• The Transactions of The Korean Institute of Electrical Engineers
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• v.62 no.6
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• pp.845-851
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• 2013

Because the existing control system has been operating for about 20 years, it is necessary to upgrade the system for stable and efficient operation. But, there is a difficulty in maintenance by difference of manufacturer of each main control systems for boiler, turbine and generator. This developed IMCS(Integrated Monitoring and Control System) consists of more than 10,000 inputs and outputs for large scale thermal power plant. This paper consists of the development journey of IMCS MBC(mill and burner control) ; core binary protection & monitoring logic including prevention circuit of boiler explosion & implosion. In this project, the IMCS for boiler, turbine and generator was developed on basis of one communications platform. In this paper, the whole journey of development of IMCS MBC is dealt with designing software and hardware, coding application software, and validating software and hardware.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.3
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• pp.152-158
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• 2016

The bonding characteristics of MLCCs (multi layer ceramic capacitor, C1608) lead-free solder (SAC305) joints were evaluated through thermal shock test ($-40^{\circ}C{\sim}125^{\circ}C$, total 1,800 cycle). After the test, IMCs( intermetallic compounds) growth and cracks were verified, also shear strengths were measured for degradation of solder joints. In addition, The thermal stress distributions at solder joints were analyzed to compare the solder joints changes before and after according to thermal shock test by FEA (finite elements analysis). We considered the effects of IMCs growth at solder joints. As results, the bonding characteristics degradation was occurred according to initial crack, crack propagations and thermal stress concentration at solder-IMCs interface, when the IMCs grown to solder inside.

• Proceedings of the KWS Conference
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• 2007.11a
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• pp.235-237
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• 2007

In this paper, fabrication of Sn-3.0Ag-0.5Cu solder bumping having accurate composition and behavior of intermetallic compounds(IMCs) growth at interface between Sn-Ag-Cu bumps and Cu substrate were studied. The ternary alloy of the Sn-3.0Ag-0.5Cu solder was made by two binary(Sn-Cu, Sn-Ag) electroplating on Cu pad. For the manufacturing of the micro-bumps, photo-lithography and reflow process were carried out. After reflow process, the micro-bumps were aged at $150^{\circ}C$ during 1 hr to 500 hrs to observe behavior of IMCs growth at interface. As a different of Cu contents(0.5 or 2wt%) at Sn-Cu layer, behavior of IMCs was estimated. The interface were observed by FE-SEM and TEM for estimating of their each IMCs volume ratio and crystallographic-structure, respectively. From the results, it was found that the thickness of $Cu_3Sn$ layer formed at Sn-2.0Cu was thinner than the thickness of that layer be formed Sn-0.5Cu. After aging treatment $Cu_3Sn$ was formed at Sn-0.5Cu layer far thinner.

• Journal of Korean Society of Environmental Engineers
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• v.31 no.7
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• pp.473-482
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• 2009

In this study, iron and manganese coated sand (IMCS) was prepared by mixing Joomoonjin sand with solutions having different molar ratio of manganese ($Mn^{2+}$) and iron ($Fe^{3+}$). Mineral type of IMCS was analyzed by X-ray diffraction spectroscopy. Removal efficiency of arsenic through As(III) oxidation and As(V) adsorption by IMCS having different ratio of Mn/Fe was evaluated. The coated amount of total Mn and Fe on all IMCS samples was less than that on sand coated with iron-oxide alone (ICS) or manganese-oxide alone (MCS). The mineral type of the manganese oxide on MCS and iron oxides on ICS were identified as ${\gamma}-MnO_2$ and mixture of goethite and magnetite, respectively. The same mineral type was appeared on IMCS. Removed amount As(V) by IMCS was greatly affected by the content of Fe rather than by the content of Mn. Adsorption of As(V) by IMCS was little affected by the presence of monovalent and divalent electrolytes. However a greatly reduced As(V) adsorption as observed in the presence of trivalent electrolyte such as $PO_4\;^{3-}$. As(III) oxidation efficiency by MCS in the presence of NaCl or $NaNO_3$ was two times greater than that in the presence of $PO_4\;^{3-}$. Meanwhile a greater As(III) oxidation efficiency was observed by IMCS in the presence of $PO_4\;^{3-}$. This was explained by the competitive adsorption between phosphate and arsenate on the surface of IMCS.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.165-180
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• 2004

Phosphor contents are critical to the interfacial reaction and IMC behavior. - If content is too low, the dissolution rate will be very fast. - If content is too much, the cracks during interfacial reaction and the IMCs spalling will easily occur. The spalling of IMCs caused the brittle fracture of solder joint under shear test. IMCs from chemical reaction influences to the mechanical properties and life time. Composition changes from chemical reaction influence to the life time.

• Journal of the Korean Society for Heat Treatment
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• v.32 no.2
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• pp.79-85
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• 2019

To investigate the influence of heat treatment on the growth intermetallic compounds (IMCs) at the joint interface of friction-welded Cu-Al, several heat treatments are performed at three different temperature with different times. The experiments reveal three different IMCs layers which are significantly influenced by atomic diffusion of Cu and Al with heat treatment conditions. Since the formation of these IMCs layers can affect mechanical properties of friction-welded Cu-Al interfaces, the relationship between the microstructure of IMCs layers and the tensile strength is analyzed according to heat treatment temperature and times.

• Korean Journal of Materials Research
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• v.29 no.4
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• pp.258-263
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• 2019

Since the directly bonded interface between TiAl alloy and SCM440 includes lots of cracks and generated intermetallic compounds(IMCs) such as TiC, FeTi, and $Fe_2Ti$, the interfacial strength can be significantly reduced. Therefore, in this study, Cu is selected as an insert metal to improve the lower tensile strength of the joint between TiAl alloy and SCM440 during friction welding. As a result, newly formed IMCs, such as $Cu_2TiAl$, CuTiAl, and $TiCu_2$, are found at the interface between TiAl alloy and Cu layer and the thickness of IMCs layers is found to vary with friction time. In addition, to determine the relationship between the thickness of the IMCs and the strength of the welded interfaces, a tensile test was performed using sub-size specimens obtained from the center to the peripheral region of the friction-welded interface. The results are discussed in terms of changes in the IMCs and the underlying deformation mechanism. Finally, it is found that the friction welding process needs to be idealized because IMCs generated between TiAl alloy and Cu act to not only increase the bonding strength but also form an easy path of fracture propagation.

• Journal of Korean Society of Environmental Engineers
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• v.32 no.2
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• pp.193-200
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• 2010

This study evaluated treatability of soluble Mn(II) using multifunctional sand media simultaneously coated with iron and manganese. In the preparation of IMCS(Iron and Manganese Coated Sand), 0.05 M Mn(II) solution and Fe(III) solution was mixed with sand at pH 7. The mineral type of IMCS was identified as the mixture of ${\gamma}-MnO_2$, goethite and magnetite($F_{e3}O_4$). The contents of Mn and Fe coated onto sand were 826 and 1676 mg/kg, respectively. The $pH_{pzc}$ of IMCS was measured as 6.40. The removal of soluble Mn(II) using IMCS and oxidants such as NaOCl and $KMnO_4$ was investigated with variation of the solution pH, reaction time and Mn(II) concentration in a batch test. The removal of Mn(II) on IMCS was 34% at pH 7.4 and the removals of Mn(II) on IMCS in the presence of NaOCl(13.6 mg/L) at pH 7 and $KMnO_4$(4.8 mg/L) at pH 7.6 were 96% and 89%, respectively. The removal of Mn(II) using IMCS and oxidants followed a typical cationic type, showing a gradual increase of removal as the solution pH increased. The removal of Mn(II) was rapid in the first 6 hrs and then a constant removal was observed. The maximum removed amount of Mn(II) on IMCS-alone and IMCS in the presence of oxidants such as NaOCl(13.6 mg/L) and $KMnO_4$(4.8mg/L) were 833.3, 1428.6 and 1666.7 mg/kg, respectively. Mn(II) removal onto the IMCS in the presence of oxidants was well described by second-order reaction and Langmuir isotherm expression.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.85-91
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• 2002

Even though electroless Hi and Sn-Ag-Cu solder are widely used materials in electronic packaging applications, interfacial reactions of the ternary Ni-Cu~Sn system have not been known well because of their complexity. Because the growth of intermetallics at the interface affects reliability of solder joint, the intermetallics in Ni-Cu-Sn system should be identified, and their growth should be investigated. Therefore, in present study, interfacial reactions between electroless Ni UB7f and 95.5Sn-4.0Ag-0.5Cu alloy were investigated focusing on morphology of the IMCs, thermodynamics, and growth kinetics. The IMCs that appear during a reflow and an aging are different each other. In early stage of a reflow, ternary IMC whose composition is Ni$_{22}$Cu$_{29}$Sn$_{49}$ forms firstly. Due to the lack of Cu diffusion, Ni$_{34}$Cu$_{6}$Sn$_{60}$ phase begins growing in a further reflow. Finally, the Ni$_{22}$Cu$_{29}$Sn$_{49}$ IMC grows abnormally and spalls into the molten solder. The transition of the IMCs from Ni$_{22}$Cu$_{29}$Sn$_{49}$ to Ni$_{34}$Cu$_{6}$Sn$_{60}$ was observed at a specific temperature. From the measurement of activation energy of each IMC, growth kinetics was discussed. In contrast to the reflow, three kinds of IMCs (Ni$_{22}$Cu$_{29}$Sn$_{49}$, Ni$_{20}$Cu$_{28}$Au$_{5}$, and Ni$_{34}$Cu$_{6}$Sn$_{60}$) were observed in order during an aging. All of the IMCs were well attached on UBM. Au in the quaternary IMC, which originates from immersion Au plating, prevents abnormal growth and separation of the IMC. Growth of each IMC is very dependent to the aging temperature because of its high activation energy. Besides the IMCs at the interface, plate-like Ag3Sn IMC grows as solder bump size inside solder bump. The abnormally grown Ni$_{22}$Cu$_{29}$Sn$_{49}$ and Ag$_3$Sn IMCs can be origins of brittle failure.failure.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.2
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• pp.1-8
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• 2018

In the soldering industry, a variety of lead-free solders have been developed as a part of restricting lead in electronic packaging. Sn-Ag-Cu (SAC) lead-free solder is regarded as one of the most superior candidates, owing to its low melting point and high solderability as well as the mechanical property. On the other hand, the mechanical property of SAC solder is directly influenced by intermetallic compounds (IMCs) in the solder joint. Although IMCs in SAC solder play an important role in bonding solder joints and impart strength to the surrounding solder matrix, a large amount of IMCs may cause poor strength, due to their brittle nature. In other words, the mechanical properties of SAC solder are of some concern because of the formation of large and brittle IMCs. As the IMCs grow, they may cause poor device performance, resulting in the failure of the electronic device. Therefore, new solder technologies which can control the IMC growth are necessary to address these issues satisfactorily. There are an advanced nanotechnology for microstructural refinement that lead to improve mechanical properties of solder alloys with nanoparticle additions, which are defined as nano-reinforced solders. These nano-reinforced solders increase the mechanical strength of the solder due to the dispersion hardening as well as solderability of the solder. This paper introduces the nano-reinforced solders, including its principles, types, and various properties.