• 전자공학회논문지D
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• 제35D권6호
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• pp.79-91
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• 1998

Escape cone 개념에 바탕을 둔 구조 해석을 통해 고휘도 LED의 설계 이론을 확립하였다. 확립된 설계이론에 근거하여 최근까지 개발된 중요한 고휘도 LED의 구조들을 비교/분석하였으며, 각각의 구조에서 출력결합효율을 대략적으로 계산하였다. Ohmic전극 영역에서의 광자 손실이 매우 심각한 것으로 알려진 AlGaAs 또는 InGaAIP LED의 경우, window layer(WL)와 transparent substrate(TS)를 활용하게 되면 전극에 의한 광자의 차폐효과가 크게 감소되어 발광효율이 크게 개선된다. 청색으로부터 녹색까지 상당히 넓은 영역에 걸친 발광특성을 갖는 InGaN LED 경우의 중요한 차이점의 하나는 WL를 사용하지 않으면서도 괄목할만한 발광효율을 얻어 낼 수 있다는 사실인데, 그 원인은 GaN와 같은 넓은 bandgap을 갖는 반도체의 경우 ohmic 전극에서의 광자의 손실이 상대적으로 미미하며 그 결과로 전극에 의한 광자의 차폐현상이 상대적으로 큰 문제가 되지 않기 때문인 것으로 분석된다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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• pp.313-313
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• 2012

In recent years there have been many studies of InGaN/GaN based light emitting diodes (LEDs) in order to progress the performance of luminescence. Many previous literatures showed the performance of LEDs by changing the LED structures and substrates. However, the studies carried out by the researchers so far were very complicated and sometimes difficult to apply in practice. Therefore, we propose one simple method of changing the thickness and the numbers of multiple quantum wells (MQWs) in order to optimize their effects. In our research, we investigated electrical and optical properties by changing the well thickness and the number of quantum well (QW) pair in LED structures by growing the structure -inch Si (111) wafer. We defined the samples from LED_1 to LED_3 according to MQW structure. Samples LED_1, LED_2 and LED_3 consist of 5-pair InGaN/GaN (3.5 nm/ 4.5 nm), 5-pair InGaN/GaN (3 nm/4.5 nm) and 7-pair InGaN/GaN (3.5 nm/4.5 nm), respectively. We characterized electrical and optical properties by using electroluminescence (EL) measurement. Also, Efficiency droop was analyzed by calculating external quantum efficiency (EQE) with varying injection current. The EL spectra of three samples show different emission wavelength peaks, FWHM and the blueshift of wavelength caused by screening the internal electric field because of the effect of different MQW structure. The results of optical properties show that the LED_2 sample reduce the internal electric field in QW than LED_1 from EL spectra. the increase in the number of QW pairs reduces the strain and increase the In composition in MQW. And, the points of efficiency droop's peak show different trend from LED_1 to LED_3. It is related with the carrier density in active region. Thus, from the results of experiments, we are able to achieve high performance LEDs and a reduction of efficiency droop and emission wavelength blueshift by optimizing MQWs structure.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2004년도 Asia Display / IMID 04
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• pp.676-678
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• 2004

In order to develop new yellow phosphor that emit efficiently under the 450 - 470 nm excitation range, we have synthesized a $Eu^{2+}$-activated $Sr_3SiO_5$ yellow phosphor and investigated an attempt to develop white LEDs by combining it with a InGaN blue LED chip (460 nm). Two distinct emission bands from the InGaN-based LED and the $Sr_3SiO_5$:Eu phosphor are clearly observed at 460 nm and at 570 nm, respectively. These two emission bands combine to give a spectrum that appears white to the naked eye. Our results showed that InGaN (460 nm chip)-based $Sr_3SiO_5$:Eu exhibits a better luminous efficiency than that of the industrially available product InGaN (460 nm chip)-based YAG:Ce.

• 한국진공학회지
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• 제17권3호
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• pp.211-214
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• 2008

Metal organic chemical vapor deposition (MOCVD)를 이용하여 사파이어 기판 위에 405 nm의 파장을 갖는 GaN light-emitting diode (LED)를 제작하였다. LED의 InGaN 활성층에서 생성되어 칩의 후면으로 향하는 광자를 전면으로 반사시키기 위하여, 사파이어 기판 후면에 반사막을 증착하였다. 반사막으로는 Al을 사용하였으며, 사파이어 기판에 대한 Al 박막의 접착력을 개선하기 위하여 사파이어 기판 후면에 Ti를 먼저 증착한 후에 Al을 증착하였다. Ti-Al 반사막을 채용한 결과, 광추출 효율이 52 % 향상되었다.

• 한국산학기술학회논문지
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• 제10권7호
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• pp.1514-1519
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• 2009

400nm 파장을 방출하는 GaN LED를 제조하여, n-GaN층과 p-GaN층의 위에 있는 ITO층 표면에 패턴을 만들어 광 추출 효율을 향상시켰다. 추가적으로, n과 p패드 아래와 칩의 바닥면에 각각 광반사 금속을 설치하였다. 광 추출 효율은 20mA에서 n-GaN의 텍스쳐링에 의해 20% 증가되었고 ITO의 텍스쳐링에 의해 18% 증가되었다. 표면 처리가 않된 LED와 비교해서 n-GaN와 ITO를 함께 표면 텍스쳐링 했을때의 광 추출 효율은 20mA에서 32% 증가되었다.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2006년도 하계종합학술대회
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• pp.575-576
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• 2006

It was analyzed qualitatively the light extraction in GaN-on-sapphire LEDs based on a simple model. The light extraction efficiency in the LEDs is simulated numerically by using ray tracing method. In the present study, the extraction efficiency was simulated on three different types of LEDs, which a have a different pattered sapphire substrate. And, the role of the patterned sapphire substrate are analyzed and discussed. Based on the analysis, the improvements of extraction efficiency in the LED structures were discussed and these analyses are helpful in the design of high brightness GaN LEDs.

• 한국전기전자재료학회논문지
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• 제18권11호
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• pp.1056-1060
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• 2005

We investigated the fabrication and characteristics of the nitride-based spin-polarized LEDs with room-temperature ferromagnetic (Ga,Mn)N layer as a spin injection source. The (Ga,Mn)N thin films having room-temperature ferromagnetic ordering were found to exhibit the negative MR and anomalous Hall resistance up to room temperature, revealing the existence of spin-polarized electrons in (Ga,Mn)N films at room temperature. The electrical characteristics in the spin LEDs did not degraded in spite of the insertion of the (Ga,Mn)N layer into the LED structure. In EL spectra of the spin LEDs, it is confirmed that the devices produce intense EL emission at 7 K as well as room temperature. These results are expected to open up new opportunities to realize room-temperature operating semiconductor spintronic devices.

• 대한전자공학회논문지SD
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• 제44권4호
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• pp.91-96
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• 2007

사파이어 기반의 GaN LED의 광추출 효율을 시뮬레이션을 이용하여 정량적으로 평가하였다. 각각의 LED는 ray-tracing 시뮬레이션을 이용하여 광추출 효율을 계산하였다. 본 연구에는 PSS(patterned sapphire substrate) LED와 flat LED의 비교 분석을 통하여, LED에서의 사파이어 기판의 패턴이 광추출에 미치는 영향을 설명하였다. 또한, 각각의 칩에서 반사막의 반사도가 광추출에 미치는 영향을 분석하고, 그 원인을 시뮬레이션을 이용하여 설명하였다. 한편, 사파이어 패턴에 의한 광추출효율의 변화 효과를 공기(air)와 실리콘(silicone) 분위기에서 시뮬레이션을 수행하였다. 이러한 시뮬레이션 기술을 통해 광추출 효율의 개선 정도를 정량적으로 평가할 수 있었으며, 이러한 연구가 향후 고효율 LED 개발에 도움을 줄 것으로 판단된다.

• 한국전기전자재료학회논문지
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• 제15권5호
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• pp.441-448
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• 2002

The electrical properties of the GaN-based green light emitting diodes(LEDs) with the Mg-doped p-GaN layer activated in $N_2$ or $O_2$ ambient have been compared. For the $N_2$ -ambient activation the current-voltage behavior of LEDs has been found to be improved when the Mg dopants activation was performed in the higher temperature. However, for the $O_2$-ambient activation the current-voltage characteristic has been observed to be enhanced when the Mg dopants activation was carried out in the lower temperature. The minimum forward voltage at 20mA was obtained to be 4.8 V for LEDs with the p-GaN layer activated at $900^{\circ}C$ in the $N_2$ ambient and 4.5V for LEDs with the p-GaN layer treated at $700^{\circ}C$ in the $O_2$ambient, repectively. The forward voltage reduction of the LEDs treated in the $O_2$-ambient may be related to the oxygen co-doping of the p-GaN layer during the activation process. The $O_2$ -ambient activation process is useful for the enhancement of the LED performance as well as the fabrication process since this process can activate the Mg dopants in the low temperature.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.312-312
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• 2013

GaN based light emitting diodes (LEDs) are important devices that are being used extensively in our daily life. For example, these devices are used in traffic light lamps, outdoor full-color displays and backlight of liquid crystal display panels. To realize high-brightness GaN based LEDs for solid-state lighting applications, the development of p-type ohmic electrodes that have low contact resistivity, high optical transmittance and high refractive index is essential. To this effect, indiumtin oxide (ITO) have been investigated for LEDs. Among the transparent electrodes for LEDs, ITO has been one of the promising electrodes on p-GaN layers owing to its excellent properties in optical, electrical conductivity, substrate adhesion, hardness, and chemical inertness. Sputtering and e-beam evaporation techniques are the most commonly used deposition methods. Commonly, ITO films on p-GaN by sputtering have better transmittance and resistivity than ITO films on p-GaN by e-bam evaporation. However, ITO films on p-GaN by sputtering have higher specific contact resistance, it has been demonstrated that this is due to possible plasma damage on the p-GaN in the sputtering process. In this paper, we have investigated the advanced sputtering using plasma damage-free p-electrode. Prepared the ITO films on the GaN based LEDs by e-beam evaporation, normal sputtering and advanced sputtering. The ITO films on GaN based LEDs by sputtering showed better transmittance and sheets resistance than ITO films on the GaN based LEDs by e-beam evaporation. Finally, fabricated of GaN based LEDs by using advanced sputtering. And compared the electrical properties (measurement by using C-TLM) and structural properties (HR-TEM and FE-SEM) of ITO films on GaN based LEDs produced by e-beam evaporation, normal sputtering and advanced sputtering. As a result, It is expected to form plasma damage free-electrode, and better light output power and break down voltage than LEDs by e-beam evaporation and normal sputter.