• Proceedings of KOSOMES biannual meeting
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• 2009.06a
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• pp.9-15
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• 2009

On-Scene Commander's quickly discernment is very important in Catastrophic Oil Spill. The Korea carring out multiagency to catastrophic oil spill. but It cannot communication to other agency and happened to operation empty and duplications. The United State enforced Incident Command System/Unified Command (ICS/US) on National Incident Management System in 2008. The Korea Government must be preparation Unified Command System include Non-Government and an oil refining company.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.19 no.3
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• pp.567-574
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• 2015

In this paper, a 50ns 256-kb EEPROM IP for MCU (micro controller unit) ICs is designed. The speed of data sensing is increased in the read mode by using a proposed DB sensing circuit of differential amplifier type which uses the reference voltage, and the switching speed is also increased by reducing the total DB parasitic capacitance as a distributed DB structure is separated into eight. Also, the access time is reduced reducing a precharging time of BL in the read mode removing a 5V NMOS transistor in the conventional RD switch, and the reliability of output data can be secured by obtaining the differential voltage (${\Delta}V$) between the DB and the reference voltages as 0.2*VDD. The access time of the designed 256-kb EEPROM IP is 45.8ns and the layout size is $1571.625{\mu}m{\times}798.540{\mu}m$ based on MagnaChip's $0.18{\mu}m$ EEPROM process.

• The Transactions of the Korean Institute of Electrical Engineers D
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• v.53 no.11
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• pp.768-775
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• 2004

The SSA technique in the digital circuit test is required to be repeated the input pattern stream to n bits output nodes n times in case of using a multiplexor. Because the method adopting a parallel/serial bit convertor to remove this inefficiency has disadvantage of requiring the test time n times for a pattern, the test strategy is required, which can enhance the test productivity by reducing the test time based on simplified fault detection mechanism. Accordingly, this paper proposes a test strategy which enhances the test productivity and efficiency by appling PAS (Parallel Signature Analysis) technique to those after analyzing the structure and characteristics of the digital devices including TTL and CMOS family ICs as well as ROM and RAM. The PSA technique identifies the faults by comparing the reminder from good device with reminder from the tested device. At this time, the reminder is obtained by enforcing the data stream obtained from output pins of the tested device on the LFSR(Linear Feedback Shift Resister) representing the characteristic equation. Also, the method to obtain the optimal signature analyzer is explained by furnishing the short bit input streams to the long bit input streams to the LFSR having 8, 12, 16, 20bit input/output pins and by analyzing the occurring probability of error which is impossible to detect. Finally, the effectiveness of the proposed test strategy is verified by simulating the stuck at 1 errors or stuck at 0 errors for several devices on typical 8051 digital board.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.4
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• pp.47-56
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• 2018

National-scale industrial control systems for gas, electric power, water processing, nuclear power, and traffic control systems increasingly use open networks and open standards protocols based on advanced information and communications technologies. The frequency of cyberattacks increases steadily because of the use of open networks and open standards protocols, but follow-up actions are limited. Therefore, the application of security solutions to an industrial control system is very important. However, it is not possible to apply security solutions to a real system because of the characteristics of industrial control systems. And a security system that can detect attacks without affecting the existing system is imperative. Therefore, in this paper, we propose an intrusion detection system based on packet analysis that can detect anomalous behaviors without affecting the industrial control system, and we verify the effectiveness of the proposed intrusion detection system by applying it in a test bed simulating a real environment.

• Journal of the Semiconductor & Display Technology
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• v.5 no.2 s.15
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• pp.33-36
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• 2006

Many issues arose to use the Pb-free solder as adhesive materials in MEMS ICs and packaging. Then this study for easy and simple sealing method using adhesive materials was carried out to maintain hermetic characteristic in MEMS Package. In this study, Hermetic characteristic using negative PR (XP SU-8 3050 NO-2) as adhesive at the interface of Si test coupon/glass substrate and Si test coupon/LTCC substrate was examined. For experiment, the dispenser pressure was 4 MPa and the $200\;{\mu}m{\Phi}$ syringe nozzle was used. 3.0 mm/sec as speed of dispensing and 0.13 mm as the gap between Si test coupon and nozzle was selected to machine condition. 1 min at $65^{\circ}C$ and 15 min at $95^{\circ}C$ as Soft bake, $200\;mj/cm^2$ expose in 365 nm wavelength as UV expose, 1 min at $65^{\circ}C$ and 6 min at $95^{\circ}C$ as Post expose bake, 60 min at $150^{\circ}C$ as hard bake were selected to activation condition of negative PR. Hermetic sealing was achieved at the Si test coupon/ glass substrate and Si test coupon/LTCC substrate. The leak rate of Si test coupon/glass substrate was $5.9{\times}10^{-8}mbar-l/sec$, and there was no effect by adhesive method. The leak rate of Si test coupon/LTCC substrate was $4.9{\times}10^{-8}mbar-l/sec$, and there was no effect by dispensing cycle. Better leak rate value could be achieved to use modified substrate which prevent PR flow, to increase UV expose energy and to use system that controls gap automatically with vision.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.3.1-3.1
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• 2011

Over the past decade, the major efforts for lowering the cost of electronics has been devoted to increasing the packaging efficiency of the integrated circuits (ICs), which is defined by the ratio of all devices on system-level board compared to the area of the board, and to working on a larger but cheaper substrates. Especially, in flexible electronics, the latter has been the favorable way along with using novel nanomaterials that have excellent mechanical flexibility and electrical properties as active channel materials and conductive films. Here, the tool for achieving large area patterning is by printing methods. Although diverse printing methods have been investigated to produce highly-aligned structures of the nanomaterials with desired patterns, many require laborious processes that need to be further optimized for practical applications, showing a clear limit to the design of the nanomaterial patterns in a large scale assembly. Here, we demonstrate the alignment of highly ordered and dense silicon (Si) NW arrays to anisotropically etched micro-engraved structures using a simple evaporation process. During evaporation, entropic attraction combined with the internal flow of the NW solution induced the alignment of NWs at the corners of pre-defined structures. The assembly characteristics of the NWs were highly dependent on the polarity of the NW solutions. After complete evaporation, the aligned NW arrays were subsequently transferred onto a flexible substrate with 95% selectivity using a direct gravure printing technique. As proof-of-concept, flexible back-gated NW field effect transistors (FETs) were fabricated. The fabricated FETs had an effective hole mobility of 0.17 $cm2/V{\cdot}s$ and an on/off ratio of ${\sim}1.4{\times}104$. These results demonstrate that our NW gravure printing technique is a simple and effective method that can be used to fabricate high-performance flexible electronics based on inorganic materials.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.1
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• pp.59-67
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• 2007

This paper presents a low power dual-level low voltage differential signaling (DLVDS) technique using current source switching for LCD driver ICs in portable products. The transmitter makes dual level signal that has two different level signal 400mVpp and 250mVpp while keeping the advantages of LVDS. The decoding circuit recovers the primary signal from DLVDS. The low power DLVDS is implemented using a $0.25{\mu}m$ CMOS process under 2.5V supply. The proposed circuit shows 800Mbps/2-line data rate and 9mW, 11.5mW power consumptions in transmitter and receiver, respectively. The proposed DLVDS scheme reduce power consumption dramatically compare with conventional one.

• JSTS:Journal of Semiconductor Technology and Science
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• v.17 no.1
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• pp.129-140
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• 2017

In this paper, a $4{\times}32$-channel neural recording system capable of acquiring neural signals is introduced. Four 32-channel neural recording ICs, complex programmable logic devices (CPLDs), a micro controller unit (MCU) with USB interface, and a PC are used. Each neural recording IC, implemented in $0.18{\mu}m$ CMOS technology, includes 32 channels of analog front-ends (AFEs), a 32-to-1 analog multiplexer, and an analog-to-digital converter (ADC). The mid-band gain of the AFE is adjustable in four steps, and have a tunable bandwidth. The AFE has a mid-band gain of 54.5 dB to 65.7 dB and a bandwidth of 35.3 Hz to 5.8 kHz. The high-pass cutoff frequency of the AFE varies from 18.6 Hz to 154.7 Hz. The input-referred noise (IRN) of the AFE is $10.2{\mu}V_{rms}$. A high-resolution, low-power ADC with a high conversion speed achieves a signal-to-noise and distortion ratio (SNDR) of 50.63 dB and a spurious-free dynamic range (SFDR) of 63.88 dB, at a sampling-rate of 2.5 MS/s. The effectiveness of our neural recording system is validated in in-vivo recording of the primary somatosensory cortex of a rat.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.2
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• pp.11-19
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• 2015

Since CMOS device scaling has stalled, three-dimensional (3-D) integration allows extending Moore's law to ever high density, higher functionality, higher performance, and more diversed materials and devices to be integrated with lower cost. 3-D integration has many benefits such as increased multi-functionality, increased performance, increased data bandwidth, reduced power, small form factor, reduced packaging volume, because it vertically stacks multiple materials, technologies, and functional components such as processor, memory, sensors, logic, analog, and power ICs into one stacked chip. Anticipated applications start with memory, handheld devices, and high-performance computers and especially extend to multifunctional convengence systems such as cloud networking for internet of things, exascale computing for big data server, electrical vehicle system for future automotive, radioactivity safety system, energy harvesting system and, wireless implantable medical system by flexible heterogeneous integrations involving CMOS, MEMS, sensors and photonic circuits. However, heterogeneous integration of different functional devices has many technical challenges owing to various types of size, thickness, and substrate of different functional devices, because they were fabricated by different technologies. This paper describes new 3-D heterogeneous integration technologies of chip self-assembling stacking and 3-D heterogeneous opto-electronics integration, backside TSV fabrication developed by Tohoku University for multifunctional convergence systems. The paper introduce a high speed sensing, highly parallel processing image sensor system comprising a 3-D stacked image sensor with extremely fast signal sensing and processing speed and a 3-D stacked microprocessor with a self-test and self-repair function for autonomous driving assist fabricated by 3-D heterogeneous integration technologies.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2015.05a
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• pp.783-785
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• 2015

Automotive Semiconductor revenue grew 3.9% in 2013 to $26.7 billion, driven by strength in LED lighting, ASSPs and analog ICs. Renesas Electronics held onto the No.1 spot despite a revenue decline, while Freescale Semiconductor, NXP, Texas Instruments and Robert Bosch made strong gains. Global Semiconductor manufacturers are paying attention to the Korean auto market, which reflects the reality of the local auto industry. The local industry has a long way go in the automotive semiconductor sector, even though it has grown to become the six-largest in the world. The reason for global semiconductors companies' interest in the local market lies in the fact that are the use of semiconductors in cars is on the rise, since smart and eco-friendly cars are becoming popular.