• Title/Summary/Keyword: In-water cleaning

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전리수를 이용한 Si 웨이퍼 표면 변화 연구 (A Study on Silicon Wafer Surfaces Treated with Electrolyzed Water)

  • 김우혁;류근걸
    • 한국산학기술학회논문지
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    • 제3권2호
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    • pp.74-79
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    • 2002
  • 80년대 반도체 산업의 급격한 성장으로 오늘날 반도체 산업은 반도체소자의 초고집접화, 웨이퍼의 대구경화로 발전이 거듭났으며, 소자의 성능과 생산 수율의 향상을 위하여 실리콘 웨이퍼의 세정하는 기술 및 연구를 계속 진행하고 있다. 기존의 반도체 세정은 과다한 화학약품의 사용으로 비 환경친화적이며, 이에 본 연구에서는 기존의 세정방법을 대체하기 위한 방법으로 환경친화적인 전리수를 이용한 반도체 세정법을 하였다. 이때 실리콘 웨이퍼 표면의 원자적 상태의 변화가 발생하여 다양한 방법으로 확인할 수 있다. 본 연구에 서는 이러한 분석을 하기 위하여 기존세정의 화학약품과 전리수로 세정한 웨이퍼의 표면을 비교하였으며, 또한 온도 및 시간별 표면상태변화를 분석하였다. 특히 접촉각 변하에 중점을 두어 변화를 관찰하였으며, 음극수의 경우 17.28°, 양극수의 경우 34.1°의 낮은 접촉각을 얻을 수 있었다.

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응집 및 정밀여과공정의 강화역세정시 NaOCl에 따른 PTFE막 투과능 회복과 막오염층 변화 (Permeability recovery and changes in fouling layer characteristics of PTFE membrane by enhanced backwash cleaning using NaOCl during coagulation and microfiltration)

  • 강선구;박근영;곽동근;김윤중;권지향
    • 상하수도학회지
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    • 제29권2호
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    • pp.233-241
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    • 2015
  • Polytetrafluoroethylene (PTFE) membrane has high resistance to chlorine, which is a great advantages in chemical cleaning to recover water flux during membrane processes in drinking water systems. A humic kaolin water with approximately 4 mg/L of DOC and 10 NTU of turbidity was prepared as a feed water. Coagulation pretreatment with or without settling was applied. The coagulation with settling showed the greatest water production. The reduced flux was effectively recovered by NaOCl cleaning, i.e., 21% recovery by 50 mg/L of NaOCl cleaning and 49% recovery by 500 mg/L NaOCl cleaning. The images of SEM and AFM analyses were corresponded to the water flux variation. However, when the floc was accumulated on the membrane surfaces, the efficiency of NaOCl cleaning was substantially limited. In addition, dynamic contact angle became greater after cleaning, which indicates changes in characteristics of fouling layer such as surface hydrophobicity. Proper cleaning technologies during enhanced backwash using NaOCl would expand application of PTFE membranes in drinking water systems.

Evaluation of Particle Removal Efficiency during Jet Spray and Megasonic Cleaning for Aluminum Coated Wafers

  • Choi, Hoomi;Min, Jaewon;Kulkarni, Atul;Ahn, Youngki;Kim, Taesung
    • 반도체디스플레이기술학회지
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    • 제11권3호
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    • pp.7-11
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    • 2012
  • Among various wet cleaning methods, megasonic and jet spray gained their popularity in single wafer cleaning process for the efficient removal of particulate contaminants from the wafer surface. In the present study, we evaluated these two cleaning methods for particle removal efficiency (PRE) and pattern damage on the aluminum layered wafer surface. Also the effect of $CO_2$ dissolved water in jet spray cleaning is assessed by measuring PRE. It is observed that the jet spray cleaning process is more effective in terms of PRE and pattern damage compared to megasonic cleaning and the mixing of $CO_2$ in the water during jet sprays further increases the PRE. We believe that the outcome of the present study is useful for the semiconductor cleaning process engineers and researchers.

화학양면성의 전해이온수를 이용한 극자외선 마스크의 나노세정 (Nano-cleaning of EUV Mask Using Amphoterically Electrolyzed Ion Water)

  • 유근걸;정윤원;최인식;김형원;최병선
    • 반도체디스플레이기술학회지
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    • 제20권2호
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    • pp.34-42
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    • 2021
  • Recent cleaning technologies of mask in extremely ultraviolet semiconductor processes were reviewed, focused on newly developed issues such as particle size determination or hydrocarbon and tin contaminations. In detail, critical particle size was defined and proposed for mask cleaning where nanosized particles and its various shapes would result in surface atomic ratio increase vigorously. A new cleaning model also was proposed with amphoteric behavior of electrolytically ionized water which had already shown excellent particle removing efficiency. Having its non-equilibrium and amphoteric properties, electrolyzed ion water seemed to oxidize contaminant surface selectively in nano-scale and then to lift up oxidized ones from mask surface very effectively. This assumption should be further investigated in future in junction with hydrogen bonding and cluster of water molecules.

출토 직물의 세탁 방법에 따른 물성 변화 (Physical Property Change of Old Fabrics Depending on Cleaning Method)

  • 배순화;이미식
    • 복식
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    • 제54권1호
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    • pp.1-10
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    • 2004
  • The purpose of this study was to compare the efficiency of four different cleaning method of silk and to fabrics, which were excavated from the sixteenth century tombs. The four cleaning methods were hand washing in water and hand washing in solvent, washing in ultrasonic cleaner, and using of ultrasonic gun after washing in ultrasonic cleaner. The following is the result of the experiment: ㆍBoth silk and jute fabrics shrank the most after hand-wash in water. This cleaning method decreased their thickness the most but changed their strength the least. However, the color of the fabric changed the most after had-wash in water. This washing method might discolor the dyed fabric, so one must check the condition of the fabric thoroughly before washing it. ㆍThe weight and the thickness of the fabric changed little after ultrasonic cleaning. This cleaning method, therefore. is less efficient than hand-water-wash. The use of ultrasonic gun after ultrasonic wash for partial cleansing enhanced the efficiency a little. Nevertheless, this method left stain around the area where the gun was used, and the injected water could damage the fabric. ㆍThe excavated fabric became softer in the cleaning process as the dirt was washed away. In both cases of silk and jute fabrics cleaning, solvent made the fabric softer than water. Washed in solvent, the fabric did not swell. But water penetrated to the fiber during the cleaning process and made the fabric swell. When the water evaporates, the swollen fiber structure collapses and the fabric become stiff. Ultrasonic wash did not cause much change in the flexibility of the fabric, for this method does not remove the dirt as effectively as the other method.

수계 세정시스템의 세정액/헹굼수의 모니터링 및 재활용 기술 분석 (Analysis of Monitoring and Recycling Technology Technologies of Cleaning Solution and Rinse Water in the Aqeous Cleaning System)

  • 한상원;이호열;배제흠;유종훈;박병덕;전성덕
    • 청정기술
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    • 제7권4호
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    • pp.225-242
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    • 2001
  • 산업체에서 부품을 가공하거나 완성품을 제조하는 과정에서 세정 공정은 필수적으로 사용하고 있고 현재 국내외 대부분의 제조업체에서는 오존파괴물질인 CFC-113이나 1,1,1-TCE 대신에 보다 환경친화적인 수계 세정제로의 대체가 진행중이다. 그러나 수계 세정시스템은 세정공정이나 헹굼공정에서 다량의 물을 사용하기 때문에 많은 폐수를 발생시키는 단점이 있다. 따라서 수계 세정시스템에서는 이러한 발생을 최소화하고 세정액과 헹굼수의 성능을 오랫동안 유지시키기 위한 모니터링 기술과 재활용 기술의 도입이 긴요하다. 본고에서는 수계 세정시스템에 사용하는 세정제와 주요 오염물질인 절삭유를 조사 분석하였고 산업현장에서 도입 가능한 수계 세정시스템의 모니터링 기술과 재활용 기술 등을 분석 평가하였다.

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해수용 역삼투막을 이용한 $1,000,000m^3/day$ 규모의 플랜트에서 오염된 막의 화학세정 효율 평가 (Evaluation on Chemical Cleaning Efficiency of Fouled in $1,000,000m^3/day$ Sea Water Reverse Osmosis Membrane Plant)

  • 박준영;김지훈;정우원;남종우;김영훈;이의종;이용수;전민정;김형수
    • 상하수도학회지
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    • 제25권3호
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    • pp.285-291
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    • 2011
  • Membrane fouling is an unavoidable phenomenon and major obstacle in the economic and efficient operation under sea water reverse osmosis (SWRO). When fouling occurs on the membrane surface, the permeate quantity and quality decrease, the trans-membrane pressure (TMP) and operation costs increase, and the membrane may be damaged. Therefore, chemical cleaning process is important to prevent permeate flow from decreasing in RO membrane filtration process. This study focused on proper chemical cleaning condition for Shuaibah RO plant in Saudi Arabia. Several chemical agents were used for chemical cleaning at different contact time and concentrations of chemicals. Also autopsy analysis was performed using LOI, FT-IR, FEEM, SEM and EDX for assessment of fouling. Specially, FEEM analysis method was thought as analyzing and evaluating tool available for selection of the first applied chemical cleaning dose to predict potential organic fouling. Also, cleaning time should be considered by the condition of RO membrane process since the cleaning time depends on the membrane fouling rate. If the fouling exceeds chemical cleaning guideline, to perfectly remove the fouling, certainly, the chemical cleaning is increased with membrane fouling rate influenced by raw water properties, pre-treatment condition and the point of the chemical cleaning operation time. Also choice of cleaning chemicals applied firstly is important.

역삼투막 공정에서 화학적 세정에 의한 $SiO_2$ scale 제거특성 (Characteristics of $SiO_2$ Scale Removal by Chemical Cleaning in Reverse Osmosis Membrane Process)

  • 독고석;이형집
    • 상하수도학회지
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    • 제24권1호
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    • pp.93-101
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    • 2010
  • Reverse osmosis (RO) membranes have been widely used for desalination as well as water and wastewater treatment facilities. Cleaning process is important to maintain stable operation as well as prevention of membrane fouling. Purpose of this research is to analyze electrostatistic and chemical characteristics after cleaning of RO membrane against $SiO_2$ scale. Four RO membranes of polyamide are used and examined about effect of chemical cleaning. EDTA (ethylene diamine tetraacetic acid) and SDS (sodium dodecil sulfate) and NaOH are applied for cleaning process after operation in synthetic water. Then, cleaning was performed with chemicals such concentration as 6hr, 12hr and 24hr, respectively. As a result, transmittances of FT-IR of four membranes are compared at each cleaning concentration. Ta/Tv shows difference of chemical composition between new membrane and cleaning membrane after cleaning. Type B of RO membrane is turned out to be most vulnerable to cleaning among four membranes. In terms of zeta potential, new membrane has -16 mV to +6 mV on pH while scaled membrane has -18 mV to 2 mV. However, it changed -23mV to 0.9 mV after cleaning. In comparison with existing salt rejection of RO membranes after cleaning, the rejection of the membranes goes down 0.7% maximum. Though cleaning changes the characteristics of membrane surface, it does not greatly affect salt rejection. pH is a critical factor to flux change in PA (polyamide) membrane.

전리수를 이용한 Si 웨이퍼 세정의 IR 특성연구 (A Study on IR Characterization of Electrolyzed Water for Si Wafer Cleaning)

  • Byeongdoo Kang;Kunkul Ryoo
    • 한국산학기술학회:학술대회논문집
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    • 한국산학기술학회 2001년도 춘계학술대회 발표논문집
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    • pp.124-128
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    • 2001
  • A present semiconductor cleaning technology is based upon RCA cleaning technology which consumes vast amounts of chemicals and ultra pure water(UPW) and is the high temperature Process. Therefore, this technology gives rise to the many environmental issues, and some alternatives such as functional water cleaning are being studied. The electrolyzed water was generated by an electrolysis system which consists of anode, cathode, and middle chambers. Oxidative water and reductive water were obtained in anode and cathode chambers, respectively. In case of NH$_4$Cl electrolyte, the oxidation-reduction potential and pH for anode water(AW) and cathode water(CW) were measured to be +1050mV and 4.8, and -750mV and 10.0, respectively. AW and CW were deteriorated after electrolyzed, but maintained their characteristics for more than 40 minutes sufficiently enough for cleaning. Their deterioration was correlated with CO$_2$ concentration changes dissolved from air. It was known that AW was effective for Cu removal, while CW was more effective for Fe removal. The particle distributions after various particle removal processes maintained the same pattern. In this work, RCA consumed about 9$\ell$chemicals, while EW did only 400$m\ell$ HCI electrolyte or 600$m\ell$ NH$_4$Cl electrolyte. It was hence concluded that EW cleaning technology would be very effective for eliminating environment, safety, and health(ESH) issues in the next generation semiconductor manufacturing.

수영장 청소 로봇 개발 및 청소성능지표 (Development of a Pool Cleaning Robot and its Cleaning Performance Evaluation)

  • 김진혁;김진현
    • 로봇학회논문지
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    • 제7권4호
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    • pp.243-251
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    • 2012
  • In this paper, developing of a pool cleaning robot is addressed. First, we analyze commercial pool cleaning robot mechanisms, and the merits and demerits of wireless version of a pool cleaning robot is introduced. And then the water-jet moving mechanism for a pool cleaning robot is proposed to improve energy efficiency and mechanical design advantage, which is one of the strong candidates for wireless pool cleaning robots. Next, the method of cleaning performance evaluation of pool cleaning robots is firstly defined with five key factors, and it was verified by experimental results. If the cleaning performance can be quantitatively defined, we can design optimally a pool cleaning robot, which results in the cost down.