Influence of Nitrogen Plasma Treatment on Low Temperature Deposited Silicon Nitride Thin Film for Flexible Display |
Kim, Seongjong
(Department of Control and Instrumentation Engineering, Korea University)
Kim, Moonkeun (Department of Control and Instrumentation Engineering, Korea University) Kwon, Kwang-Ho (Department of Control and Instrumentation Engineering, Korea University) Kim, Jong-Kwan (Department of Electrical and Electronic Engineering, Anyang University) |
1 | Y. Kuo, The Electrochemical Society Interface, (Pennington, New Jersey, 2013). |
2 | K. Fukuda and N. Ibaraki, Elctronics and Communications in Jpn, 76, 12 (1993). |
3 | J. Jang, Materialstoday, 9, 46 (2006). |
4 | W. A. McDonald, J. Mater. Chem, 14, 4 (2004). DOI ScienceOn |
5 | T. Wang, CS Mantech Conference (Tampa, Florida, 2009). |
6 | C. M. Huang, L. C. Chen, K. W. Cheng, and G. T. Pan, J. Mol. Catalys., A, 261, 218 (2007). DOI ScienceOn |
7 | F. Alonso, M. Rinner, A. Loinaz, J. I. Onate, W. Ensinger, and B. Rauschnbach, Surf. Coat. Technol., 93, 305 (1997). DOI |
8 | M. R. Sanchis, O. Calvo, O. Fenollar, D. Garcia, and R. Balart, Polym. Test., 27, 75 (2008). DOI |
9 | S. Rauf, S. W. Lim, and P. L. G. Ventzek, J. Appl Phys.., 98, 024305 (2005). DOI |
10 | G. Santana, J. Fandino, A. Ortiz, and J. C. Alonso, J. Non-crystalline Solids, 351, 922 (2005). DOI |
11 | D. Ikeda, M. Ogawa, Y. Hara, Y. Nishimura, O. Odusanya, K. Azuma, S. Matsuda, M. Yatsuzuka, and A. Murakami, Surf. Coat. Technol., 156, 301 (2002). DOI |
12 | N. S. McIntyre, R. N. S. Sodhi, and D. H. Hunter, J. Appl. Polym. Sci, 40, 1903 (1990). DOI |
13 | E. P. Gusev, H. C. Lu, E. L. Garfunkel, T. Gustafsson, and M. L. Green, IBM J. Res. Dev., 43, 265 (1999). DOI |
14 | C. H. Chen, Y. K. Fang, C. W. Yang, S. F. Ting, Y. S. Tsair, M. C. Yu, T. H. Hou, M. F. Wang, S. C. Chen, C. H. Yu, and M. S. Liang, IEEE Trans. Elec. Dev., 22, 378 (2001). DOI |
15 | Y. H. Ham, A. M. Efremov, S. J. Yun, J. K. Kim, N. K. Min, and K. H. Kwon, Thin Solid Films, 517, 4242 (2009). DOI |
16 | R. Chen, D. F. Qi, Y. J. Ruan, S. W. Pan, S. Y. Chen, S. Xie, C. Li, H. K. Lai, and H. D. Sun, Appl. Phys., 106, 251 (2012). |
17 | D. M. Schneider, A. Ersoy, J. Maibach, D. Schneider, and E. Obermeier, Sens. Master., 7, 121 (1995). |
18 | J. Kanicki and M. S. Crowder, Appl. Phys. Lett., 59, 1723 (1991). DOI |
19 | Y. Manabe, J. Appl. Phys., 66, 2475 (1989). DOI |
20 | Y. B. Park and S. W. Rhee, J. Mater. Sci., 9, 515 (2001). |
21 | Y. Hirohata, N. Shimamoto, T. Hino, T. Yamashima, and K. Yabe, Thin Solid Films, 253, 425 (1994). DOI |
22 | E. David, Kotechki, and Jonathan D. Chapple-Sokol, J. Appl. Phys., 77, 1284 (1995). DOI |
23 | M. C. Hugon, B. Agius, F. Abel, J. L. Courant, and M. Puech, J. Vac. Sci. Technol A., 13, 2900 (1995). DOI |
24 | G. B. Zhao, S. V. B. Janardhan Garikipati, X. Hu, M. D. Argyle, and M. Radosz, AlChE Journal (2005). |
25 | G. H. Kim, A. M. Efremov, D. P. Kim, and C. I. Kim, Micro. Engr., 81, 96 (2005). DOI |
26 | T. Kimura and H. Kasugai, J. Appl. Phys., 108, 033305 (2010). DOI ScienceOn |
27 | K. Tao, D. Mao, and J. Hopwood, J. Appl. Phys., 91, 4040 (2002). DOI ScienceOn |
28 | E. G. Thorsteinsson and J. T. Gudmundsson, Plasma Source. Sci. Technol., 18, 045001 (2009). DOI ScienceOn |
29 | Y. Tanaka and T. Sakuta, J. Phys. D, 35, 468 (2002). DOI |
30 | S. J. Park and J. S. Kim, J. Colloid and Interface Science, 244, 336 (2001). DOI ScienceOn |