• 한국표면공학회지
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• 제34권5호
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• pp.475-480
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• 2001

Diffusion of Cu into the low-k para-xylene based plasma polymer (pXPP) thin films deposited by plasma-enhanced chemical vapor deposition using the para-xylene precursor was comparatively measured using various methods. Cu layer was deposited on the surfaces of pXPPs treated by $N_2$ plasma generated in a magnetically enhanced inductively coupled plasma reactor. Diffusion characteristics of Cu into pXPPs were measured using Rutherford backscattering spectroscopy (RBS), secondary ion mass spectroscopy (SIMS), cross-sectional transmission electron microscopy (XTEM), and current-voltage (I-V) measurements for the vacuum-annealed Cu/pXPPs for 1 hour at $450^{\circ}C$ and were compared. The results showed a correlation between the I-V measurement and SIMS data are correlated and have a sensitivity enough to evaluate the dielectric properties but the RBS or XTEM measurements are not sufficient to conclude the electrical properties of low-k dielectrics with Cu in the film bulk. The additional results indicate that the pXPP layers are quite resistant to Cu diffusion at the annealing temperature of $450^{\circ}C$ compared to the other previously reported organic low-k materials.

• 한국전기전자재료학회논문지
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• 제27권1호
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• pp.39-44
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• 2014

Silicon nitride thin film deposited with Plasma Enhanced Chemical Vapor Deposition was treated by a nitrogen plasma generated by Inductively Coupled Plasma at room temperature. The treatment was investigated by Fourier Transform Infrared Spectroscopy and Atomic Force Microscopy on the surface at various RF source powers at two RF bias powers. The amount of hydrogen was reduced and the surface roughness of the films was decreased remarkably after the plasma treatment. In order to understand the causes, we analyzed the plasma diagnostics by Optical Emission Spectroscopy and Double Langmuir Probe. Based on these analysis results, we show that the nitrogen plasma treatment was effective in the improving of the properties silicon nitride thin film for flexible display.

• 한국재료학회지
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• 제15권3호
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• pp.149-154
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• 2005

Teflon like fluorocarbon thin films have been deposited on silicon and oxide molds as an antistiction layer for the hot embossing process by an inductively coupled plasma (ICP) chemical vapor deposition (CVD) method. The process was performed at $C_4F_8$ gas flow rate of 2 sccm and 30 W of plasma power as a function of substrate temperature. The thickness of film was measured by a spectroscopic ellipsometry. These films were left in a vacuum oven of 100, 200 and $300^{\circ}C$ for a week. The change of film thickness, contact angle and adhesion and friction force was measured before and after the thermal test. No degradation of film was observed when films were treated at $100^{\circ}C$. The heat treatment of films at 200 and $300^{\circ}C$ caused the reduction of contact angles and film thickness in both silicon and oxide samples. Higher adhesion and friction forces of films were also measured on films treated at higher temperatures than $100^{\circ}C$. No differences on film properties were found when films were deposited on either silicon or oxide. A 100 nm silicon template with 1 to $500\;{\mu}m$ patterns was used for the hot embossing process on $4.5\;{\mu}m$ thick PMMA spun coated silicon wafers. The antistiction layer of 10 nm was deposited on the silicon mold. No stiction or damages were found on PMMA surfaces even after 30 times of hot embossing at $200^{\circ}C$ and 10 kN.

• 마이크로전자및패키징학회지
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• 제21권3호
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• pp.67-71
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• 2014

본 연구에서는 Si(111) 기판을 이용하여 고품질의 GaN 박막을 성장하기 위하여 다양한 패턴을 갖는 Si 기판을 제작하였다. Si(111) 기판위에 이온 스퍼터(ion-sputter)를 이용하여 Pt 박막을 증착한 후 열처리(thermal annealing)하여 Pt 금속 마스크를 형성하고 유도 결합 플라즈마 이온 식각(inductively coupled plasma-reactive ion etching, ICP-RIE) 공정을 통하여 기둥(pillar)형태의 나노 패턴된 Si(111) 기판을 제작하였고 리소그래피 공정을 통하여 마이크로 패턴된 Si(111) 기판을 제작하였다. 일반적인 Si(111) 기판, 마이크로 패턴된 Si(111) 기판 및 나노 패턴된 Si(111) 기판위에 유기화학기상증착(metal organic chemical vapor deposition, MOCVD) 방법으로 GaN 박막을 성장하여 표면 특성과 결정성 및 광학적 특성을 분석하였다. 나노 패턴된 Si(111) 기판위에 성장한 GaN 박막은 일반적인Si(111) 기판과 마이크로 패턴된 Si(111) 기판위에 성장한 GaN 박막보다 표면의 균열과 거칠기가 개선되었다. 나노 패턴된 Si(111) 기판위에 성장한 GaN (002)면과 (102)면에 x-선 회절(x-ray diffraction, XRD) 피크의 반폭치(full width at half maximum, FWHM)는 576 arcsec, 828 arcsec으로 다른 두 기판위에 성장한 GaN 박막 보다 가장 낮은 값을 보여 결정성이 향상되었음을 확인하였다. Photoluminescence(PL)의 반폭치는 나노 패턴된 Si(111) 기판위에 성장한 GaN 박막이 46.5 meV으로 다른 기판위에 성장한 GaN 박막과 비교하여 광학적 특성이 향상되었음을 확인하였다.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2004년도 Asia Display / IMID 04
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• pp.1003-1006
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• 2004

We have fabricated poly-Si TFTs at 170$^{\circ}C$ using inductively coupled plasma chemical vapor deposition (ICP-CVD) and excimer laser annealing (ELA). A Poly-Si film with large grains exceeding 5000${\AA}$ and a $SiO_2$ film with high breakdown field are deposited by ICP-CVD. A high mobility exceeding 100$cm^2$/Vs with a low sub-threshold swing of 0.76V/dec was obtained.

• 반도체디스플레이기술학회지
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• 제5권2호
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• pp.1-5
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• 2006

The GaN thin film on the 8 periods InGaN/GaN multi-quantum well structure was grown on the sapphire substrate using metal-organic chemical vapor deposition. The nano-scaled triangular-lattice holes with the diameter of 150 nm were patterned on a polymethylmethacrylate blocking film using an electron beam nano-lithography system. The thin slab and two-dimensional photonic crystals with the thickness of 28 nm were fabricated on the GaN layer for the blue light diffraction sources. The photonic crystal with the lattice parameter of 460 nm enhances spectral intensity of photoluminescence indicating that the photonic crystals provides the source of nano-diffraction for the blue light of the 450-nm wavelength.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제41회 하계 정기 학술대회 초록집
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• pp.343-343
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• 2011

저온에서의 Thin Film Transistor (TFT) 혹은 Nonvolatile memory (NVM) 등의 MOS 구조 소자들의 높은 전기적 특성에 관한 연구들이 진행 되면서 mobility와 stability 그리고 구조화의 용이성에 대한 연구가 진행됨에 따라 amorphous silicon의 결정화를 통해 전기적 특성을 향상 시킨 Nanocrystalline silicon (nc-Si)/Microcrystalline silicon (${\mu}c$-Si)에 대한 연구가 관심을 받고 있다. 본 논문에서는 ${\leq}300^{\circ}C$에서 Inductively coupled plasma chemical vapor deposition를 이용한 TFT을 제작하였다. 가스비, 온도, 두께에 따른 결정화 정도를 Raman spectra를 통해 확인한 후 Bottom gate와 Top gate 구조의 TFT를 제작 하고 결정화에 따른 전기적 특성 향상과 그의 덧붙여 플라즈마 처리를 통한 특성 향상을 확인 하였다.

• 한국반도체및디스플레이장비학회:학술대회논문집
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• 한국반도체및디스플레이장비학회 2006년도 춘계학술대회
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• pp.127-130
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• 2006

사파이어 기판위에 MOCVD (metal organic chemical vapor deposition)를 이용하여 8주기의 InGaN/GaN 다중양자우물(multiple quantum well : MQW)구조가 성장되어졌고 이 구조 위에 p-GaN층이 형성됐다. 다시 p-GaN 위에 200nm의 두께를 갖는 PMMU 박막을 도포하고 electron beam lithography system을 이용하여 직경이 150nm가 되도록 나노단위의 삼각격자 구조를 가진 구멍을 패턴하고 inductively coupled plasma(ICP)를 이용하여 식각을 하여 광결정을 제작하였다. 광결정은 두께가 26nm이고 격자간격은 460nm로서 파장이 450nm인 파란빛을 나노회절 시켜서 photoluminescence(PL)의 세기를 강화시킨다.

• 반도체디스플레이기술학회지
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• 제11권1호
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• pp.61-65
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• 2012

In this study, for use of carbon nanotubes (CNTs) as a cold cathode of x-ray tubes, we examine the effects of selective growth of CNTs on their field emission properties and long-term stability. The selective growth of CNTs was performed by selectively etching the catalyst layer which was used for CNTs' nucleation. CNTs were grown on conical-type tungsten substrates using an inductively-coupled plasma chemical vapor deposition system. For all the grown CNTs, their morphologies and microstructures were analyzed by field-emission scanning electron microscope and Raman spectroscopy. The electron-emission properties of CNTs and the long-term stability of emission currents were measured and characterized according to the CNTs' growth position on the substrate.

• 한국전기전자재료학회논문지
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• 제22권4호
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• pp.342-349
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• 2009

This study investigated the growth characteristics of carbon nanotubes (CNTs) by changing a period of annealing time and a $C_{2}H_{2}/H_2$ flow ratio at temperature as low as $450^{\circ}C$ with inductively coupled plasma chemical vapor deposition. The 1-nm-thick Fe-Ni-Co alloy thin film served as a catalyst layer for the growth of CNTs, which was thermally evaporated on the 15-nm-thick Al underlayer deposited on the 50-nm-thick Ti diffusion barrier. The annealing at low temperature of $450^{\circ}C$ brought about almost no granulation of the catalyst layer, and the CNT growth was not affected by a period of annealing time. A study of changing the flow rate of $C_{2}H_{2}$ and $H_2$ showed that as the ratio of the $C_{2}H_{2}$ flow rate to the $H_2$ flow rate was lowered, the CNTs were grown to be longer With further decreasing the flow ratio, the length of CNTs reached the maximum and then became shorter. Under the optimized gas flow rates, we successfully synthesized CNTs with a uniform length over a 4-inch Si wafer at $450^{\circ}C$.