• 제목/요약/키워드: In-Process Profile Measurement

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디지탈 영상처리 기법을 이용한 자동 두께측정 장치 개발 (Development for Automatic Thickness Measurment System by Digital Image Processing)

  • Kim, Y.I.
    • 한국정밀공학회지
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    • 제12권6호
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    • pp.72-79
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    • 1995
  • The purpose of this paper is to develop an automatic measuring system based on the digital image processing which can be applied to the in-process measurment of the characteristics of the thin thickness. The derivative operators is used for edge detection in gray level image. This concept can be easily illustrated with the aid of object shows an image of a simple light object on a dark background, the gray level profile along a horizontal scan line of the image, and the first and second derivatives of the profile. The first derivative of an edge modeled in this manner is 0 in all regions of constant gray level, and assumes a constant value during a gray level transition. The experimental results indicate that the developed automatic inspection system can be applied in real situation.

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CMP 패드 두께 프로파일 측정 장치 및 방법에 관한 연구 (A Study on CMP Pad Thickness Profile Measuring Device and Method)

  • 이태경;김도연;강필식
    • 한국산업융합학회 논문집
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    • 제23권6_2호
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    • pp.1051-1058
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    • 2020
  • The chemical mechanical planarization (CMP) is a process of physically and chemically polishing the semiconductor substrate. The planarization quality of a substrate can be evaluated by the within wafer non-uniformity (WIWNU). In order to improve WIWNU, it is important to manage the pad profile. In this study, a device capable of non-contact measurement of the pad thickness profile was developed. From the measured pad profile, the profile of the pad surface and the groove was extracted using the envelope function, and the pad thickness profile was derived using the difference between each profile. Thickness profiles of various CMP pads were measured using the developed PMS and envelope function. In the case of IC series pads, regardless of the pad wear amount, the envelopes closely follow the pad surface and grooves, making it easy to calculate the pad thickness profile. In the case of the H80 series pad, the pad thickness profile was easy to derive because the pad with a small wear amount did not reveal deep pores on the pad surface. However, the pad with a large wear amount make errors in the lower envelope profile, because there are pores deeper than the grooves. By removing these deep pores through filtering, the pad flatness could be clearly confirmed. Through the developed PMS and the pad thickness profile calculation method using the envelope function, the pad life, the amount of wear and the pad flatness can be easily derived and used for various pad analysis.

홀확장 잔류응력 예측을 위한 유한요소해석 (The Finite Element Analysis for Prediction of Residual Stresses Induced by Cold Expansion)

  • 김철;양원호;고명훈;허성필;현철승
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2000년도 추계학술대회논문집A
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    • pp.470-474
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    • 2000
  • Cold expansion of fastener holes is a mechanical process widely used in the aerospace industry. This treatment leads to an improvement of fatigue behavior due to the developed compressive residual stresses on the hole surface. The residual stress profile depends on the parameters of cold expansion, which are, expanding rate, inserting direction of mandrel, material properties etc. and the method to confirm this profile is only measurement by X-ray diffractometer. Despite its importance to aerospace industries, little attention has been devoted to the accurate modelling of the process. In this paper, Two-dimensional axisymmetric finite element simulations have been conducted for the cold expansion in an aluminium plate in order to predict the magnitude and distribution of the residual stress and plastic deformation. Maximum compressive residual stress could be increase about 7 percent using the 2-step cold expansion method.

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원자간력 현미경의 자율교정법 (New Calibration Methods for improving the Accuracy of AFM)

  • 권현규;고영채
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2001년도 춘계학술대회논문집B
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    • pp.48-52
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    • 2001
  • In this paper presents an accurate AFM used that is free from the Z-directional distortion of a servo actuator is described. Two mathematical correction methods by the in-situ self-calibrationare employed in this AFM. One is the method by the integration, and the other is the method by inverse function of the calibration curve. The in situ self-calibration method by the integration, the derivative of the calibration curve function of the PZT actuator is calculated from the profile measurement data sets which are obtained by repeating measurements after a small Z-directional shift. Input displacement at each sampling point is approximately estimated first by using a straight calibration line. The derivative is integrated with reference to the approximate input to obtain the approximate calibration curve. Then the approximation of the input value of each sampling point is improved using the obtained calibration curve. Next the integral of the derivative is improved using the newly estimated input values. As a result of repeating these improving process, the calibration curve converges to the correct one, and the distortion of the AFM image can be corrected. In the in situ self-calibration through evaluating the inverse function of the calibration curve, the profile measurement data sets were used during the data processing technique. Principles and experimental results of the two methods are presented.

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신경망과 주사전자현미경을 이용한 플라즈마 진단 (Plasma Diagnosis by Using Scanning Electron Microscope and Neural Network)

  • 배중기;김병환
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2006년도 심포지엄 논문집 정보 및 제어부문
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    • pp.96-98
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    • 2006
  • A new ex-situ model to diagnose a plasma processing equipment was presented. The model was constructed by combining wavelet, scanning electron microscope, ex-situ measurement of etching profile, and neural network. The diagnosis technique was applied to a tungsten etching process, conducted in a $SF_6$ helicon plasma. The wavelet was used to characterize detailed variations of plasma-etched surface. The diagnosis model was constructed with the vertical wavelet component. For comparison, a conventional model was built by using the estimated profile data. Compared to the conventional model, the wavelet-based model, demonstrated a much improved diagnosis.

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코너부 모깍기 엔드밀가공시 가공정밀도의 최적조건에 관한 연구 (A study on the optimal conditions for machining accuracy when endmill fillet cutting at the corner)

  • 최성윤;권대규;박인수;왕덕현
    • 한국기계가공학회지
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    • 제15권4호
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    • pp.101-108
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    • 2016
  • Endmill fillet cutting at the corner was conducted with the online measurement of cutting forces and tool deflection by a tool dynamometer and an eddy current sensor system. The profile of the machined surface was also compared with the CAD profile with a Coordinate Measuring Machine (CMM) and CALYPSO software. It was found that the end mill cutter with four blades has a better surface profile than that with two blades, and the cutting forces and tool deformation were increased as the cutting speed was increased. When the tool located at the degree $45^{\circ}$ corner was found to conduct the maximum cutting force than started to the point of the workpiece. As it was compared with the CMM and ANOVA analysis result in the case that the cutting force and tool deformation was the maximum, it was found that the result was affected by the spindle speed and the number of blades.

광학적 기법을 이용한 회전체 인프로세스 측정에 관한 연구 (A Study on the In-Process Measurement of Rotary Body by Optical Technique)

  • 소의열;임영호;유봉환
    • 한국정밀공학회지
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    • 제13권5호
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    • pp.148-156
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    • 1996
  • Automatic product system is gradually increasing according to development of industrial society. On-line measurement makes a important role in view of economic and effective side in industrial product system. Syncronization system is developed to measure screw thread which is rotating. In-process measuring of rotating body have a lot of difficuties even thoufht using various method containing high speed camera. So, now we suggest one of the new method which is not so expansive. In this study, digital value was produced through the image processing algorithm from acquired orignal image. As a result, we have a good agreement between measuring values calculated from image conture and measuring values acquired from profile project by means of experiment, respectively.

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Coordinated Wide-Area Regulation of Transmission System for Voltage Profile Improvement and Power Loss Reduction

  • Asadzadeh, Babak;Golshannavaz, Sajjad
    • Transactions on Electrical and Electronic Materials
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    • 제18권5호
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    • pp.279-286
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    • 2017
  • In this paper, an optimal approach for the wide-area regulation of control devices in a transmission network is proposed. In order to realize an improved voltage profile and reduced power loss, existing devices such as tap-changing transformers, synchronous machines, and capacitor banks should be controlled in a coordinated and on-line manner. It is well-understood that phasor measurement units in transmission substations allow the system operators to access the on-line loading and operation status of the network. Accordingly, this study proposes efficient software applications that can be employed in area operation centers. Thus, the implanted control devices can be regulated in an on-line and wide-area coordinated approach. In this process, efficient objective functions are devised for both voltage profile improvement and power loss reduction. Subsequently, sensitivity analysis is carried out to determine the best weighting factors for these objectives. Extensive numerical studies are conducted on an IEEE 14-bus test system and a real-world system named the Azarbayjan Regional Transmission Network. The obtained results are discussed in detail to highlight the promising improvements.

비구면 초정밀절삭 공정기술에 관한 연구 (A study on Ultra Precision machining process for Aspheric)

  • 김건희;홍권희;김효식;김현배;양순철;윈종호
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2003년도 춘계학술대회 논문집
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    • pp.90-93
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    • 2003
  • This paper described about the ultra-precision profile measurement of aspheric surfaces using contact probing technique. A contact probe has been designed as a sensing device to obtain measuring resolutions in nanometer regime utilizing a circle leaf spring mechanism and a capacitive-type sensor. The, contact probe is attached on the z-axis during measurement while aspheric object are supported on the diamond turning machine(DTM). The machine xz-axis motions are monitored by a set of two orthogonal plane mirror type laser interferometers. Experimental results show that the contact probing technique developed of on-machine measurement system in this investigation is capable of providing a repeatability of 10 nanometers with a $\pm$20 uncertainty of 200nmPv.

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공정프로파일 모니터링에서 웨이블릿기 반 T2-검정과 신경회로망의 성능비교 (Performance Comparisons of Wavelet Based T2-Test and Neural Network in Monitoring Process Profiles)

  • 김성준;최덕기
    • 한국지능시스템학회논문지
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    • 제18권6호
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    • pp.737-745
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    • 2008
  • 최근 공정 및 계측기술이 발전함에 따라 밀링, 그라인딩, 브로칭 등 공정작업의 온라인 모니터링에 대한 관심이 높아지고 있다. 온라인 모니터링 시스템은 공구의 마모나 파손 등과 같은 공정변화를 가급적 조기에 발견함으로써 설비를 보호하고 불필요한 비용의 발생을 억제하는 데 그 목적을 두고 있다 본 논문에서는 온라인 공정관측 데이터가 프로파일로 주어질 때 웨이블릿변환을 이용한 $T^2$-검정과 신경회로망의 모니터링 성능에 대해 고찰한다. 2006년 Axinte가 제시한 절삭력 데이터를 이용하여 수치실험을 수행한 결과, 웨이블릿기반 $T^2$는 양호한 검출력을 나타냈지만 그 검사특성은 자기상관에 매우 민감하게 반응하였다. 반면, 자기상관의 존재 하에서도 신경회로망은 $T^2$-검정에 비해 매우 안정적인 검사특성을 갖는 것으로 나타났다. 이는 웨이블릿기반 $T^2$-검정에 노이즈분석을 위한 적응적인 요소가 필요하다는 점을 시사한다