• Journal of the Korean Society of Safety
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• v.27 no.6
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• pp.7-13
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• 2012

A lack of study on the dynamic tensile strengths of Sn-based solder joints at high strain rates was the motivation for the present study. A modified miniature Charpy impact testing machine instrumented with an impact sensor was built to quantitatively evaluate the dynamic impact strength of a solder joint under tensile impact loading. This study evaluated the tensile strength of lead-free solder ball joints at strain rates from $1.8{\times}10^3s^{-1}$ and $8.5{\times}10^3s^{-1}$. The maximum tensile strength of the solder ball joint decreases as the load speed increases in the testing range. This tensile strength represented that of the interface because of the interfacial fracture site. The tensile strengths of solder joints between Sn-3.0Ag-0.5Cu and copper substrate were between 21.7 MPa and 8.6 MPa in the high strain range.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.24 no.1
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• pp.117-123
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• 2015

The need for drop simulations for board-leveled flip chips in micro-system packaging has been increasing. There have been many studies on flip chips with various solder ball compositions. However, studies on flip chips with Sn-1.0Ag-0.5Cu and Sn-3.0Ag-0.5Cu have rarely been attempted because of the unknown material properties. According to recent studies, drop simulations with these solder ball compositions have proven feasible. In this study, predictions of the impact lifetime by drop simulations are performed considering Cu and Cu/Ni UBMs using LS-DYNA to alter the design parameters of the flip chips, such as thickness of the flip chip and size of the solder ball. It was found that a smaller chip thickness, larger solder ball diameter, and using the Cu/Ni UBM can improve the drop lifetime of solder balls.

• The Journal of Natural Sciences
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• v.14 no.2
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• pp.1-14
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• 2004

The observation of the various swing parameters and its effect on golfer swing are tatally analyzed. The golf ball impact and flies away, therefore it must be controlled bofore ball impact. The purpose of this paper is that the cause of hook and slice are found and the posture of swing is corrected. The trajectory after ball impact is on the $\Delta$-plane, which is consisted of the normal vector on club face and the swing velocity vector of club head including the initial celocity and the spin axis after ball imfact. In order to correct the miss shot in golf swing, this paper is is shown that the theoretical review and study is discussed to use the D-plane and $\Delta$-plane.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2000.04a
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• pp.20-25
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• 2000

In order to study the impact fracture behavior of brittle materials, a steel-ball-impact experiment was Performed. Five kinds of materials were used in this study : soda-lime glass plates, glass/epoxy prepreg-one layer-bonded and unbonded glass plates, glass/epoxy prepreg-three layers-bonded and unbonded glass plates. Fracture patterns, the maximum stress and absorbed fracture energy were observed according to various impact velocities 40-120m/s. With increasing impact velocity, ring crack, cone crack, radial crack and lateral crack took place in the interior of glass plates. The generation of such cracks was largely reduced with glass/epoxy prepreg coating. Consequently, it is thought that the characteristics of the dynamic Impact fracture behavior could be evaluated using the absorbed fracture energy and the maximum stress measured at the back surface of glass plates.

• Transactions of the Korean Society of Automotive Engineers
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• v.2 no.6
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• pp.66-75
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• 1994

In this paper, the effects of temperature change on the impact damages of CF/PEEK laminates are experimentally investigated. Composite laminates used in this experiment are CF/PEEK orthotropic laminated plates, which have two-interfaces$[0^{\circ}_4/90^{\circ}_4]_{9+} A steel ball launched by the air gun collides against CFRP laminates to generate impact damage. The delamination damages are oberved by a scanning acoustic microscope. And various relations are experimentally observed including the impact energy vs. delamination area, the specimen temperature vs. transverse crack, and the impact energy vs. residual bending strength of carbon fiber peek composite laminates subjected to FOD(Foreign Object Damage) under high temperatures.

• Journal of the Korean Society for Nondestructive Testing
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• v.12 no.2
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• pp.21-29
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• 1992

Acceleration signal characteristics of a steel plate, impacted by steel balls, were studied in an attempt to apply the experimental results to the impact location and mass estimation of metallic loose parts in the cooling system of nuclear power plants. Experimental results show that the variation of maximum acceleration amplitude and impact contact time due to the change of ball mass and impact velocity can be well explained by the Hertz impact theory. The frequency spectral pattern shifted slightly in spite of the increase of impact velocity and impact location. Ball mass, however, strongly affected the frequency spectral pattern. Hence the frequency spectrum can be used for estimation of the mass of unknown loose parts in the cooling system.

• Korean Journal of Applied Biomechanics
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• v.17 no.1
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• pp.191-199
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• 2007

This study was conducted to examine the biomechanical characteristics of open spike in the volleyball to improve the technique of the volleyball spike. The subjects were six male college and high school athletes. The motions of volleyball spike were filmed by using two Sony VX 2000 Video Cameras. The mechanical factors were angle and angular velocity of body segments in the upper and the lower limbs. The conclusions were as follows; 1. The angle of the shoulder joint of the skilled showed larger than that of the unskilled in impacting of the volley ball spike. 2. The angle of the elbow joint of the skilled showed larger than that of the unskilled in impacting of the volley ball spike. 3. The angle of the wrist joint of the skilled showed smaller than that of the unskilled in impacting of the volley ball spike. 4. The angle of the hip joint of skilled showed larger than that of unskilled in impacting of the volley ball spike. 5. The angle of the knee joint of the skilled and the unskilled showed same in take off and impacting of the volley ball spike, and that of the skilled showed smaller than that of the unskilled in take-off touchdown and touchdown after impact of the volley ball spike. 6. The angle of the ankle joint of skilled showed larger than unskilled in take-off of the volley ball spike. 7. The angular velocity of the shoulder joint, elbow joint, wrist joint of the skilled showed faster than that of the unskilled in impacting of the volley ball spike. Taken together the result of them, I have come to conclusion that knee joint angle in touchdown of the take off should be decreased and knee joint angle in take off should be increased, and then stability of the take off should be made and, and that extension of the elbow joint should be made and wrist joint angle decreased and shoulder and hip joint angle increased, and then C.O.G of the arm and hand should be positioned ahead C.O.G of the body in impacting for effective impact of the spike, and that the transfer of the angular velocity of body segments for effective impact of the spike make from the proximal segment to the distal segment at spike in volleyball.

• 연구논문집
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• s.25
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• pp.23-29
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• 1995

Steering column is a typical component that may injure the driver at a frontal collision accident. To protect the driver from an impact, it is very important to study the impact absorbing behaviour of steering column. The dynamic simulation were performed for the ball sleeve type impact absorbing steering column. The simulation results show similar trends to FMVSS 203 test results. Hence using the simulation program developed in this study, it is possible to predict dynamic response of steering system which is used in design modification. Impact absorbing performance of the ball sleeve type steering column with the column angle of $21^\circC$ and $26^\circC$ satisfies the safety criterion of FMVSS 203.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2001.11b
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• pp.945-950
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• 2001

Floor impact noise has been evaluated by investigating the temporal and spectral characteristics of the noise. The noises generated by different impactors were analyzed to find out whether there is any correlation with the factors of ACF /IACF (Autocorrelation Function/Inter-aural Cross-correlation Function) [1] and Zwicker parameters [2]. Experiments were undertaken to compare the objective and subjective parameters of the floor impact noises generated by a bang/tapping machine, a rubber ball [3], and a walker. As a result, it was found that $\phi$ (0) and IACC extracted from ACF/IACF, and Loudness, Unbiased Annoyance from Zwicker parameters showed high correlation with subjective evaluations of loudness concerning floor impact noises. In addition, it was revealed that jumping is similar to the ball.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.5
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• pp.559-563
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• 2011

Drop impact reliability assessment of solder joints on the flip chip is one of the critical issues for micro system packaging. Our previous researches have been showing that new solder ball compositions of Sn-3.0Ag-0.5Cu has better mechanical reliability than Sn-1.0Ag-0.5Cu. In this paper, dynamic reliability analysis using Finite Element Analysis (FEA) is carried out to assess the factors affecting flip chip in drop simulation. The design parameters are size and thickness of chip, and size, pitch and array of solder ball with composition of Sn1.0Ag0.5Cu. The board systems by JEDEC standard including 15 chips, solder balls and PCB are modeled with various design parameter combinations, and through these simulations, maximum yield stress and strain at each chip are shown at the solder balls. It is found that larger chip size, smaller chip array, smaller ball diameter, larger pitch, and larger chip thickness have bad effect on maximum yield stress and strain at solder ball of each chip.