• 한국세라믹학회지
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• 제48권2호
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• pp.189-194
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• 2011

Metallurgical grade silicon was recovered from slurry waste for ingot sawing process by acid leaching and thermal treatment. SiC abrasive was removed by gravity concentration and centrifugation. Metal impurities were removed by the acid leaching using HF/HCl. The remaining SiC was separated by the thermal treatment at $1600^{\circ}C$ in an inert atmosphere by the difference in melting points. The purity of the obtained silicon was found to be around 99.7%.

• 한국세라믹학회지
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• 제48권6호
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• pp.621-624
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• 2011

In order to deposit a homogeneous and uniform ${\beta}$-SiC films by chemical vapor deposition, we constructed the phase-diagram of ${\beta}$-SiC over graphite and silicon via computational thermodynamic calculation considering pressure(P), temperature(T) and gas composition(C) as variables in $C_3H_8-SiCl_4-H_2$ system. During the calculation, the ratio of Cl/Si and C/Si is maintained to be 4 and 1, respectively, and H/Si ratio is varied from 2.67 to 15,000. The P-T-C diagram showed very steep phase boundary between SiC+C and SiC region perpendicular to H/Si axis and also showed SiC+Si region with very large H/Si value of ~6700. The diagram can be applied not only to the prediction of the deposited phase composition but to compositional variation due to the temperature distribution in the reactor. The P-T-C diagram could provide the better understanding of chemical vapor deposition of silicon carbide.

• 한국세라믹학회지
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• 제49권4호
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• pp.328-332
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• 2012

Etch rates of Si and high purity SiC have been compared for various fluorocarbon plasmas. The relative plasma resistance of SiC, which is defined as the etch rate ratio of Si to SiC, varied between 1.4 and 4.1, showing generally higher plasma resistance of SiC. High resolution X-ray photoelectron analysis revealed that etched SiC has a surface carbon content higher than that of etched Si, resulting in a thicker fluorocarbon polymer layer on the SiC surface. The plasma resistance of SiC was correlated with this thick fluorocarbon polymer layer, which reduced the reaction probability of fluorine-containing species in the plasma with silicon from the SiC substrate. The remnant carbon after the removal of Si as volatile etch products augments the surface carbon, and seems to be the origin of the higher plasma resistance of SiC.

• 한국결정성장학회지
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• 제23권6호
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• pp.309-313
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• 2013

실리콘카바이드(SiC)는 높은융점과 내마모성 및 열전도 특성으로 산업적으로 널리 활용되고 있다. 특히 고순도 SiC는 고효율 전력 변환용 SiC 반도체 및 LED 공정에 적용되는 미래소재로 각광받고 있다. 본 연구에서는 고순도 SiC를 합성하기 위한 원료인 고순도 카본(C)을 유도 열플라즈마(RF Inductively thermal plasma)를 이용하여 합성하였으며, 출발원료로서 탄화수소계 액상물질인 도데칸이 사용되었다. 유도 열플라즈마 합성된 고순도 카본은 반응관과 필터에서 포집되며, 필터에서 포집된 카본 분말은 반응관에서 포집된 카본 분말보다 작은 입도(10~20 nm)와 낮은 결정성을 갖는 것으로 확인하였다. 반응관과 필터부에서 포집된 카본 분말의 순도는 각각 99.9997 %(5N7)와 99.9993 %(5N3)로 측정되었으며, 카본 분말에서 검출되는 불순물은 열플라즈마 합성장비에서 기인한 것으로 확인되었다.

• 한국세라믹학회지
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• 제48권3호
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• pp.236-240
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• 2011

In order to deposit a homogeneous and uniform ${\beta}$-SiC films by chemical vapor deposition, we demonstrated the phase stability of ${\beta}$-SiC over graphite and silicon via computational thermodynamic calculation considering pressure, temperature and gas composition as variables. The ${\beta}$-SiC predominant region over other solid phases like carbon and silicon was changed gradually and consistently with temperature and pressure. Practically these maps provide necessary conditions for homogeneous ${\beta}$-SiC deposition of single phase. With the thermodynamic analyses, the CVD apparatus for uniform coating was modeled and simulated with computational fluid dynamics to obtain temperature and flow distribution in the CVD chamber. It gave an inspiration for the uniform temperature distribution and low local flow velocity over the deposition chamber. These calculation and model simulation could provide milestones for improving the thickness uniformity and phase homogeneity.

• 한국표면공학회지
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• 제47권6호
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• pp.354-361
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• 2014

In order to utilize silicon carbide (SiC) as an inner part of fluidized bed reactor (FBR) for manufacturing poly-silicon, we have carried out the thermodynamic calculation on the overall reactions including poly-silicon synthesis and compatibility of SiC with FBR process. The resources of silicon included $SiH_4(MS)$, $SiHCl_3(TCS)$ and $SiCl_4(STC)$ and the thermodynamic yield of the FBR with MS, TCS and STC were compared each other with variable range of temperature, pressure and hydrogen to silicon ratio. The silicon yield of MS, TCS and STC were 100%, 28% and 4%, respectively, throughout the conventional FBR conditions. Silicon carbide having high hardness and strength showed strong resistance to granule collisions during the FBR process using a lab-scale reactor. And it also showed quite good compatibility with the typical FBR processes of MS and TCS resources.

• 한국세라믹학회지
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• 제45권1호
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• pp.69-74
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• 2008

The effects of $SiO_2$ impurity on the high temperature resistivities of AIN ceramics have been investigated. When $SiO_2$ was added into 1 wt% $Y_2O_3$-doped AIN, DC resistivities have decreased and electrode polarizations disappeared. Impedance spectroscopy showed two semi-circles at $600^{\circ}C$, which were attributed to grain and grain boundary, respectively. $SiO_2$ doping had more significant effects on the grain resistivity than grain boundary resistivity, implying that doped Si acted as a donor in AIN lattice. In addition, voltage dependency of DC resistivity was observed, which might be related to dependency of size of grain boundary semi-circle on the bias voltage in impedance spectroscopy.

• 한국세라믹학회지
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• 제55권4호
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• pp.392-399
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• 2018

$C_f/SiC$ composites were prepared via a process combining chemical vapor infiltration (CVI) and precursor infiltration pyrolysis (PIP), wherein silicon carbide matrices were infiltrated into 2.5D carbon preforms. The obtained composites exhibited porosities of 20 vol % and achieved strengths of 244 MPa in air at room temperature and 423 MPa at $1300^{\circ}C$ under an Ar atmosphere. Carbon fiber pull-out was rarely observed in the fractured surfaces, although intermediate layers of pyrolytic carbon of 150 nm thickness were deposited between the fiber and matrix. Fatigue fracture was observed after 1380 cycles under 45 MPa stress at $1000^{\circ}C$. The fractured samples were analyzed by transmission electron microscopy to observe the distributed phases.

• 한국결정성장학회지
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• 제18권6호
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• pp.232-236
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• 2008

최근 실리콘 원료의 부족에 따른 가격상승으로 인하여 99.9999% 이상의 순도를 지닌 폴리 실리콘을 더 저렴하게 제조하기 위한 연구가 활발히 진행되고 있다. 본 연구에서는 순도 99%의 금속급 실리콘(MG-Si)을 원료로 산처리와 일방향 응고를 통해 고순도로 정제하는 연구를 수행하였다. MG-Si 럼프를 플레너터리 밀로 분쇄한 후 HCl/$HNO_3$/HF 산 수용액에서 처리하였다. 그 결과 Al, Fe, Ca, Mn 등과 같은 금속 불순물들의 실리콘 내 함량이 크게 감소하면서 실리콘의 순도는 99.995%까지 향상되었다. 정제된 실리콘 분말을 성형한 후 HEM로를 이용하여 용융시킨 뒤, 일방향 응고를 통하여 잉곳을 제조하였다. 성장시킨 다결정 실리콘 잉곳은 $0.3{\Omega}{\cdot}cm$의 비저항과 $3.8{\mu}{\cdot}sec$의 열 운반자 소멸시간(minority carrier life time)을 나타내었다.

• 한국세라믹학회지
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• 제46권6호
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• pp.685-688
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• 2009

Surface Texturing is very important process for high cell efficiency in crystalline silicon solar cell. Anisotropic texturing with an alkali etchant was known not to be able to produce uniform surface morphology in multi-crystalline silicon (mc-Si), because of its different etching rate with random crystal orientation. In order to reduce surface reflectance of mc-Si wafer, the general etching tendency was studied with HF/HN$O_3$/De-ionized Water acidic solution. And the surface structures of textured mc-Si in various HF/HN$O_3$ ratios were compared. The surface morphology and reflectance of textured silicon wafers were measured by FE-SEM and UVvisible spectrophotometer, respectively. We obtained average reflectance of $16{\sim}19$% for wavelength between 400 nm and 900 nm depending on different etching conditions.