• Electrical & Electronic Materials
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• v.20 no.5
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• pp.3-11
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• 2007

• Polymer Science and Technology
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• v.26 no.3
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• pp.232-237
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• 2015

• Proceedings of the Materials Research Society of Korea Conference
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• 1998.11a
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• pp.52-52
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• 1998

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.22 no.4
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• pp.147-152
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• 2008

This paper describes the breakdown poperties of porcelain and polymer insulators using the UV camera. The experiment was carried out using condition of voltage at the KS C IEC 60060-1(2006). As these results, corona discharge in porcelain insulator was generated the weakness point of insulator union. And the corona discharge of polymer insulator happened in union of power source. Also, we could confirm easily weakness part of these insulators by ultraviolet image through the corona discharge. Besides, in the comparison with the exciting technique of ultrasonic detection, it confirmed that deterioration steps are corrected. These steps are possible to judge the deterioration of power facilities through reliable date. Hereafter, this study as the diagnostic technology suitable for the sites is used.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.12
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• pp.7283-7286
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• 2014

SiOC films were prepared as insulators for displays by sputtering at low temperatures, and the relationship with the electrical properties waaas examined. The electrical properties of SiOC films were affected by the annealing process, and SiOC films annealed at 100oC showed a significant increase in thickness and a decrease in the reflective index. XRD revealed an increase in the degree of the amorphous structure. Moreover, the capacitance and leakage current of the SiOC films annealed at 100oC decreased. These characteristics of SiOC films highlight their potential as ideal insulators. Amorphous SiOC films by the reduction of polarization are dependent on the elongation effect of the bonding lengths in the structure and the thickness. The properties of these SiOC films are suitable for low temperature displays.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.5
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• pp.413-417
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• 2010

Line to ground faults by deterioration of insulators has frequently occurred in power system, and the main cause is surface contamination of the insulators. The contamination of insulator is analyzed by monitoring the surface leakage current flowing them. The suspension insulator is monitored by installation of a zero-phase current sensor(ZCT), but the line-post insulator is impossible to apply the same method because of its large diameter structure. This paper proposed a detection method of surface leakage current for a line-post insulator, and it can easily be applied to new and/or built insulators. The leakage current is indirectly calculated from the potential difference between the metal electrode attached on the surface of insulator and the ground connector. To evaluate the performance of the proposed method, the leakage current is compared as a function of contamination condition controlled by the density of NaCl solution. The leakage current is proportioned to the density of NaCl solution, and the voltage detected by the electrode showed the same trend. From the experimental results, we designed and fabricated a monitoring device which is composed of a detection electrode, signal converter, microprocessor, and ZigBee, and its measurement range is $10{\mu}A{\sim}5mA$.

• Journal of the Semiconductor & Display Technology
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• v.5 no.1 s.14
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• pp.39-43
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• 2006

The polyvinyl series organic films as gate insulators of thin film transistor(TFT) have been processed and characterized on the polyether sulphone (PES) substrates . The poly-4-vinyl phenol(PVP) and polyvinyl toluene (PVT) were used as solutes and propylene glycol monomethyl ether acetate(PGMEA) as a solvent in the formation of organic insulators. The cross-linking of organic insulators was also attempted by adding the thermosetting material, poly (melamine-co-formaldehyde) as a hardener in the compound. The electrical characteristics measured in the metal-insulator-metal (MIM) structures showed that insulating properties of PVP layers were generally superior to those of PVT layers. Among the layers of PVP series; copolymer PVP(10 wt%), 5wt% cross-linked PVP(10 wt%), copolymer PVP(20 wt%), 5 wt% cross-linked PVP(20 wt%) and 10 wt% cross-linked PVP(20 wt%), the 10 wt% cross-linked PVP(20 wt%) layer showed the lowest leakage current of 1.2 pA at ${\pm}10V$. The ms value of surface roughness and the capcitance per unit area are 2.41 and $1.76nF/cm^2$ in the case of 10 wt% cross-linked PVP(20 wt%) layer, respectively.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2004.05b
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• pp.500-504
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• 2004

This research is about the result of leakage current waveform about the situation of surface leakage current and environmental changes(Salt fog, clean fog and rain) by EPDM polymer insulators' amount of salt. The researcher presents the result of changing about fundamental harmonic, 3rd harmonic and 5th harmonic from starting point of supplying power to flashover. In this study, researched environmental affects (clean fog, salt fog and .am) about surface aging of polymer insulators and used frequency spectrum of leakage current waveform to develop the diagnostic technique of surface aging. When amount of salt contents changed, surface aging stage and the degree of aging (distortion factor) about 3rd and 5th harmonir waveform on low frequency harmonic wave. The distortion factor which is harmonic percentage about basic harmonic is important pointer to evaluate the surface condition of polymer insulators.

• Journal of Industrial and Engineering Chemistry
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• v.68
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• pp.117-123
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• 2018

Recently, aqueous method has attracted lots of attention because it enables the solution-processed metal oxide thin film with high electrical properties in low temperature fabrication condition to various flexible devices. Focusing the development of aqueous route, many researchers are only focused on metal oxide materials. However, for expansive application of the aqueous-based metal oxide films, the systematic study of performance change with process variables for the development of aqueous-based metal oxide insulator film is urgently required. Here, we propose importance of process variables to achieve high electrical-performance metal oxide insulator based on the aqueous method. We found that the significant process variables including precursor solution temperature and humidity during the spincoating process strongly affect chemical, physical, and electrical properties of $AlO_x$ insulators. Through the optimization of significant variables in process, an $AlO_x$ insulator with a leakage current value approximately $10^5$ times smaller and a breakdown voltage value approximately 2-3 times greater than un-optimized $AlO_x$ was realized. Finally, by introducing the optimized $AlO_x$ insulators to solutionprocessed $InO_x$ TFTs, we successfully achieved $InO_x/AlO_x$ TFTs with remarkably high average field-effect mobility of ${\sim}52cm^2V^{-1}\;s^{-1}$ and on/off current ratio of 106 at fabrication temperature of $250^{\circ}C$.

• Journal of the Microelectronics and Packaging Society
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• v.31 no.3
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• pp.87-90
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• 2024

Currently, when oxides are used as insulators in hybrid bonding for 3D integration, they are prone to delamination due to their surface characteristics, and the RC delay value due to the resistance of the metal and the capacitance of the insulator increases as the wiring of the semiconductor chip becomes longer. To solve these problems, we studied the optimization of the conditions of the polymer insulator bonding method for hybrid bonding. To check the possibility of the de-wetting method, we coated a polymer film on the existing micro pillar and conducted hot-press bonding to remove the polymer between the metals. Through this study, it is expected that the introduction of polymers as insulators in hybrid bonding and fine-pitch metal bonding will improve signal transmission speed by reducing RC delay. It is also expected to be commercialized in the future to increase the number of I/O terminals by applying it to hybrid bonding.