• The Korean Journal of Pain
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• v.33 no.4
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• pp.294-304
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• 2020

The sacroiliac joints connect the base of the sacrum to the ilium. When inflamed, they are suspected to cause low back pain. Inflammation of the sacroiliac joints is called sacroiliitis. The severity of the pain varies and depends on the degree of inflammation. Sacroiliitis is a hallmark of seronegative spondyloarthropathies. The presence or absence of chronic sacroiliitis is an important clue in the diagnosis of low back pain. This article aims to provide a concise overview of the anatomy, physiology, and molecular biology of sacroiliitis to aid clinicians in the assessment and management of sacroiliitis. For this narrative review, we evaluated articles in English published before August 2019 in PubMed. Then, we selected articles related to the painful manifestations of the sacroiliac joint. From the retrieved articles, we found that chronic sacroiliitis may be caused by various forms of spondyloarthritis, such as ankylosing spondyloarthritis. Sacroiliitis can also be associated with inflammatory bowel disease, Crohn's disease, gout, tuberculosis, brucellosis, and osteoarthritis, indicating common underlying etiological factors. The pathophysiology of sacroiliitis is complex and may involve internal, environmental, immunological, and genetic factors. Finally, genetic factors may also play a central role in progression of the disease. Knowing the genetic pre-disposition for sacroiliitis can be useful for diagnosis and for formulating treatment regimens, and may lead to a substantial reduction in disease severity and duration and to improved patient performance.

• Proceedings of the IEEK Conference
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• 2004.08c
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• pp.717-722
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• 2004

A design was done, and all characteristic of photodetectr of the web pattern type which a standard process of the Bipolar which Si PIN structure was used in this paper, and was used for the current amplifier design was used, and high-speed, was used as receiving optcal area of high altitude, and the module which had a low dark current characteristic was implemented with one chip with a base. Important area decreases an area of Ie at the time of this in order to consider an electrical characteristic and economy than the existing receiving IC, and performance of a product and confidence are got done in incense. First of all, the receiving IC which a spec, pattern of a wafer to he satisfied with the following electrical optical characteristic that produced receiving IC of 5V and structure are determined, and did one-chip is made. On the other hand, the time when AR layer of double is $Si_{3}N_{4}/SiO_{2}=1500/1800$ has an optical reflectivity of less than $10{\%}$ on an incidence optical wavelength of 660 ,and, in case of photo detector which reverse voltage made with 1.8V runs in 1.65V, an error about a change of thickness is very the thickness that can be improved surely. And, as for the optical current characteristic, about 5 times increases had the optical current with 274nA in 55nA when Pc was -27dBm. A BJT process is used, and receiving IC running electricity suitable for low voltage and an optical characteristic in minimum 1.8V with a base with two phases is made with one chip. IC of low voltage operates in 1.8V and 3.0V at the same time, and optical link receiving IC is going to be implemented

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.1
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• pp.1-6
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• 2009

The holding voltage of high-voltage devices under the snapback breakdown condition has been known to be much smaller than the operating voltage. Such characteristics cause high-voltage ICs to be susceptible to the transient latch-up failure in the practical system applications, especially when these devices are used as the ESD(ElectroStatic Discharge) power clamp circuit. A new latchup-free design of the ESD power clamp circuit with stacked-bipolar devices is proposed and successfully verified in a $0.35{\mu}m$ 3.3V/60V BCD(Bipolar-CMOS-DMOS) process to achieve the desired ESD level. The total holding voltage of the stacked-bipolar devices in the snapback breakdown condition can be larger than the operating voltage. Proposed power clamp operates safely because of the high holding voltage. From the measurement on the devices fabricated using a $0.35{\mu}m$ BCD Process, it was observed that the proposed ESD power clamp can provide 800% higher ESD robustness per silicon area as compared to the conventional clamps with a high-voltage diode.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.1-9
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• 2010

Three-dimensional (3-D) integration is an emerging technology, which vertically stacks and interconnects multiple materials, technologies, and functional components such as processor, memory, sensors, logic, analog, and power ICs into one stacked chip to form highly integrated micro-nano systems. Since CMOS device scaling has stalled, 3D integration technology allows extending Moore's law to ever high density, higher functionality, higher performance, and more diversed materials and devices to be integrated with lower cost. The potential benefits of 3D integration can vary depending on approach; increased multifunctionality, increased performance, increased data bandwidth, reduced power, small form factor, reduced packaging volume, increased yield and reliability, flexible heterogeneous integration, and reduced overall costs. It is expected that the semiconductor industry's paradiam will be shift to a new industry-fusing technology era that will offer tremendous global opportunities for expanded use of 3D based technologies in highly integrated systems. Anticipated applications start with memory, handheld devices, and high-performance computers and extend to high-density multifunctional heterogeneous integration of IT-NT-BT systems. This paper attempts to introduce new 3D integration technologies of the chip self-assembling stacking and 3D heterogeneous opto-electronics integration for realizng the super-chip.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.12 no.2
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• pp.43-52
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• 2012

This paper presents and analyzes laboratory test results of Interference Cancellation Digital On Channel Regenerative Repeater(IC-DOCR) to broadcast digital television signals in the Advanced Television Systems Committee(ATSC) transmission systems using single frequency networks(SFN). IC-DOCR laboratory test is classified to receiver test, transmitter test, and feedback interference cancellation test. The receiver part includes random noise, single echo, multi-path ensembles, and adjacent channel interference test. The transmitter part includes out-of channel emission, equality of transmitting signal, and phase noise test. By the laboratory test, the receiver part of the IC-DOCR eliminates 28dB of feedback signal higher than the received signal and has 17.8dB at TOV(Threshold Of Visibility) under random noise environment. Also, the transmitter part satisfies the specification of US FCC(Federal Communications Commission) as well as maintains good output signal quality for guaranteeing more than SNR 30dB.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.15 no.1
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• pp.261-267
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• 2015

The eigenvalue problems involving the diffraction of waves by multi-layered grating configurations can be explained by rigorous modal expansion terms. Such a modal solution can be represented by equivalent transmission-line networks, which are generalized forms of simple conventional circuits. This approach brings considerable physical insight into the grating diffraction process of the fields everywhere. In particular, the transmission-line representation can serve as a template for computational algorithms that systematically evaluate dispersion properties, radiation effects and other optical characteristics that are not readily obtained by other methods. To illustrate the validity of the present rigorous approach, the previous research works are numerically confirmed and the results agree well each other.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.16 no.6
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• pp.191-196
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• 2016

A development on the indoor positioning technologies and services has been proceeded very actively. Among the several positioning technologies, the TDOA(Time Difference of Arrival) technology using acoustic signal has the best positioning performance. Because so many people use their own smartphones, the location of the smartphone is important, and the TDOA technology should be employed to use the acoustic signal for the positioning. For the digital signal processing with the acoustic signal, the signal should be sampled, and as the sampling rate increases, the positioning accuracy could be improved instead of processing time burden. In this paper, the position estimation error according to the sampling rate is analyzed, and the appropriate sampling rate for the positioning system is proposed.

• Journal of the Korea Institute of Information Security & Cryptology
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• v.25 no.6
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• pp.1455-1463
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• 2015

If the industrial control system is infected by malicious worm such as Stuxnet, national disaster could be caused inevitably. Therefore, most of the industrial control system defence is focused on intrusion detection in network to protect against these threats. Conventional method is effective to monitor network traffic and detect anomalous patterns, but normal traffic pattern attacks using MITM technique are difficult to be detected. This study analyzes the PROFINET/DCP protocol and weaknesses with the data collected in real industrial control system. And add the authentication data field to secure the protocol, find out the applicability. Improved protocol may prevent the national disaster and defend against MITM attacks.

• The Journal of the Korea institute of electronic communication sciences
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• v.9 no.8
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• pp.955-964
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• 2014

The more importance of international collaboration has increased, the more studies on statues of international collaboration are increasing. However, few studies have attempted to identify the international collaboration. This article aims at a multidirectional characterization of the international collaboration in the field of Computer Science by analysis of articles published in the SCOPUS database. We applied Probabilistic Affinity Index(PAI) and Indicator of Collaboration Strength(ICS) for measuring the intensity of scientific collaboration among countries, and index of Incremental Citation Impact(ICI) for measuring the quality of international collaboration. These analyses identify the trends of international collaboration in the field of Computer Science and it's effect by nation.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.46 no.1
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• pp.52-58
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• 2018

A Study on the dynamic characteristics of a rotor driven by a tipjet system in hovering condition was carried out. The sectional modeling was performed for the tipjet blade in which the flow path was inserted, and the dynamic characteristics analysis was conducted by modeling the components of the proposed rotor system. The analysis was conducted with respect to the rotational speed and the collective pitch. As a result of the analysis, it was checked that the proposed tipjet rotor did not have aeroelastic instability within the designed operating range. The tipjet test equipment was constructed in order to verify the analysis approach. It was confirmed that the proposed rotor was driven normally by tipjet. The non-rotating eigenmode measurement test and the rotation test were performed, and the validity was proved by comparing the test results and the analysis results.