• 제목/요약/키워드: Improved Methods

검색결과 11,237건 처리시간 0.039초

Improved Scalar Multiplication on Elliptic Curves Defined over $F_{2^{mn}}$

  • Lee, Dong-Hoon;Chee, Seong-Taek;Hwang, Sang-Cheol;Ryou, Jae-Cheol
    • ETRI Journal
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    • 제26권3호
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    • pp.241-251
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    • 2004
  • We propose two improved scalar multiplication methods on elliptic curves over $F_{{q}^{n}}$ $q= 2^{m}$ using Frobenius expansion. The scalar multiplication of elliptic curves defined over subfield $F_q$ can be sped up by Frobenius expansion. Previous methods are restricted to the case of a small m. However, when m is small, it is hard to find curves having good cryptographic properties. Our methods are suitable for curves defined over medium-sized fields, that is, $10{\leq}m{\leq}20$. These methods are variants of the conventional multiple-base binary (MBB) method combined with the window method. One of our methods is for a polynomial basis representation with software implementation, and the other is for a normal basis representation with hardware implementation. Our software experiment shows that it is about 10% faster than the MBB method, which also uses Frobenius expansion, and about 20% faster than the Montgomery method, which is the fastest general method in polynomial basis implementation.

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구조계의 신뢰도해석을 위한 개선된 기법 (Improved Methods for Reliability Evaluations of Structural Systems)

  • 류정수;윤정방
    • 한국전산구조공학회:학술대회논문집
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    • 한국전산구조공학회 1992년도 봄 학술발표회 논문집
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    • pp.51-57
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    • 1992
  • The primary objective of this study is the development of second moment methods for the efficient reliability evaluations of structural systems. Two methods are presented. One is the improved first order reliability method (IFORM), and the other is the modified probabilistic network evaluation technique (MPNET). For the purpose of verifying the proposed methods, example analyses are carried out on several cases with two failure modes, a plane frame structure involving three failure modes and simplified parallel member models for fatigue reliability evaluations of offshore structures. Numerical results indicate that the effectiveness of the proposed methods over the conventional ones (i.e., the FORM and the PNET) increases very significantly as the number of failure modes of the system increases.

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Dynamic Fractional Frequency Reuse based on an Improved Water-Filling for Network MIMO

  • M.K, Noor Shahida;Nordin, Rosdiadee;Ismail, Mahamod
    • KSII Transactions on Internet and Information Systems (TIIS)
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    • 제10권5호
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    • pp.2124-2143
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    • 2016
  • In Long Term Evolution-Advanced (LTE-A) systems, Inter-cell Interference (ICI) is a prominent limiting factor that affects the performance of the systems, especially at the cell edges. Based on the literature, Fractional Frequency Reuse (FFR) methods are known as efficient interference management techniques. In this report, the proposed Dynamic Fractional Frequency Reuse (DFFR) technique improved the capacity and cell edge coverage performance by 70% compared to the Fractional Frequency Reuse (FFR) technique. In this study, an improved power allocation method was adopted into the DFFR technique to reach the goal of not only reducing the ICI mitigation at the cell edges, but also improving the overall capacity of the LTE-A systems. Hence, an improved water-filling algorithm was proposed, and its performance was compared with that of other methods that were considered. Through the simulation results and comparisons with other frequency reuse techniques, it was shown that the proposed method significantly improved the performance of the cell edge throughput by 42%, the capacity by 75%, and the coverage by 80%. Based on the analysis and numerical expressions, it was concluded that the proposed DFFR method provides significant performance improvements, especially for cell edge users.

Vantage Point Metric Index Improvement for Multimedia Databases

  • Chanpisey, Uch;Lee, Sang-Kon Samuel;Lee, In-Hong
    • 한국정보과학회:학술대회논문집
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    • 한국정보과학회 2011년도 한국컴퓨터종합학술대회논문집 Vol.38 No.1(C)
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    • pp.112-114
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    • 2011
  • On multimedia databases, in order to realize the fast access method, indexing methods for the multidimension data space are used. However, since it is a premise to use the Euclid distance as the distance measure, this method lacks in flexibility. On the other hand, there are metric indexing methods which require only to satisfy distance axiom. Since metric indexing methods can also apply for distance measures other than the Euclid distance, these methods have high flexibility. This paper proposes an improved method of VP-tree which is one of the metric indexing methods. VP-tree follows the node which suits the search range from a route node at searching. And distances between a query and all objects linked from the leaf node which finally arrived are computed, and it investigates whether each object is contained in the search range. However, search speed will become slow if the number of distance calculations in a leaf node increases. Therefore, we paid attention to the candidates selection method using the triangular inequality in a leaf node. As the improved methods, we propose a method to use the nearest neighbor object point for the query as the datum point of the triangular inequality. It becomes possible to make the search range smaller and to cut down the number of times of distance calculation by these improved methods. From evaluation experiments using 10,000 image data, it was found that our proposed method could cut 5%~12% of search time of the traditional method.

"상황 평가에 기반을 둔 병합"을 위한 개선 방법 (Improved Method for "Aggregation Based on Situation Assessment")

  • 최대영
    • 정보처리학회논문지B
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    • 제8B권6호
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    • pp.669-674
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    • 2001
  • 병합 과정에 병합 상황을 반영하기 위해 상황 평가에 기반을 둔 병합(ASA) 방법이 제안되었다.[1]. 상황 평가 모델의 정수화된 출력은 병합을 위한 입력으로 사용된다. 상황 평가 모델의 정수화된 출력은 현재의 병합 상황 정도를 나타낸다. ASA 알고리즘은 최소값과 최대값 사이에서 기껏해야 몇 개의 병합 결과를 만들어 낸다. 결과적으로 ASA 방법은 최소값과 최대값 사이에서 보다 더 정교한 병합 결과를 갖는 응용 분야를 적절히 다룰 수 없다. 이러한 문제를 해결하기 위해 두 가지의 개선된 ASA (I-ASA) 방법을 제안한다. 이들 I-ASA 방법에서는 상황 평가 모델의 매개변수의 값이 실수 값이 되는 것이 허용되고, 최소값과 최대값 사이에서 연속된 병합 결과를 만들 수 있게 하기 위해 두 가지의 개선된 ASA 알고리즘을 제시한다. 이들 I-ASA 방법들은 정밀 병합과 근사 병합을 다룰 수 있다. 결과적으로, ASA 방법[1]과 비교할 때 제안된 I-ASA 방법들이 보다 더 정교한 병합 결과를 갖는 응용 분야를 적절히 다룰 수 있고, 또한 보다 범용적인 병합 분야에 사용될 수 있다는 관점에서 장점이 있다.

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CST-트리를 채택한 Mint 시스템을 이용한 멀티미디어 콘텐츠 검색 개선 (CST-Tree with improved Mint system multimedia content using the refine)

  • 정명진;조성제
    • 디지털산업정보학회논문지
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    • 제9권3호
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    • pp.145-153
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    • 2013
  • Multimedia contents' searching methods in existing mobile computer environment tend to be brought with many over heads when attempting to search data in large bulks. The MINT system has been studied to resolve such problem. However, MINT system delivers many over heads by searching multimedia contents through applying B-Tree. The suggested method is said to be CST-MCR searching system based on CST-Tree. The specific characteristic of this method is improved MINT system by applying CST-Tree's index. The result of capacity evaluation came out with improved capacity of 4.27% from MINT system and CST-MCR methods in average. Conclusively, it has been proven that the suggested method is superior.

Wafer Burn-in Method of SRAM for Multi Chip Package

  • Kim, Hoo-Sung;Kim, Je-Yoon;Sung, Man-Young
    • Transactions on Electrical and Electronic Materials
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    • 제5권4호
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    • pp.138-142
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    • 2004
  • This paper presents the improved bum-in method for the reliability of SRAM in Multi Chip Package (MCP). Semiconductor reliability is commonly improved through the bum-in process. Reliability problem is more significant in MCP that includes over two chips in a package, because the failure of one chip (SRAM) has a large influence on the yield and quality of the other chips - Flash Memory, DRAM, etc. Therefore, the quality of SRAM must be guaranteed. To improve the quality of SRAM, we applied the improved wafer level bum-in process using multi cells selection method in addition to the previously used methods. That method is effective in detecting special failure. Finally, with the composition of some kind of methods, we could achieve the high quality of SRAM in Multi Chip Package.

New Wafer Burn-in Method of SRAM in Multi Chip Package (MCP)

  • Kim, Hoo-Sung;Kim, Hwa-Young;Park, Sang-Won;Sung, Man-Young
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2004년도 추계학술대회 논문집 Vol.17
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    • pp.53-56
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    • 2004
  • This paper presents the improved burn-in method for the reliability of SRAM in MCP Semiconductor reliability is commonly improved through the burn-in process. Reliability problem is more significant in the Multi Chip Package, because of including over two devices in a package. In the SRAM-based Multi Chip Package, the failure of SRAM has a large effect on the yield and quality of the other chips - Flash Memory, DRAM, etc. So, the quality of SRAM must be guaranteed. To improve the quality of SRAM, we applied the improved wafer level burn-in process using multi cell selection method in addition to the current used methods. That method is effective in detecting special failure. Finally, with the composition of some kinds of methods, we could achieve the high qualify of SRAM in Multi Chip Package.

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OBSERVATIONS ON A FURTHER IMPROVED ($\frac{G}{G}$) - EXPANSION METHOD AND THE EXTENDED TANH-METHOD FOR FINDING EXACT SOLUTIONS OF NONLINEAR PDES

  • Zayed, E.M.E.
    • Journal of applied mathematics & informatics
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    • 제30권1_2호
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    • pp.253-264
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    • 2012
  • In the present article, we construct the exact traveling wave solutions of nonlinear PDEs in the mathematical physics via the (1+1)-dimensional Boussinesq equation by using the following two methods: (i) A further improved ($\frac{G}{G}$) - expansion method, where $G=G({\xi})$ satisfies the auxiliary ordinary differential equation $[G^{\prime}({\xi})]^2=aG^2({\xi})+bG^4({\xi})+cG^6({\xi})$, where ${\xi}=x-Vt$ while $a$, $b$, $c$ and $V$ are constants. (ii) The well known extended tanh-function method. We show that some of the exact solutions obtained by these two methods are equivalent. Note that the first method (i) has not been used by anyone before which gives more exact solutions than the second method (ii).

Multi Chip Package의 SRAM을 위한 웨이퍼 Burn-in 방법 (Wafer Burn-in Method for SRAM in Multi Chip Package)

  • 윤지영;유장우;김후성;성만영
    • 한국전기전자재료학회논문지
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    • 제18권6호
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    • pp.506-509
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    • 2005
  • This paper presents the improved burn-in method for the reliability of SRAM in Multi Chip Package (MCP). Semiconductor reliability is commonly improved by the burn-in process. Reliability Problem is very significant in the MCP which includes over two chips in a package because the failure of one SRAM chip has a large influence on the yield and quality of the other chips such as Flash Memory, DRAM, etc. Therefore the quality of SRAM must be guaranteed. To improve the qualify of SRAM, we applied the improved wafer level burn-in process using multi cell selection method in addition to the previously used methods and it is found to be effective in detecting particular failures. Finally, with the composition of some kinds of methods, we achieved the high quality of SRAM in MCP.