• Nuclear Engineering and Technology
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• v.55 no.11
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• pp.4238-4245
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• 2023

In order to predict the lifetime of InP Heterojunction Bipolar Transistor (HBT) devices and related circuits in the space radiation environment, a novel model including gamma radiation effects is proposed in this paper. Based on the analysis of radiation-induced device degradation effects including both DC and AC characteristics, a set of empirical expressions describing the device degradation trend are presented and incorporated into the Keysight model. To validate the effective of the proposed model, a series of radiation experiments are performed. The correctness of the novel model is validated by comparing experimental and simulated results before and after radiation.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.51 no.11
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• pp.546-550
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• 2002

In this paper, Heterojunction phototransistors(HPT's) with an optically transparent ITO emitter contacts were fabricated. The ITO ohmic contacts were realized by employing thin imdium layer between the ITO and $n^+$-InP layers. The ITO contact was annealed at $250^{\circ}C$. The specific contact resistance of about $6.6{\times}10^{-4}{\Omega}cm^2$ was measured by use of the transmission line model (TLM). Heterojunction bipolar transistors (HBTs) having the same device layout were fabricated to compare with HPTs. The DC characteristics of the InP/InGaAs HPT showed the similar electrical characteristics of the HBT. Emitter contact resistance($R_E$) of about $6.4{\Omega}$ was extracted, which was very similar to that of the HBT. The optical characteristics of HPT's were generated by illuminating the device with light from $1.3{\mu}m$ light. It showed that HPT's can be controlled optically.

• JSTS:Journal of Semiconductor Technology and Science
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• v.3 no.1
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• pp.33-41
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• 2003

In this work, process optimization techniques for high frequency performance of HBTs are presented. The techniques are focused on reducing parasitic base resistance and base-collector capacitance, which are key elements determining the high frequency characteristics of HBTs. Several fabrication techniques, which can significantly reduce the parasitic elements of the HBTs for improved high frequency performance, are proposed and verified by the measured data of the fabricated devices.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.162-162
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• 2010

InAs 는 광전자 및 광통신 소자에 널리 이용되는 $In_xGa_{1-x}As_yP_{1-y}$ 화합물의 endpoint 로서, Heterojunction Field-Effect Transistors (HEMTs), Heterojunction Bipolar Transistor (HBT) 등에 중요하게 이용되고, 다양한 소자의 기판으로도 폭넓게 사용되는 물질이다. InAs 의 반도체 소자로의 응용을 위해서는 정확한 광 특성과 밴드갭 값들이 필수적이며, 분광타원편광분석법(ellipsometry) 을 이용한 상온 InAs 유전율 함수는 이미 정확히 알려져 있다. 그러나 상온에서는 $E_2$ 전이점 영역에서 여러 개의 밴드갭들이 중첩되어 있어, 밴드구조계산 등에 필수적인 InAs의 전이점을 정확히 정의하기 어렵다. 또한, 현재의 산업계에서 중요하게 여겨지는 실시간 모니터링을 위해서는 증착온도에서의 유전율 함수 데이터베이스가 필수적이다. 이와 같은 필요성에 의해, 22 K - 700 K 의 온도범위에서 InAs 의 유전율 함수와 밴드갭 에너지에 대한 연구를 수행하였다. InAs bulk 기판을 methanol, acetone, DI water 등으로 세척 한 뒤, 저온 cryostat 에 부착하였다. 분광타원분석법은 표면의 오염에 매우 민감하기 때문에, 저온에서의 응결 방지를 위해 고 진공도를 유지하며, 액체 헬륨으로 냉각하였다. 0.7 - 6.5 eV 에너지 영역에서 측정이 가능한 분광타원편광분석기로 측정한 결과, 온도가 증가함에 따라 열팽창과 phonon-electron 상호작용효과의 증가에 의해, 밴드갭 에너지 값의 적색 천이와 밴드갭들의 중첩을 관찰 할 수 있었다. 정확한 밴드갭 에너지 값의 분석을 위하여 2계 미분을 통한 표준 밴드갭 해석법을 적용하였으며, 22 K 의 저온에서는 $E_2$ 전이점 영역에서 중첩된 여러 개의 밴드갭들을 분리 할 수 있었다. 또한 고온에서의 연구를 통해, 실시간 분석을 위한 InAs 유전함수의 데이터베이스를 확립하였다. 본 연구의 결과는 InAs 를 기반으로 한 광전자 소자의 개발 및 적용분야와 밴드갭 엔지니어링 분야에 많은 도움이 될 것으로 예상한다.

• Nuclear Engineering and Technology
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• v.51 no.5
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• pp.1428-1435
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• 2019

The total ionizing dose (TID) and non ionizing energy loss (NIEL) effects of 100 MeV phosphorous ($P^{7+}$) and 80 MeV nitrogen ($N^{6+}$) ions on 200 GHz silicon-germanium heterojunction bipolar transistors (SiGe HBTs) were examined in the total dose range from 1 to 100 Mrad(Si). The in-situ I-V characteristics like Gummel characteristics, excess base current (${\Delta}I_B$), net oxide trapped charge ($N_{OX}$), current gain ($h_{FE}$), avalanche multiplication (M-1), neutral base recombination (NBR) and output characteristics ($I_C-V_{CE}$) were analysed before and after irradiation. The significant degradation in device parameters was observed after $100MeV\;P^{7+}$ and $80MeV\;N^{6+}$ ion irradiation. The $100MeV\;P^{7+}$ ions create more damage in the SiGe HBT structure and in turn degrade the electrical characteristics of SiGe HBTs more when compared to $80MeV\;N^{6+}$. The SiGe HBTs irradiated up to 100 Mrad of total dose were annealed from $50^{\circ}C$ to $400^{\circ}C$ in different steps for 30 min duration in order to study the recovery of electrical characteristics. The recovery factors (RFs) are employed to analyse the contribution of room temperature and isochronal annealing in total recovery.

• Proceedings of the Korea Association of Crystal Growth Conference
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• 1996.06a
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• pp.422-448
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• 1996

Low-temperature epitaxial growth of Si and SiGe layers of Si is one of the important processes for the fabrication of the high-speed Si-based heterostructure devices such as heterojunction bipolar transistors. Low-temperature growth ensures the abrupt compositional and doping concentration profiles for future novel devices. Especially in SiGe epitaxy, low-temperature growth is a prerequisite for two-dimensional growth mode for the growth of thin, uniform layers. UHV-ECRCVD is a new growth technique for Si and SiGe epilayers and it is possible to grow epilayers at even lower temperatures than conventional CVD's. SiH and GeH and dopant gases are dissociated by an ECR plasma in an ultrahigh vacuum growth chamber. In situ hydrogen plasma cleaning of the Si native oxide before the epitaxial growth is successfully developed in UHV-ECRCVD. Structural quality of the epilayers are examined by reflection high energy electron diffraction, transmission electron microscopy, Nomarski microscope and atomic force microscope. Device-quality Si and SiGe epilayers are successfully grown at temperatures lower than 600℃ after proper optimization of process parameters such as temperature, total pressure, partial pressures of input gases, plasma power, and substrate dc bias. Dopant incorporation and activation for B in Si and SiGe are studied by secondary ion mass spectrometry and spreading resistance profilometry. Silicon p-n homojunction diodes are fabricated from in situ doped Si layers. I-V characteristics of the diodes shows that the ideality factor is 1.2, implying that the low-temperature silicon epilayers grown by UHV-ECRCVD is truly of device-quality.