• 한국멀티미디어학회논문지
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• 제17권11호
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• pp.1270-1278
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• 2014

The modern infrared (IR) imaging systems use mainly one or more wavelength bands among short wavelength IR (SWIR), middle wavelength IR (MWIR), and long wavelength IR (LWIR) bands. In the process of IR image synthesis and modeling, IR image wavelength-band conversion which transforms arbitrary band image to other band one is required. The wavelength-band conversion procedure includes a temperature estimation process of an object surface. However, in this procedure, an approximated Planck's radiation equation causes errors in estimated temperature. In this paper, we propose an estimation temperature error attenuation method in IR image band conversion procedure. The estimated temperature is corrected with a slope information of radiance according to it. The corrected temperature is used for generation of the other band IR image. The verification of proposed method is demonstrated through the simulation.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2002년도 ICCAS
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• pp.96.4-96
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• 2002

Thermal infrared imaging is a highly promising technology for condition monitoring and predictive maintenance of electronic, electrical and mechanical elements in nuclear power plants. However, conventional low-cost infrared imaging systems suffer from poor spatial resolution compared to commercial CCD cameras. This paper describes an approach to enhance inspection performances for calandria reactor area of Wolsung nuclear power plant through the technique of superimposing thermal infrared image into real CCD image. In the occurrence of thermal abnormalities on observation points and areas of calandria reactor area, unusual hot image taken from thermal infrared camera is mapped upon re...

• Journal of Advanced Marine Engineering and Technology
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• 제25권6호
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• pp.1237-1243
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• 2001

This paper presents an information about the heat transfer characteristics of impinging jet in eletronic equipment with infrared image processing unit. There have been many experimental investigations and theoretical studies on impinging jet because of application in a wide variety of industrial process including electronic equipment. In this study, we used infrared image processing unit to visualize heat transfer characteristics of impinging jet in eletronic equipment. Infrared image processing unit is one of non-contact temperature measuring methods and it is possible to minimize flow resistance and this measurement is comparatively accurate. The main parameters are distance between nozz1e and heat source. Reynolds number is 6000.

• 한국컴퓨터정보학회논문지
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• 제22권7호
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• pp.39-45
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• 2017

In this paper, we propose three compensation methods to solve problems in high-resolution airborne infrared camera and to improve long-range target information acquisition performance. First, image motion and temporal noise reduction technique which is caused by atmospheric turbulence. Second, thermal blurring image correction technique by imperfect performance of NUC(Non Uniformity Correction) or raising the internal temperature of the camera. Finally, DRC(Dynamic Range Compression) and flicker removing technique of 14bits HDR(High Dynamic Range) infrared image. Through this study, we designed techniques to improve the acquisition performance of long-range target information of high-resolution airborne infrared camera, and compared and analyzed the performance improvement result with implemented images.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 1997년도 한국자동제어학술회의논문집; 한국전력공사 서울연수원; 17-18 Oct. 1997
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• pp.11-16
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• 1997

This paper describes the grenade counting system developed for DPICM submunition analysis using the infrared video streams, and its some video stream processing technique. The video stream data processing procedure consists of four sequences; Analog infrared video stream recording, video stream capture, video stream pre-processing, and video stream analysis including the grenade counting. Some applications of this algorithms to real bursting test has shown the possibility of automation for submunition counting.

• 한국멀티미디어학회논문지
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• 제12권11호
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• pp.1547-1556
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• 2009

본 논문에서는 적외선 영상에서 영역확장 및 온라인 분산을 이용한 화염검출 방법을 제안한다. 본 논문에서 제안된 화염검출 방법은 화염 후보영역을 효과적으로 검출하기 위하여, 먼저 적외선 자기 영상에 높은 임계값을 적용하여 초기 화염영역의 후보영역을 분할하고, 영역확장 방법을 이용하여 유사한 높은 값을 갖는 이웃영역으로 확장시켜 최종후보영역을 검출한다. 분할된 후보영역은 나대지 와 건물같은 비 화염 영역을 포함할 수 있기 때문에, 화염 영역을 검출하기 위하여 분할영역을 시간에 따라 추적하면서, 각 후보영역의 밝기 값의 변화 정도를 추적영역의 분산을 온라인 갱신에 의해 효과적으로 계산하였다. 적외선 영상에서의 실험을 통하여 영영 확장 방법과 온라인 분산에 의한 제안방법이 적외선 영상에서 효율적으로 화염을 검출함을 보였다.

• 한국군사과학기술학회지
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• 제16권2호
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• pp.207-213
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• 2013

An infrared image synthetic method is proposed for infrared system simulation. The synthesis image uses a background IR image captured from real scene and a target IR modeling image. The radiances related with maximum and minimum temperatures of the background and target images are calculated from the Planck's blackbody equation. Based on them, the background and target images are compensated and synthesized. The proposed method is simulated and the IR target images are generated by RadThermIR software.

• Transactions on Electrical and Electronic Materials
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• 제18권6호
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• pp.341-344
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• 2017

Infrared (IR) filters were developed to implement integrated three-dimensional (3D) image sensors that are capable of obtaining both color image and depth information at the same time. The combination of light filters applicable to the 3D image sensor is composed of a modified IR cut filter mounted on the objective lens module and on-chip filters such as IR pass filters and color filters. The IR cut filters were fabricated by inorganic $SiO_2/TiO_2$ multilayered thin-film deposition using RF magnetron sputtering. On-chip IR pass filters were synthetized by dissolving various pigments and dyes in organic solvents and by subsequent patterning with photolithography. The fabrication process of the filters is fairly compatible with the complementary metal oxide semiconductor (CMOS) process. Thus, the IR cut filter and IR pass filter combined with conventional color filters are considered successfully applicable to 3D image sensors.

• Journal of the Optical Society of Korea
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• 제12권2호
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• pp.79-87
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• 2008

We have developed a miniature fisheye lens with $190^{\circ}$ field of view operating simultaneously in the visible and the near infrared wavelengths. The modulation transfer function characteristic for the visible wavelength is sufficient for a mega-pixel-grade image sensor. The lens also has a fair resolution in the infrared wavelength region. The calibrated $f-{\theta}$ distortion is less than 5%, and the relative illumination is over 90%. In consequence, a sharp wide-angle image can be obtained which is uniform in brightness over the entire range of field angles. The real image heights for the visible and the near infrared wavelengths have been fitted to polynomial functions of incidence angle with sub-pixel accuracies. Combined with the near equidistance projection scheme of the lens, this lens can be advantageously employed in various image-processing applications requiring a wide-angle lens.

• 한국컴퓨터정보학회논문지
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• 제23권1호
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• pp.33-39
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• 2018

In this paper, We studied the possibility of SoC(System On Chip) design using infrared image processing IP(Intellectual Property). And, we studied NUC(Non Uniformity Correction), BPR(Bad Pixel Recovery), and CEM(Contrast Enhancement) processing, the infrared image processing algorithm implemented by IP. We showed the logic and timing diagram implemented through the hardware block designed based on each algorithm. Each algorithm was coded as RTL(Register Transfer Level) using Verilog HDL(Hardware Description Language), ALTERA QUARTUS synthesis, and programed in FPGA(Field Programmable Gated Array). In addition, we have verified that the image data is processed at each algorithm without any problems by integrating the infrared image processing algorithm. Particularly, using the directly manufactured electronic board, Processor, SRAM, and FLASH are interconnected and tested and the verification result is presented so that the SoC type can be realized later. The infrared image processing IP proposed and verified in this study is expected to be of high value in the future SoC semiconductor fabrication. In addition, we have laid the basis for future application in the camera SoC industry.