• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.93-100
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• 2003

The continuing scaling trend in microelectronic circuit technology has a significant impact on the different IC interconnection and packaging technologies. These latter technologies have not kept pace with the IC scaling trends, resulting in a so-called“interconnect technology gap”. Multilayer thin film technology is proposed as a“bridge”- technology between the very high density IC technology and the coarse standard PCB technology. It is also a key enabling technology for the realisation of true“System-in-a-Package”(SIP) solutions, combining multiple“System-on-a-Chip”(SOC) IC's with other components and also integrating passive components in its layers. A further step is to use this technology to realise new functionalities on top of active wafers. These additional“above-IC”processed layers may e.g. be used for low loss, high speed on chip interconnects, clock distribution circuits, efficient power/ground distribution and to realize high Q inductors on chip.

• ETRI Journal
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• v.37 no.6
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• pp.1165-1175
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• 2015

This paper presents an advanced sensorless permanent magnet (PM) brushless motor controller integrated circuit (IC) employing an automatic lead-angle compensator. The proposed IC is composed of not only a sensorless sine-wave motor controller but also an isolated gate-driver and current self-sensing circuit. The fabricated IC operates in sensorless mode using a position estimator based on a sliding mode observer and an open-loop start-up. For high efficiency PM brushless motor driving, an automatic lead-angle control algorithm is employed, which improves the efficiency of a PM brushless motor system by tracking the minimum copper loss under various load and speed conditions. The fabricated IC is evaluated experimentally using a commercial 200 W PM brushless motor and power switches. The proposed IC is successfully operated without any additional sensors, and the proposed algorithm maintains the minimum current and maximum system efficiency under $0N{\cdot}m$ to $0.8N{\cdot}m$ load conditions. The proposed IC is a feasible sensorless speed controller for various applications with a wide range of load and speed conditions.

• Proceedings of the Korean Society of Computer Information Conference
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• 2020.07a
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• pp.327-328
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• 2020

본 논문에서는 저전력 저비용 임베디드 환경에서 PCB 검사 기법을 제안한다. 특히, IC 미삽에 대한 검출 알고리즘을 제안하고 실험한다. 고사양의 컴퓨팅 시스템에서는 CNN과 같은 딥러닝 뉴럴 네트워크를 사용하여 특별한 알고리즘을 고려하지 않아도 대규모의 데이터를 입력함으로써 모델을 완성하고 이를 통해 PCB 검사를 수행할 수 있다. 그러나 데이터의 양이 충분하지 않거나 충분한 전력과 비용을 투입하지 못하는 임베디드 환경에서는 각 부품에 따른 컴퓨터 비전 알고리즘이 필요하다. IC의 경우 타부품에 비하여 형태가 직사각으로 정형화 되있으며 색상도 균일한 특징을 가지고 있기에 미삽에 대한 검출이 가능하다. 베어보드(Bare Board)의 색상과 IC 부품의 색상이 확연히 다를 경우에는 RGB 픽셀을 카운트 하는 히스토그램 카운팅 알고리즘만으로 검출이 가능하다. 베어보드의 색삭과 IC의 색상이 유사할 경우에는 베어보드의 핀 혹은 홀의 형태를 감지하여 검출이 가능하다. 본 논문에서는 베어보드의 색상와 IC의 색상이 같을 경우에 다를 경우를 나누어 미삽 검사를 수행하고 그 정확도를 확인한다.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.3
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• pp.1-6
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• 2013

3D integrated circuit(IC) technology with TSV(through Si via) liquid cooling system is discussed. As a device scales down, both interconnect and packaging technologies are not fast enough to follow transistor's technology. 3D IC technology is considered as one of key technologies to resolve a device scaling issue between transistor and packaging. However, despite of many advantages, 3D IC technology suffers from power delivery, thermal management, manufacturing yield, and device test. Especially for high density and high performance devices, power density increases significantly and it results in a major thermal problem in stacked ICs. In this paper, the recent studies of TSV liquid cooling system has been reviewed as one of device cooling methods for the next generation thermal management.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07a
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• pp.381-384
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• 2005

Driver IC is one of the key components on the LCD monitor and LCD/TV. The function of the driver IC is to transfer and forward the input signals to LCD panel module. Inside driver IC, there are several operating units which process the input signals and generate the appropriate size and resolution to the LCD panel module. LCD panel module will display these input signals. However, there are some difficulties which driver IC designer, LCD monitor and LCD/TV maker will face. Thus, this article addresses the function and difficulties on driver IC.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2014.10a
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• pp.291-292
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• 2014

High-speed video transmission modes of master bridge IC are implemented, which supports MIPI (Mobile Industry Processor Interface) DSI (Display Serial Interface) standard. MIPI DSI master bridge IC sends RGB data and various commands to display module (slave) in order to test it. The master bridge IC consists of buffers storing video data of two lines, packet generation block, and D-PHY layer that distributes packets to data lanes and transmits them to slave. In addition, it supports four bpp (bit per pixel) formats and three transmission modes including Burst and Non-Burst (Sync Events, Sync Pulses types). The designed bridge IC is verified by RTL simulations showing that it functions correctly for various operating parameters.

• Journal of Korea Multimedia Society
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• v.16 no.1
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• pp.87-99
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• 2013

The demands of IC card payment system has been increased according to the rapid advancement of the IT convergence application technologies. Recently IC card payment systems are in demands of the usage space at anytime and anywhere by developing the wireless communication technology and its related multimedia processing technology. Therefore the security of IC card payment system becomes more important and necessary. There are many fault analysis methods to evaluate the security and safety of information systems according to their characteristics and usages. However, the only assessment method to evaluate the security of information systems is not enough to analyse properly on account of the various types and characteristics of information systems by the progress of IT convergence and their applications. Therefore, this paper proposes an integrative method of the Fault Tree Analysis (FTA) and Fault Modes and Effect Analysis/Criticality (FMEA/C) based on criticality to evaluate and improve the security of IC card payment system as an illustration.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.40 no.12
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• pp.2503-2510
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• 2015

This paper presents a single-phase energy measurement IC to measure electric power quantities. The entire IC includes two programmable gain amplifiers (PGAs), two ${\sum}{\Delta}$ modulators, a reference circuit, a low-dropout (LDO) regulator, a temperature sensor, a filter unit, a computation engine, a calibration control unit, registers, and an external interface block. The proposed energy measurement IC is fabricated with $0.18-{\mu}m$ CMOS technology and housed in a 32-pin quad-flat no-leads (QFN) package. It operates at a clock speed of 4,096 kHz and consumes 10 mW in 3.3 V supply.

• Journal of the Korean Wood Science and Technology
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• v.17 no.4
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• pp.70-76
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• 1989

The fracture toughness of two species, Pinus rigida MILL and Pinus koraiensis S. et Z. grown in Korea, was investigated by means of single edge notch beam specimen for the six principal systems of crack propagation in wood. The values of the fracture toughness for the LR and the LT systems ($K_{IC}$LR and $K_{IC}$LT) were found to be similar to each other and about 8 times greater than those for the other systems ($K_{IC}$RL, $K_{IC}$TL and $K_{IC}$TR) in both species. The results indicate that the characteristics of fracture toughness in three principal directions of wood (L, R, T direction) are quite different from those of bending strength for the responsible direction. To predict $K_{IC}$ value based on the variation of specific gravity, the experimental values of $K_{IC}$LT and $K_{IC}$TL were compared to the predicted values by published relationship between $K_{IC}$ and specific gravity. However, there were 10 to 25% differences between the former and the latter.

• Proceedings of the IEEK Conference
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• 1999.06a
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• pp.233-238
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• 1999

극 미세 기술과 이에 수반되는 고가 장비와 시설에 대한 대량 투자, 그리고 고속, 저전력, 멀티미디어로 대변되는 칩의 다기능화라는 반도체 기술의 기술적 측면과 산업적 측면을 조망한다. 이러한 환경 내에서 산업화 이전 핵심기술을 산·학·연이 공동 개발함으로써, 연구개발 위험도를 줄이고 국가적으로 핵심기술을 위한 인프라를 구축하고자 1998년부터 시작된 시스템집적반도체기반 기술개발사업 (System IC 2010 : A Collaborative Project for Excellence in Basic System IC Technology)의 내용과 방향을 제시하고자 한다.