiplier implemented by the technique is capable of working at higher spced than that of the ternary counter type. This technique is intended to use the binary elements except the ternary inverter. And also, the mordetn COS/MOS integration process can easily implement the circuit designed by this method.

• Journal of Institute of Control, Robotics and Systems
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• v.6 no.2
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• pp.228-233
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• 2000

It is common to apply the technology of FPGA (Fie이 Programmable Gate Array) which is one of the design methods for ASIC(Application Specific IC)to the active components used in the data processing at the digital system of satellite aircraft missile etc for compact lightness and integration of Printed Circuit Board (PCB) In carrying out the digital data processing the FPGAs are designed for the various functions of the Process Control Interrupt Control Clock Generation Error Detection and Correction (EDAC) as the individual module. In this paper an FPGA chip for Single Error Correction and Double Error Detection (SEC-DED) for EDAC is designed and simulated by using a VLSI design software LODECAP.