• 수산해양교육연구
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• 제26권1호
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• pp.34-48
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• 2014

Marine algal assemblages on the artificial reefs at three stations (Haengwon, Geumneung, Pyoseon in Jeju-do) and the growth pattern of Ecklonia cava with water depth were studied before and after rocky cleaning. Nine algal species occurred at three artificial reefs before rocky cleaning in July 2012, however, 19 algal species were found at three artificial reefs after rocky cleaning in July 2013. In particular, 13 of 19 species in 2013 were replaced by different species which were not found in July 2012. Algal biomass rapidly increased in July 2013 after rocky cleaning. The nMDS plot based on the presence and absence data of macro-algal assemblages on the artificial reefs showed that the species compositions between artificial reefs were similar to each other before rocky cleaning operations in July of 2012. However, after rocky cleaning, the species composition of macro-algal assemblages in Haengwon region was similar to that in Pyoseon region while that in Geumneung region was different to those in Haengwon and Pyseon regions in July 2013. It is needed to clarify the suitable water depth for transplantation of perennial Phaeophyta E. cava. According to the data on seasonal changes in total length, total weight, blade length, blade width, blade weight of E. cava, it began to grow rapidly from April and reached to the maximum value in June, and then degeneration of the blade occurred in July and continued to early August. Although the total length of E. cava at 10m water depth was larger than those at 5 m and 15 m water depths, there was no significant difference statistically among water depths by ANOVA test. However, in the values of total weight, blade length, blade width, and blade weight, the growth patterns at 5 m water depth were larger than those at 10 m and 15 m. Thus, it is assumed that the most suitable water depth for transplantation and its maximum growth and effective release of zoospores of E. cava will be 7~10 m water depth.

• 상하수도학회지
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• 제13권1호
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• pp.140-145
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• 1999

This study was carried out a investigate the effect of chemical cleaning of corrosion product in cooling system made of copper and copper alloy as basic material and used cooling water as pure water. We studied chemical cleaning condition that minimizes the influence on basic material by means of EDTA solution so as to eliminate the slurry in cooling system. As a result, we found that the main components of sludge in cooling system produced by corrosion of copper were $Cu_2O$, CuO, Cu, and Fe. The optimum condition of chemical cleaning was 400 ppm EDTA solution at $60^{\circ}C$.

• 한국해양생명과학회지
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• 제9권1호
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• pp.1-8
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• 2024

Over the past decade, there has been global expansion in the advancement of underwater cleaning technology for ship hulls. This methodology ensures both diver safety and operational efficiency. However, recent attention has been drawn to the harmful effects of ship hull-cleaning wastewater on marine animals. It is anticipated that this wastewater may have various impacts on a wide range of organisms, potentially leading to populationand ecosystem-relevant alterations. This concern is especially significant when the wastewater affects functionally important species, such as aquaculture animals and habitat-forming species living in coastal regions, where underwater cleaning platforms are commonly established. Despite this, information on the ecotoxicological effects of this wastewater remains limited. In this mini review, we discuss the adverse effects of wastewater from in-water cleaning processes, as well as the current challenges and limitations in regulating and mitigating its potential toxicity. Overall, recent findings underscore the detrimental effects posed by sublethal levels of wastewater to the health status of aquatic animals under both acute and chronic exposure.

• 한국환경과학회지
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• 제25권6호
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• pp.817-827
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• 2016

The resistance in series model has been frequently used for determination of various filtration resistance to correctly understand the membrane fouling behaviour in MBR (membrane bio-reactor) for wastewater treatment. The cake layer resistance ($R_c$) which is commonly determined by calculation of flux dataset that are obtained empirically before and after removing the cake layer on membrane surface. However, the calculated Rc values are very dependent on the cleaning methods adapted for removal of cake layer. This study investigated how the various cleaning options affect $R_c$. Seven different cleaning methods were employed: i) ultrasonication (100 W, 10 min), ii) ultrasonication (200 W, 60 min), iii) ultrasonication (400 W, 120 min), iv) water rinsing in a shaker (100 rpm, 10 min), v) water rinsing in a shaker (300 rpm, 60 min), vi) water rinsing, vii) sponge scrubbing. For the hydrophilic PES membrane, the cake layer removal efficiencies ranged from 64% to 10%, indicating that the removal of cake layer was highly dependent on the cleaning options. For the hydrophobic PVDF membrane, the cake layer removal efficiencies ranged from 79% to 97%. Consequently, a standardized method for cake layer removal to determine cake resistance ($R_c$) is needed for correct interpretation of the fouling phenomena.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제52권12호
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• pp.579-585
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• 2003

Recently the utilization of the ozone dissolved de-ionized water(DI-O3 water) in semiconductor wet cleaning process to replace the conventional RCA methods has been studied. In this paper, we propose the water-electrode type ozone generator which has the ozone gas characteristics of the high concentration and high purity to produce the high concentration DI-O3 water for the silicon wafer surface cleaning process. The ozone generator has the dual dielectric tube structure of silent discharge type and the water is both used to electrode and cooling water. We investigate the performance of the proposed ozone generator which has the design goal of the concentration of 7[wt%] and ozone generation quantity of 6[g/hr] at flow rate of 1[$\ell$/min). The experiment results show that the water electrode type ozone generator has the characteristics of 8.48[wt%] of concentration, 8.08[g/hr] of generation quantity and 76.2[g/kWh] of yield and it's possible to use the proposed ozone generator for the DI-O3 water cleaning process of silicon wafer surface.

• 상하수도학회지
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• 제25권3호
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• pp.399-405
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• 2011

In a desalination technology using RO membranes, chemical cleaning makes damage for membrane surface and membrane life be shortened. In this research cleaning technology using direct osmosis (DO) was introduced to apply it under the condition of high pH and high concentration of feed. When the high concentration of feed is injected to the concentrate side after release of operating pressure, then backward flow occurred from treated water toward concentrated for osmotic pressure. This flow reduces fouling on the membrane surface. Namely, flux of DO was monitored under pH 3, 5, 10 and 12 conditions at feed concentrations of NaCl 40,000 mg/L, 120,000 mg/L and 160,000 mg/L. As a result, DO flux in pH 12 increased about 21% than pH 3. DO cleaning was performed under the concentrate NaCl 160,000 mg/L of pH 12 during 20 minutes. Three kinds of synthetic feed water were used as concentrates. They consisted of organic, inorganic and seawater; chemicals of SiO2 (200 mg/L), humic acid (50 mg/L) sodium alginate (50 mg/L) and seawater. As a result, fluxes were recovered to 17% in organic fouling, 15% in inorganic fouling and 14% of seawater fouling after cleaning using DO under the condition of concentrate NaCl 160,000 mg/L of pH 12.

• 청정기술
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• 제7권3호
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• pp.215-223
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• 2001

A present semiconductor cleaning technology is based upon RCA cleaning technology which consumes vast amounts of chemicals and ultra pure water(UPW) and is the high temperature process. Therefore, this technology gives rise to the many environmental issues, and some alternatives such as electrolyzed water(EW) are being studied. In this work, intentionally contaminated Si wafers were cleaned using the electrolyzed water. The electrolyzed water was generated by an electrolysis system which consists of three anode, cathode, and middle chambers. Oxidative water and reductive water were obtained in anode and cathode chambers, respectively. In case of NH4Cl electrolyte, the oxidation-reduction potential and pH for anode water(AW) and cathode water(CW) were measured to be +1050mV and 4.8, and -750mV and 10.0, respectively. AW and CW were deteriorated after electrolyzed, but maintained their characteristics for more than 40 minutes sufficiently enough for cleaning. Their deterioration was correlated with CO2 concentration changes dissolved from air. Contact angles of UPW, AW, and CW on DHF treated Si wafer surfaces were measured to be $65.9^{\circ}$, $66.5^{\circ}$ and $56.8^{\circ}$, respectively, which characterizes clearly the eletrolyzed water. To analyze the amount of metallic impurities on Si wafer surface, ICP-MS was introduced. It was known that AW was effective for Cu removal, while CW was more effective for Fe removal. To analyze the number of particles on Si wafer surfaces, Tencor 6220 were introduced. The particle distributions after various particle removal processes maintained the same pattern. In this work, RCA consumed about $9{\ell}$ chemicals, while EW did only $400m{\ell}$ HCl electrolyte or $600m{\ell}$ NH4Cl electrolyte. It was hence concluded that EW cleaning technology would be very effective for promoting environment, safety, and health(ESH) issues in the next generation semiconductor manufacturing.

• 전기학회논문지
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• 제61권1호
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• pp.94-98
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• 2012

The behavior of ozone micro bubble cleaning system was investigated to evaluate the solution as a new method of solar cell wafer cleaning in comparison with former conventional RCA cleaning. We have developed the ozone dissolution system in the ozonated water for more efficient cleaning conditions. The optimized cleaning conditions for solar cell wafer process were 10 ppm of ozone concentration and 12 minutes in cleaning periods, respectively. We have confirmed the cleaning reliability and cell efficiencies after ozone micro bubble cleaning. Using this new cleaning technology, it was possible to obtain higher efficiency, higher productivity, and fast tact time for applying cleaning in the fields on bare ingot wafer, LED wafers as well as the solar cell wafer.

• Korean Chemical Engineering Research
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• 제40권6호
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• pp.769-777
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• 2002

Nonionic surfactant/water/탄화수소 오일/alcohol의 4성분계 시스템에서 12종의 조성물을 제조하여 물성 평가를 수행한 결과, 30.5-31.1 dyne/cm의 낮은 표면장력의 값과, 1.6-7.2 c.p.의 낮은 점도의 물성을 보여 산업용 세정제로서의 기본 물성을 보여주었다. 이들 조성물들이 안정한 단일상으로 존재하는 온도의 범위는 alcohol/surfactant(A/S)비의 증가에 따라 감소되는 경향을 보이고 있으나, 전체적으로는 계면활성제의 hydrophilic lipophilic balance(HLB) 값에 크게 영향을 받고 있으며, HLB 값이 높을수록 안정하게 존재하는 온도 영역이 증가되는 경향을 보여주고 있다. 그리고 각각의 조성물에 물의 함량을 증가 시켜 안정한 단일상이 유지되는 물의 최대 함유량을 측정한 결과 HLB 값이 낮은 계면활성제를 사용하였을 경우 HLB 값이 6.4인 비이온 계면활성제를 사용할 경우 22.1%까지도 물을 함유할 수 있었고, 물의 양이 증가됨에 따라서 단일상으로 존재하는 온도영역은 좁아졌다. 오염원으로 플럭스 제조에 사용되는 abietic acid에 대한 세정 효율을 UV/Visable Spectrophotometer와 FT-IR Spectrometer와 같은 분석기기를 이용하여 검토하여 본 결과, 비이온 계면활성제의 HLB 값이 낮을수록 높은 세정 효율을 보여주어, W/O microemulsion의 경우 비이온 계면활성제에 따른 세정력의 변화가 매우 큼을 확인 할 수 있었다. 그러나 A/S의 비가 증가에 따른 세정효율의 차이는 별다른 경향을 보이지 않았다. 또한 산업세정에 있어서 중요한 세정 요소로 작용하는 변수인 온도 변화와 초음파 주파수의 변화에 따른 세정효율을 측정한 결과, 온도가 높을수록 그리고 초음파의 주파수가 낮을수록 높은 세정력을 보여주었다. 세정 공정 중 린스조에서의 유분 오염물이 함유된 린스액의 유수분리 효율을 측정한 결과, HLB 값이 6.4인 비이온 계면활성제를 사용한 시스템의 경우 $25^{\circ}C$ 이상에서 85% 이상의 높은 제거 효율을 보여, 효율적인 세정 및 관리가 가능한 것으로 판단되었다.

• 한국지반신소재학회논문집
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• 제23권2호
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• pp.63-75
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• 2024

마시는 물은 인간의 기본적인 생활권 보장을 위한 필수적 요소로 깨끗한 물에 대한 품질은 항상 확보되어야 한다. 하지만 국내 수도시설을 집중 설치하였던 2000년 초반을 기점으로 현재 노후 상수도 시설이 증가하고 있으며, 색도 및 탁도와 같은 물의 변색, 이물질 누출 등의 사고가 빈번히 발생하고 있다. 실제로 모든 관의 교체는 불가능하기 때문에 2021년 제정된 상수관망시설 유지관리업무 세부기준에서는 상수관 세척을 의무화 하였으며, 다양한 세척 공법들을 통해 유지관리가 이루어지고 있는 실정이다. 상수관 세척 공법 중 스왑피그 공법은 관 내 이물질을 물리적으로 제거하는 방법으로 세척 효율이 가장 높은 것으로 평가 받고 있다. 하지만, 세척과정에서 스왑피그의 파손 및 변형에 따라 세척 효율은 변화하며, 분실의 가능성이 존재한다. 따라서 본 연구에서는 피그 자체의 재료를 변경하여, 압축력 및 관 내벽과의 밀착력을 향상시키고자 하며, 세척 효율 극대화를 위해 회전 블레이드를 삽입된 회전식 스왑피그를 개발하였다. 또한, 분실 가능성을 제거하고, 피그의 위치 파악을 위해 고강도 와이어 및 권취 장치를 추가적으로 개발하여, 투입구부터 토출구까지를 연결하였다. 각 세부 기술의 성능 검증 이후에는 30m 구간의 테스트베드에서 본 기술을 적용하였으며, 현장 적용성 평가와 더불어 공정 시간을 측정하여 기술의 성능을 검증하였다.