• 마이크로전자및패키징학회지
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• 제17권3호
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• pp.59-63
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• 2010

Immersion Sn plating was produced on Cu foil by distributing nano-sized diamonds (ND). The ND distributed on the coating surface broke the continuity of Sn-oxide layer, therefore leading to penetrate the molten solder through the oxide and retarding the wettability degradation during a reflow process. Furthermore, the ND in the Sn coating played a role of diffusion barrier for Sn atoms and decreased the growth rate of intermetallic compound ($Cu_6Sn_5$) layer during the solid-state aging. The study confirmed the importance of ND to improve the wettability and reliability of the Sn plating. Complete dispersion of the ND within the immersion Sn plating needs to be further developed for the electronic packaging applications.

• 한국전기전자재료학회논문지
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• 제16권6호
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• pp.549-554
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• 2003

The purpose of this paper is to investigate the solder properties by the change of P mass percentage. Tension test, wetting balance test, spread test, and analysis of intermetallic compound after isothermal aging of Sn-2.5Ag-0.7Cu-0.005P, Sn-2.5Ag-0.7Cu-0.01P, Sn-2.5Ag-0.7Cu-0.02P, Sn-0.7Cu-0.005P were performed. Adding P in the solder alloys resulted in improvement of tensile strength, reduction of intermetallic compound growth, reduction of oxidization in fusible solders under wave soldering. After comparing solder alloy containing P with tin-lead eutectic solder alloy, P contained solders alloys showed much better solder properties than eutectic solder alloy. Furthermore, this solder alloy presented remarkable properties than any other lead-free solder alloy.

• 마이크로전자및패키징학회지
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• 제17권2호
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• pp.11-20
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• 2010

The effects of heat treatment on matte pure tin-plated Cu leadframes at high temperature and humidity conditions were investigated. After 1800 hrs of storage at $55^{\circ}C/85%$ RH, approximately 14.5 ${\mu}m$ long striation-shaped whiskers were observed on the surface of the without postbake treatment (WOPB) samples, while no whiskers were found in with postbake treatment (WPB) samples. The preferred orientations of Sn grains in WOPB and WPB sample did not change after the postbake treatment at $125^{\circ}C$ for 1 hr. However, both changed from (112) to (321) and (101), respectively, after 1800 hrs of storage at $55^{\circ}C/85%$ RH. The tensile stress of 8 MPa generated in as-plated sample was changed to a compression stress of 17 MPa after 2 days in room temperature storage. Due to the grain growth during postbake treatment, the WPB samples have more regular grains than the WOPB samples. In the as-plated sample, 0.32 ${\mu}m$ thickness of planar intermetallic compound (IMC) was observed. The IMCs in the WOPB and WPB samples had two distinct layers with large grains of $Cu_6Sn_5$ and with small grains of ${\eta}-Cu_{6.26}Sn_5$.

• 대한금속재료학회지
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• 제50권10호
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• pp.775-783
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• 2012

The effect of thermal annealing on the in-situ growth characteristics of intermetallics (IMCs) and the mechanical strength of Cu pillar/Sn-3.5Ag microbumps are systematically investigated. The $Cu_6Sn_5$ phase formed at the Cu/solder interface right after bonding and grew with increased annealing time, while the $Cu_3Sn$ phase formed at the $Cu/Cu_6Sn_5$ interface and grew with increased annealing time. IMC growth followed a linear relationship with the square root of the annealing time due to a diffusion-controlled mechanism. The shear strength measured by the die shear test monotonically increased with annealing time. It then changed the slope with further annealing, which correlated with the change in fracture modes from ductile to brittle at a critical transition time. This is ascribed not only to the increasing thickness of brittle IMCs but also to the decreasing thickness of the solder, as there exists a critical annealing time for a fracture mode transition in our thin solder-capped Cu pillar microbump structures.

• Journal of Welding and Joining
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• 제21권7호
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• pp.59-64
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• 2003

Microstructure and shear strength of Sn-Zn lead-free solders and Au/Ni/Cu UBM joint under thermal aging conditions was investigated. The samples were aged isothermally at 10$0^{\circ}C$ and 15$0^{\circ}C$ for 300, 600, and 900 hours. The IMCs(Intermetallic Compound) at the interface between solder and UBM were examined by FESEM and TEM. The results showed that the shear strength was decreased with aging time and temperature. The solder ball with high activated RA flux had about 8.2% higher shear strength than that of RMA flux. Poor wetting and many voids were observed in the fractured solder joint with of RMA flux. The decreased shear strengths were caused by IMC growth and Zn grain coarsening. Zn reacted with Au and then was transformed to the $\beta$ -AuZn compound. Although AuZn grew first, $r-Ni_5Zn_{21}$ compounds were formed with aging time. The layers indicated by $Ni_5Zn_{21}(1)$, (2), and (3) were formed with the thickness of ∼0.7 ${\mu}{\textrm}{m}$, ∼4 ${\mu}{\textrm}{m}$, and ∼2 ${\mu}{\textrm}{m}$, respectively.

• 마이크로전자및패키징학회지
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• 제15권2호
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• pp.47-54
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• 2008

컴포넌트에서의 비정상적인 금속간화합물 성장이 보드 레벨 기계적 신뢰성에 미치는 영향을 연구하기 위하여, 전기 도금된 Ni/Au UBM과 Sn2.5Ag0.5Cu 솔더의 리플로우 횟수 및 고온 시효 시간에 따른 금속간 화합물 성장거동을 관찰하였다. 각 조건별로 처리된 컴포넌트에서 솔더 접합부의 기계적 특성을 비교하기 위하여, 전단 속도 변화에 따른 볼 전단 시험을 실시하여 전단에너지 값을 측정하였다. 마지막으로, 보드 레벨에서의 기계적 신뢰성 시험을 위하여 조건별로 처리된 컴포넌트를 PCB 보드에 실장하여, 3점 굽힘 시험 및 충격 시험을 실시한 후 파괴모드를 분석하였다.

• 마이크로전자및패키징학회지
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• 제25권2호
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• pp.1-8
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• 2018

In the soldering industry, a variety of lead-free solders have been developed as a part of restricting lead in electronic packaging. Sn-Ag-Cu (SAC) lead-free solder is regarded as one of the most superior candidates, owing to its low melting point and high solderability as well as the mechanical property. On the other hand, the mechanical property of SAC solder is directly influenced by intermetallic compounds (IMCs) in the solder joint. Although IMCs in SAC solder play an important role in bonding solder joints and impart strength to the surrounding solder matrix, a large amount of IMCs may cause poor strength, due to their brittle nature. In other words, the mechanical properties of SAC solder are of some concern because of the formation of large and brittle IMCs. As the IMCs grow, they may cause poor device performance, resulting in the failure of the electronic device. Therefore, new solder technologies which can control the IMC growth are necessary to address these issues satisfactorily. There are an advanced nanotechnology for microstructural refinement that lead to improve mechanical properties of solder alloys with nanoparticle additions, which are defined as nano-reinforced solders. These nano-reinforced solders increase the mechanical strength of the solder due to the dispersion hardening as well as solderability of the solder. This paper introduces the nano-reinforced solders, including its principles, types, and various properties.

• 대한기계학회논문집
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• 제18권7호
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• pp.1713-1721
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• 1994

Intermetallic-matrix composites(IMCs) have the potential of combing matrix properties of oxidation resistance and high temperature stability with reinforcement properties of high specific strength and modulus. One of the major limiting factors for successful applications of these composite at high temperatures is the formation of interfacial reactions between matrix and ceramic reinforcement during composite process and during service. The purpose of the present investigation is to develop a better understanding of the nature of creep fracture mechanisms in a $Ni_{3}Al$ composite reinforced with both $TiB_{2}$ and SiC particulates. Emphasis is placed in the roles of the products of the reactions in determining the creep lifetime of the composite. In the present study, creep rupture specimens were tested under constant ranging from 180 to 350 MPa in vacuum at $760^{\cric}C$. The experimental data reveal that the stress exponent for power law creep for the composite is 3.5, a value close to that for unreinforced $Ni_{3}Al$. The microstructural observations reveal that most of the cavities lie on the grain boundaries of the $Ni_{3}Al$ matrix as opposed to the large $TiB_{2}/Ni_{3}Al$ interfaces, suggesting that cavities nucleate at fine carbides that lie in the $Ni_{3}Al$ grain boundaries as a result of the decomposition of the $SiC_{p}$. This observation accounts for the longer rupture times for the monolicthic $Ni_{3}Al$ as compared to those for the $Ni_{3}Al/SiC_{p}/TiB_{2} IMC$. Finally, it is suggested that creep deformation in matrix appears to dominate the rupture process for monolithic $Ni_{3}Al$, whereas growth and coalescence of cavities appears to dominate the rupture process for the composite.

• 한국재료학회지
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• 제17권3호
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• pp.152-159
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• 2007

When the electronics are tested with thermal shock for Pb-free solder joint reliability, there are temperature conditions with use environment but number of cycles for test don't clearly exist. To obtain the long term reliability data, electronic companies have spent the cost and times. Therefore this studies show the test method and number of thermal shock cycles for evaluating the solder joint reliability of electronic components and also research bonding strength variation with formation and growth of intermetallic compounds (IMC). SMD (surface mount device) 3216 chip resistor and 44 pin QFP (quad flat package) was utilized for experiments and each components were soldered with Sn-40Pb and Sn-3.0 Ag-0.5 Cu solder on the FR-4 PCB(printed circuit board) using by reflow soldering process. To reliability evaluation, thermal shock test was conducted between $-40^{\circ}C\;and\;+125^{\circ}C$ for 2,000 cycles, 10 minute dwell time, respectively. Also we analyzed the IMCs of solder joint using by SEM and EDX. To compare with bonding strength, resistor and QFP were tested shear strength and $45^{\circ}$ lead pull strength, respectively. From these results, optimized number of cycles was proposed with variation of bonding strength under thermal shock.

• 마이크로전자및패키징학회지
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• 제9권1호
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• pp.35-41
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• 2002

솔더 범프를 이용한 플립 칩 접속 기술은 시스템의 고속화, 고집적화, 소형화 요구 덴 마이크로 일렉트로닉스의 성능은 향상시키기 위해 필요한 기술이다. 본연구 에서는 Cr/Cr-Cu/cu UBM 구조에서 고 용융점 솔더 범프와 저 용융점 솔더 범프를-시효처리 후 전단 강도를 평가하였다. 계면에서 관찰된 금속간 화합물의 성장과 접합상태를 SEM과 TEM으로 분석하였으며, 유한요소법을 통하여 전단하중을 적용하였을때 집중되는 응력을 해석하였다. 실험결과 Sn-97wt%Pb와 Sn-37wt%Pb에서 900시간 시효 처리된 시편의 전단강도는 최대 값에서 각각 25%, 20% 감소하였다. 시효처리를 통해 금속간화합물인 $Cu_6/Sn_5$와 $Cu_3Sn$의 성장을 확인하였으며, 파단 경로는 초기의 솔더 내부에서 IMC층의 계면으로 이동하는 경향을 알 수 있었다.