• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.3 no.2
• /
• pp.74-79
• /
• 2002

In the a rapid changes of the semiconductor manufacturing technologies for early 21st century, it may be safely said that a kernel of terms is the size increase of Si wafer and the size decrease of semiconductor devices. As the size of Si wafers increases and semiconductor device is miniaturized, the units of cleaning processes increases. A present cleaning technology is based upon RCA cleaning which consumes vast chemicals and ultra pure water (UPW) and is the high temperature process. Therefore, this technology gives rise to the environmental issue. To resolve this matter, candidates of advanced cleaning processes has been studied. One of them is to apply the electrolyzed water. In this work, Compared with surface on Si wafer with electrolyzed water cleaning and various chemicals cleaning, and analyzed Si wafer surface condition treated with elecoolyzed water by cleaning temperature and cleaning time. Especially. concentrate upon the contact angle. finally, contact angle on surface treated with cathode water cleaning is 17.28, and anode water cleaning is 34.1.

• Journal of Korean Society of Water and Wastewater
• /
• v.29 no.2
• /
• pp.233-241
• /
• 2015

Polytetrafluoroethylene (PTFE) membrane has high resistance to chlorine, which is a great advantages in chemical cleaning to recover water flux during membrane processes in drinking water systems. A humic kaolin water with approximately 4 mg/L of DOC and 10 NTU of turbidity was prepared as a feed water. Coagulation pretreatment with or without settling was applied. The coagulation with settling showed the greatest water production. The reduced flux was effectively recovered by NaOCl cleaning, i.e., 21% recovery by 50 mg/L of NaOCl cleaning and 49% recovery by 500 mg/L NaOCl cleaning. The images of SEM and AFM analyses were corresponded to the water flux variation. However, when the floc was accumulated on the membrane surfaces, the efficiency of NaOCl cleaning was substantially limited. In addition, dynamic contact angle became greater after cleaning, which indicates changes in characteristics of fouling layer such as surface hydrophobicity. Proper cleaning technologies during enhanced backwash using NaOCl would expand application of PTFE membranes in drinking water systems.

• Journal of the Semiconductor & Display Technology
• /
• v.11 no.3
• /
• pp.7-11
• /
• 2012

Among various wet cleaning methods, megasonic and jet spray gained their popularity in single wafer cleaning process for the efficient removal of particulate contaminants from the wafer surface. In the present study, we evaluated these two cleaning methods for particle removal efficiency (PRE) and pattern damage on the aluminum layered wafer surface. Also the effect of $CO_2$ dissolved water in jet spray cleaning is assessed by measuring PRE. It is observed that the jet spray cleaning process is more effective in terms of PRE and pattern damage compared to megasonic cleaning and the mixing of $CO_2$ in the water during jet sprays further increases the PRE. We believe that the outcome of the present study is useful for the semiconductor cleaning process engineers and researchers.

• Journal of the Semiconductor & Display Technology
• /
• v.20 no.2
• /
• pp.34-42
• /
• 2021

Recent cleaning technologies of mask in extremely ultraviolet semiconductor processes were reviewed, focused on newly developed issues such as particle size determination or hydrocarbon and tin contaminations. In detail, critical particle size was defined and proposed for mask cleaning where nanosized particles and its various shapes would result in surface atomic ratio increase vigorously. A new cleaning model also was proposed with amphoteric behavior of electrolytically ionized water which had already shown excellent particle removing efficiency. Having its non-equilibrium and amphoteric properties, electrolyzed ion water seemed to oxidize contaminant surface selectively in nano-scale and then to lift up oxidized ones from mask surface very effectively. This assumption should be further investigated in future in junction with hydrogen bonding and cluster of water molecules.

• Journal of the Korean Society of Costume
• /
• v.54 no.1
• /
• pp.1-10
• /
• 2004

The purpose of this study was to compare the efficiency of four different cleaning method of silk and to fabrics, which were excavated from the sixteenth century tombs. The four cleaning methods were hand washing in water and hand washing in solvent, washing in ultrasonic cleaner, and using of ultrasonic gun after washing in ultrasonic cleaner. The following is the result of the experiment: ㆍBoth silk and jute fabrics shrank the most after hand-wash in water. This cleaning method decreased their thickness the most but changed their strength the least. However, the color of the fabric changed the most after had-wash in water. This washing method might discolor the dyed fabric, so one must check the condition of the fabric thoroughly before washing it. ㆍThe weight and the thickness of the fabric changed little after ultrasonic cleaning. This cleaning method, therefore. is less efficient than hand-water-wash. The use of ultrasonic gun after ultrasonic wash for partial cleansing enhanced the efficiency a little. Nevertheless, this method left stain around the area where the gun was used, and the injected water could damage the fabric. ㆍThe excavated fabric became softer in the cleaning process as the dirt was washed away. In both cases of silk and jute fabrics cleaning, solvent made the fabric softer than water. Washed in solvent, the fabric did not swell. But water penetrated to the fiber during the cleaning process and made the fabric swell. When the water evaporates, the swollen fiber structure collapses and the fabric become stiff. Ultrasonic wash did not cause much change in the flexibility of the fabric, for this method does not remove the dirt as effectively as the other method.

• Clean Technology
• /
• v.7 no.4
• /
• pp.225-242
• /
• 2001

Cleaning process is necessary for machining parts or manufacturing finished products in the industry. Most of domestic and foreign companies are now trying to adopt environment-friendly aqueous cleaning agents instead of CFC-113 and 1,1,1-TCE which are ozone-depleting substances. However, the aqueous cleaning system has a disadvantage due to its generation of lots of waste water since the system utilizes water in cleaning and rinsing processes. Thus, it is very important that monitoring and recycling technologies of the cleaning solution and the rinse water should be introduced in the aqueous cleaning system in order to minimize generation of waste water and to maintain its cleaning performance for a quite long time. In this paper, the cleaning agents utilized in the aqueous cleaning system and cutting oils which are main contaminants were examined and analyzed. And the monitoring and recycling technologies of the aqueous cleaning system which can be employed in the industrial fields were also reviewed and evaluated.

• Journal of Korean Society of Water and Wastewater
• /
• v.25 no.3
• /
• pp.285-291
• /
• 2011

Membrane fouling is an unavoidable phenomenon and major obstacle in the economic and efficient operation under sea water reverse osmosis (SWRO). When fouling occurs on the membrane surface, the permeate quantity and quality decrease, the trans-membrane pressure (TMP) and operation costs increase, and the membrane may be damaged. Therefore, chemical cleaning process is important to prevent permeate flow from decreasing in RO membrane filtration process. This study focused on proper chemical cleaning condition for Shuaibah RO plant in Saudi Arabia. Several chemical agents were used for chemical cleaning at different contact time and concentrations of chemicals. Also autopsy analysis was performed using LOI, FT-IR, FEEM, SEM and EDX for assessment of fouling. Specially, FEEM analysis method was thought as analyzing and evaluating tool available for selection of the first applied chemical cleaning dose to predict potential organic fouling. Also, cleaning time should be considered by the condition of RO membrane process since the cleaning time depends on the membrane fouling rate. If the fouling exceeds chemical cleaning guideline, to perfectly remove the fouling, certainly, the chemical cleaning is increased with membrane fouling rate influenced by raw water properties, pre-treatment condition and the point of the chemical cleaning operation time. Also choice of cleaning chemicals applied firstly is important.

• Journal of Korean Society of Water and Wastewater
• /
• v.24 no.1
• /
• pp.93-101
• /
• 2010

Reverse osmosis (RO) membranes have been widely used for desalination as well as water and wastewater treatment facilities. Cleaning process is important to maintain stable operation as well as prevention of membrane fouling. Purpose of this research is to analyze electrostatistic and chemical characteristics after cleaning of RO membrane against $SiO_2$ scale. Four RO membranes of polyamide are used and examined about effect of chemical cleaning. EDTA (ethylene diamine tetraacetic acid) and SDS (sodium dodecil sulfate) and NaOH are applied for cleaning process after operation in synthetic water. Then, cleaning was performed with chemicals such concentration as 6hr, 12hr and 24hr, respectively. As a result, transmittances of FT-IR of four membranes are compared at each cleaning concentration. Ta/Tv shows difference of chemical composition between new membrane and cleaning membrane after cleaning. Type B of RO membrane is turned out to be most vulnerable to cleaning among four membranes. In terms of zeta potential, new membrane has -16 mV to +6 mV on pH while scaled membrane has -18 mV to 2 mV. However, it changed -23mV to 0.9 mV after cleaning. In comparison with existing salt rejection of RO membranes after cleaning, the rejection of the membranes goes down 0.7% maximum. Though cleaning changes the characteristics of membrane surface, it does not greatly affect salt rejection. pH is a critical factor to flux change in PA (polyamide) membrane.

• Proceedings of the KAIS Fall Conference
• /
• 2001.05a
• /
• pp.124-128
• /
• 2001

A present semiconductor cleaning technology is based upon RCA cleaning technology which consumes vast amounts of chemicals and ultra pure water(UPW) and is the high temperature Process. Therefore, this technology gives rise to the many environmental issues, and some alternatives such as functional water cleaning are being studied. The electrolyzed water was generated by an electrolysis system which consists of anode, cathode, and middle chambers. Oxidative water and reductive water were obtained in anode and cathode chambers, respectively. In case of NH$_4$Cl electrolyte, the oxidation-reduction potential and pH for anode water(AW) and cathode water(CW) were measured to be +1050mV and 4.8, and -750mV and 10.0, respectively. AW and CW were deteriorated after electrolyzed, but maintained their characteristics for more than 40 minutes sufficiently enough for cleaning. Their deterioration was correlated with CO$_2$ concentration changes dissolved from air. It was known that AW was effective for Cu removal, while CW was more effective for Fe removal. The particle distributions after various particle removal processes maintained the same pattern. In this work, RCA consumed about 9$\ell$chemicals, while EW did only 400$m\ell$ HCI electrolyte or 600$m\ell$ NH$_4$Cl electrolyte. It was hence concluded that EW cleaning technology would be very effective for eliminating environment, safety, and health(ESH) issues in the next generation semiconductor manufacturing.

• The Journal of Korea Robotics Society
• /
• v.7 no.4
• /
• pp.243-251
• /
• 2012

In this paper, developing of a pool cleaning robot is addressed. First, we analyze commercial pool cleaning robot mechanisms, and the merits and demerits of wireless version of a pool cleaning robot is introduced. And then the water-jet moving mechanism for a pool cleaning robot is proposed to improve energy efficiency and mechanical design advantage, which is one of the strong candidates for wireless pool cleaning robots. Next, the method of cleaning performance evaluation of pool cleaning robots is firstly defined with five key factors, and it was verified by experimental results. If the cleaning performance can be quantitatively defined, we can design optimally a pool cleaning robot, which results in the cost down.