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http://dx.doi.org/10.6117/kmeps.2020.27.3.083

Elastic Properties Evaluation of Thin Films on Flexible Substrates with Consideration of Contact Morphology in Nanoindentation  

Kim, Won Jun (School of Materials Science & Engineering, Research Center for Energy and Clean Technology, Andong National University)
Hwang, Gyeong-Seok (Department of Materials Science and Engineering, UNIST(Ulsan National Institute of Science and Technology))
Kim, Ju-Young (Department of Materials Science and Engineering, UNIST(Ulsan National Institute of Science and Technology))
Kim, Young-Cheon (School of Materials Science & Engineering, Research Center for Energy and Clean Technology, Andong National University)
Publication Information
Journal of the Microelectronics and Packaging Society / v.27, no.3, 2020 , pp. 83-88 More about this Journal
Abstract
The evolution of smartphones has led to numerous researches in the mechanical behavior of flexible devices. Due to the nano-size of the thin flexible film, nanoindentation is widely used to evaluate its mechanical behaviors, such as elastic modulus, and hardness. However, the commonly used Oliver-Pharr method is not suited for analyzing the indentation force-depth curves of hard films on soft substrates, as the effects of soft substrate is not considered theoretically. In this study, the elastic modulus of the thin film was evaluated with references to other reported models which include the substrate effect, and with calibration of the indentation depth for the pile-ups between the indenter and test surface. We fabricated test samples by deposition of amorphous metal film on polyimide and silicon wafers for verification of modified models.
Keywords
Elastic modulus; Nanoindentation; Thin film; pile-up;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
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