• Title/Summary/Keyword: Indentation force

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Molecular Simulation Study on Influence of Water Film Thickness on Lubrication Characteristics (물 분자막의 두께와 윤활특성의 상관관계에 대한 분자시뮬레이션 연구)

  • Kim, Hyun-Joon;Heo, Segon
    • Tribology and Lubricants
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    • v.38 no.5
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    • pp.199-204
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    • 2022
  • This paper presents a numerical investigation of the influence of water molecule thickness on frictional behavior at the nanoscale using molecular dynamics simulation. Three different models, comprising water thin films of various thicknesses, were built, and indentation and sliding simulations were performed using the models. Various normal loads were applied by indenting the Si tip on the water film for the sliding simulation to evaluate the interplay between the water thin film thickness and the normal load. The results of the simulations showed that the friction force generally increased with respect to the normal load and thickness of the water thin film. The friction coefficient varied with respect to the normal load and the water film thickness. The friction coefficient was the smallest under a moderate normal force and increased with decreasing or increasing normal loads. As the water film became thicker, the contact area between the tip and water film became larger. Under well-lubricated conditions, the friction force was proportional to the contact area regardless of the water film thickness. As the normal force increased above a critical condition, the water molecules beneath the Si tip spread out; thus, the film could not provide lubrication. Consequently, the substrate was permanently deformed by direct contact with the Si tip, while the friction force and friction coefficient significantly increased. The results suggest that a thin water film can effectively reduce friction under relatively low normal load and contact pressure conditions. In addition, the contact area between the contacting surfaces dominates the friction force.

Variation of Nanoindentation Curve due to Wear of Indenter Apex and Its Correction Method (압입자 첨단마모에 따른 나노압입곡선의 변화 및 이의 보정기법)

  • Lee, Yun-Hee;Kim, Yong-Il;Park, Jong Seo;Kim, Kwang Ho
    • Journal of the Korean Society for Nondestructive Testing
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    • v.33 no.2
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    • pp.129-137
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    • 2013
  • A force calibration of a nanoindenter and a 3D morphology observation of indenters were carried out in this study. A microbalance calibrated with standard weights was used for measuring the loads generated by a nanoindenter. The indentation load could be calibrated from the ratio of measured and generated loads and the first contact load also could be detected from the microbalance data. By analyzing atomic force microscopy images of two indenters, curvature radii of apexes were determined by $19.71{\pm}3.03$ and $1043.94{\pm}50.91$ nm, respectively, for the nearly new indenter A and the severly worn indenter B. Corresponding bluntness depths were estimated by 1.22 and 64.56 nm for the both indenters by overlapping their profiles on the perfect pyramidal shape. In addition, nanoindentation curves obtained from a fused silica reference material with the both indenters showed a depth difference corresponding to the bluntness depth difference along the indentation depth axis. By shifting amounts of the bluntness depths along the horizontal axis, whole nanoindentation curves overlapped on themselves and resulted in nanohardness values consistent within 1.11 % without considering the complex indenter area function of each indenter.

Molecular dynamics simulation of scratching a Cu bicrystal across a $\Sigma=5(210)$ grain boundary ($\Sigma=5(210)$ 결정립계를 포함한 구리 bicrystal 모재상 스크래칭에 관한 분자역학모사)

  • Kim Ki Jung;Cho Min Hyung;Jang Ho
    • Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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    • 2004.11a
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    • pp.215-220
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    • 2004
  • Molecular Dynamics(MD) method was used to investigate the change of friction force due to interaction between dislocations and a grain boundary when a Ni tip was scratched on a Cu bicrystal. The substrate comprised a Cu bicrystal containing a vertical$\Sigma=5(210)$ grain boundary. The moving tip for scratching simulation was consisted of fixed Ni atoms emulating a rigid tip. The indentation depth was $3.6\AA$ and the scratching was performed along <110>direction in the first grain. As the scratching was continued, nucleation and propagation of dislocations were observed. In the early stage, the grain boundary played as a barrier to moving dislocations and interrupting further dislocation movement with no dislocation resulting in no propagation across the grain boundary. As the Ni tip approached the grain boundary, dislocations were nucleated at the grain boundary and propagated to the second grain. However, stick-slip phenomena that were observed on a single crystal scratching were not observed in the bicrystal. And, instead, irregular oscillation of friction force was observed during the scratching due to the presence of a grain boundary.

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Characterization of Thin Film Materials by Nanoindentation and Scanning Probe Microscopy (나노인덴테이션과 주사탐침현미경을 이용한 박막 재료의 특성평가)

  • Kim, Bong-seob;Yun, Jon-do;Kim, Jong-kuk
    • Korean Journal of Materials Research
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    • v.13 no.9
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    • pp.606-612
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    • 2003
  • Surface and mechanical properties of thin films with submicron thickness was characterized by nanoindentation with Berkovich and Vickers tips, and scanning probe microscopy. Nanoindention was made in a depth range of 15 to 200 nm from the surface by applying tiny force in a range from 150 to $9,000 \mu$N. Stiffness, contact area, hardness, and elastic modulus were determined from the force-displacement curve obtained. Reliability was first tested by using fused quartz, a standard sample. Elastic modulus and hardness values of fused quartz measured were the same as those reported in the literature within two percent of error. Mechanical properties of ITO thin film were characterized in a depth range of 15∼200nm. As indentation depth increased, elastic modulus and hardness decreased by substrate effect. Ion beam deposited DLC thin films were indented in a depth range of 40∼50 nm. The results showed that the DLC thin film using benzene and bias voltage 0∼-50 V has elastic modulus and hardness value of 132 and 18 GPa respectively. Pure DLC thin films showed roughnesses lower than 0.25 nm, but silicon-added DLC thin films showed much higher roughness values, and the wavy surface morphology.

Impact Damage of Honeycomb Sandwich Antenna Structures (통신 안테나용 허니콤 샌드위치 구조물의 충격 손상에 관한 연구)

  • Kim, Cha-Gyeom;Lee, Ra-Mi;Park, Hyeon-Cheol;Hwang, Un-Bong;Park, Wi-Sang
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.26 no.2
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    • pp.387-398
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    • 2002
  • The impact response and damage of CLAS panel was investigated experimentally. The facesheet material used was RO4003 woven-glass hydrocarbon/ceramic and the core material was Nomex honeycomb with a cell size of 3.2mm and a density of 96 kg/㎥. The shield plane used was RO4003 and 2024-T3 aluminum. Static indentation and impact test was conducted to characterize the type and extent of the damage observed in two CLAS panels, and the performance of antenna used in a wireless LAN system. Correlation of peak contact force, residual indentation and the delamination area shows impact damage of the panel with an aluminum shield plane is larger than that of the panel with RO4003 shield plane, although the former is more penetration resistant. The damage was observed by naked eye, ultrasonic inspection and cross sectioning. The shape and size of delamination was estimated by ultrasonic inspection, and the area of delamination linearly increases as impact energy increases. The performance of impact damaged antenna was estimated by measuring return loss and radiation pattern. It was revealed that the performance of antenna was related to the impact damage and there was a threshold that the performance of antenna fell as impact energy level changed. The threshold was between the impact energies of 1.5J and 1.75J.

A Study on Nano/micro Pattern Fabrication of Metals by Using Mechanical Machining and Selective Deposition Technique (기계적 가공과 무전해 선택적 증착기술을 이용한 나노/마이크로 금속패턴 제작에 관한 연구)

  • Cho S.H.;Youn S.W.;Kang C.G.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.06a
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    • pp.1507-1510
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    • 2005
  • This study was carried out as a part of the research on the development of a maskless and electroless process for fabricating metal micro/nanostructures by using a nanoindenter and an electroless deposition technique. $2-\mu{m}-deep$ indentation tests on Ni and Cu samples were performed. The elastic recovery of the Ni and Cu was 9.30% and 9.53% of the maximum penetration depth, respectively. The hardness and the elastic modulus were 1.56 GPa and 120 GPa for Ni and 1.49 GPa and 100 GPa for Cu. The effect of single-point diamond machining conditions such as the Berkovich tip orientation (0, 45, and $90^{\circ}$) and the normal load (0.1, 0.3, 0.5, 1, 3, and 5 mN), on both the deformation behavior and the morphology of cutting traces (such as width and depth) was investigated by constant-load scratch tests. The tip orientation had a significant influence on the coefficient of friction, which varied from 0.52-0.66 for Ni and from 0.46-0.61 for Cu. The crisscross-pattern sample showed that the tip orientation strongly affects the surface quality of the machined area during scratching. A selective deposition of Cu at the pit-like defect on a p-type Si(111) surface was also investigated. Preferential deposition of the Cu occurred at the surface defect sites of silicon wafers, indicating that those defect sites act as active sites for the deposition reaction. The shape of the Cu-deposited area was almost the same as that of the residual stress field.

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Characteristics of Silicon Nitride Deposited Thin Films on IT Glass by RF Magnetron Sputtering Process (RF Magnetron Sputtering공정에 의해 IT유리에 적층시킨 Silicon Nitride 박막의 특성)

  • Son, Jeongil;Kim, Gwangsoo
    • Korean Journal of Materials Research
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    • v.30 no.4
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    • pp.169-175
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    • 2020
  • Silicon nitride thin films are deposited by RF (13.57 MHz) magnetron sputtering process using a Si (99.999 %) target and with different ratios of Ar/N2 sputtering gas mixture. Corning G type glass is used as substrate. The vacuum atmosphere, RF source power, deposit time and temperature of substrate of the sputtering process are maintained consistently at 2 ~ 3 × 10-3 torr, 30 sccm, 100 watt, 20 min. and room temperature, respectively. Cross sectional views and surface morphology of the deposited thin films are observed by field emission scanning electron microscope, atomic force microscope and X-ray photoelectron spectroscopy. The hardness values are determined by nano-indentation measurement. The thickness of the deposited films is approximately within the range of 88 nm ~ 200 nm. As the amount of N2 gas in the Ar:N2 gas mixture increases, the thickness of the films decreases. AFM observation reveals that film deposited at high Ar:N2 gas ratio and large amount of N2 gas has a very irregular surface morphology, even though it has a low RMS value. The hardness value of the deposited films made with ratio of Ar:N2=9:1 display the highest value. The XPS spectrum indicates that the deposited film is assigned to non-stoichiometric silicon nitride and the transmittance of the glass with deposited SiO2-SixNy thin film is satisfactory at 97 %.

Elastic Properties Evaluation of Thin Films on Flexible Substrates with Consideration of Contact Morphology in Nanoindentation (나노압입시험에서의 접촉형상 보정을 통한 유연소자 박막의 탄성특성 평가)

  • Kim, Won Jun;Hwang, Gyeong-Seok;Kim, Ju-Young;Kim, Young-Cheon
    • Journal of the Microelectronics and Packaging Society
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    • v.27 no.3
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    • pp.83-88
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    • 2020
  • The evolution of smartphones has led to numerous researches in the mechanical behavior of flexible devices. Due to the nano-size of the thin flexible film, nanoindentation is widely used to evaluate its mechanical behaviors, such as elastic modulus, and hardness. However, the commonly used Oliver-Pharr method is not suited for analyzing the indentation force-depth curves of hard films on soft substrates, as the effects of soft substrate is not considered theoretically. In this study, the elastic modulus of the thin film was evaluated with references to other reported models which include the substrate effect, and with calibration of the indentation depth for the pile-ups between the indenter and test surface. We fabricated test samples by deposition of amorphous metal film on polyimide and silicon wafers for verification of modified models.

Cracking Behavior Under Contact Stress in Densely Coated Porous Engineering Ceramics (치밀층으로 코팅된 다공성 엔지니어링 세라믹스에서의 접촉응력에 의한 균열 거동)

  • Kim, Sang-Kyum;Kim, Tae-Woo;Kim, Do-Kyung;Lee, Kee-Sung
    • Journal of the Korean Ceramic Society
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    • v.42 no.8 s.279
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    • pp.554-560
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    • 2005
  • The engineering ceramic needs the properties of high strength, hardness, corrosion-resistance and heat-resistance in order to withstand thermal shock or applied nonuniform stresses without failure. The densely coated porous ceramics can be used for machine component, electromagnetic component, bio-system component and energy-system component by their high-performances from superior coating properties and light-weight characteristics due to the structure including pore by itself. In this study we controlled the porosity of silica and alumina, $8.2\~25.4\%$ and $23.4\~36.0\%$, respectively, by the control of sintering temperature and starting powder size. We made bilayer structures, consisting of a transparent glass coating layer bonded to a thick substrate of different porous ceramics by a thin layer of epoxy adhesive, facilitated observations of crack initiation and propagation. The elastic modulus mismatch could be controlled using different porous ceramics as the substrate layer. Then we applied 150 N force using WC sphere with a radius of 3.18 mm by Hertzian indentation. As a result, the crack initiation in the coating layer was delayed at lower porosity in the substrate layer, and the damage in the coating layer was relatively smaller at the bilayer structure coated on higher elastic substrate.

Measurement of Mechanical Properties of Thin Films Using a Combination of the Bulge Test and Nanoindentation (벌지 실험과 나노 압입 실험을 통한 박막의 기계적 물성 측정)

  • Jung, Bong-Bu;Lee, Hun-Kee;Park, Hyun-Chul
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.36 no.2
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    • pp.117-123
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    • 2012
  • This paper discusses two different techniques used to measure the mechanical properties of thin films: the bulge test and the nanoindentation test. In the bulge test, a uniform pressure is applied to one side of the film. Measurement of the membrane deflection as a function of the applied pressure allows one to determine the mechanical properties such as Young's modulus, and the residual stress. A nanoindentation test is performed by pushing an indenter tip into the specimen and then withdrawing it, and then recording the indentation force as a function of the indenter position. A modified King's model is used to estimate the mechanical properties of the thin film in order to avoid the effects of the substrate layers. A combination of both the bulge test and the nanoindentation test can determine both Young's modulus and Poisson's ratio simultaneously.