• Title/Summary/Keyword: IC&RC

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Active RC Synthesis Using Integrators (적분회로를 응용한 능동 RC 회로합성)

  • 이영근
    • Journal of the Korean Institute of Telematics and Electronics
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    • v.9 no.5
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    • pp.6-11
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    • 1972
  • A general active RC network synthesis procedure which realizes any stable transfer function is described. The network elements are only R's, C's and OA's, and the network configuration are well suited for construction using thin-film RC networks and integrated cil'suit operational amplifiers. Poles and transmission zeros can be adjusted independently to each other and are qu;te insensitive to element variations.

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A critical steel yielding length model for predicting intermediate crack-induced debonding in FRP -strengthened RC members

  • Dai, Jian-Guo;Harries, Kent A.;Yokota, Hiroshi
    • Steel and Composite Structures
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    • v.8 no.6
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    • pp.457-473
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    • 2008
  • Yielding of the internal steel reinforcement is an important mechanism that influences the Intermediate Crack-induced debonding (IC debonding) behavior in FRP-strengthened RC members since the FRP is required to carry additional forces beyond the condition of steel yielding. However, rational design practice dictates an appropriate limit state is defined when steel yielding is assured prior to FRP debonding. This paper proposes a criterion which correlates the occurrence of IC debonding to the formulation of a critical steel yielding length. Once this length is exceeded the average bond stress in the FRP/concrete interface exceeds its threshold value, which proves to correlate with the average bond resistance in an FRP/concrete joint under simple shear loading. This proposed IC debonding concept is based on traditional sections analysis which is conventionally applied in design practice. Hence complex bond stress-slip analyses are avoided. Furthermore, the proposed model incorporates not only the bond properties of FRP/concrete interface but also the beam geometry, and properties of steel and FRP reinforcement in the analysis of IC debonding strength. Based upon a solid database, the validity of the proposed simple IC debonding criterion is demonstrated.

The Intelligent Power Modules Assembly with Reverse Conduction IGBTs and SOI Driver for Low Power Motor Drives (저전력 모터 구동을 위한 SOI 드라이브 IC 와 RC-IGBT를 탑재한 지능형 반도체 모듈)

  • Cho, JeongSu;Park, SungBum;Lee, JunBae;Chung, DaeWoong
    • Proceedings of the KIPE Conference
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    • 2011.07a
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    • pp.287-289
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    • 2011
  • 본 논문은 인피니언 테크놀로지스의 RC-IGBT (Reverse Conducting Isolated Gate Bipolar Transistor)와 SOI 드라이브 IC(Integrated Circuit)를 사용한 DIL(Dual-In-Line) 구조의 저전력 모듈인 CIPOS TM (Control Integrated POwer System) 제품을 소개한다. 이 전력 모듈은 최적의 게이트 구동회로, 트렌치 필드스톱의 RC-IGBT를 사용하여 기존의 IGBT 와 Diode를 사용하는 구조에서 최소화 된 패키지 크기를 사용하여 높은 효율을 구현할 수 있다. 본 논문을 통하여 인버터의 어플리케이션에 적합하게 설계된 전력모듈에 대한 소개와 그 특징 및 시스템 구성을 위한 고려사항에 대하여 기술하였다.

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Debonding failure analysis of prestressed FRP strengthened RC beams

  • Hoque, Nusrat;Jumaat, Mohd Z.
    • Structural Engineering and Mechanics
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    • v.66 no.4
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    • pp.543-555
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    • 2018
  • Fiber Reinforced Polymer (FRP), which has a high strength to weight ratio, are now regularly used for strengthening of deficient reinforced concrete (RC) structures. While various researches have been conducted on FRP strengthening, an area that still requires attention is predicting the debonding failure load of prestressed FRP strengthened RC beams. Application of prestressing increases the capacity and reduces the premature failure of the beams largely, though not entirely. Few analytical methods are available to predict the failure loads under flexure failure. With this paucity, this research proposes a method for predicting debonding failure induced by intermediate crack (IC) for prestressed FRP-strengthened beams. The method consists of a numerical study on beams retrofitted with prestressed FRP in the tension side of the beam. The method applies modified Branson moment-curvature analysis together with the global energy balance approach in combination with fracture mechanics criteria to predict failure load for complicated IC-induced failure. The numerically simulated results were compared with published experimental data and the average of theoretical to experimental debonding failure load is found to be 0.93 with a standard deviation of 0.09.

Resveratrol Induces Apoptosis in Primary Human Prostate Cancer Cells (Primary 인체 전립선 암세포에서 Resveratrol의 Apoptosis 유도 효과)

  • Kang, Hye-In;Kim, Jae-Yong;Cho, Hyun-Dong;Park, Kyung-Wuk;Kang, Jum-Soon;Seo, Kwon-Il
    • Journal of the Korean Society of Food Science and Nutrition
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    • v.39 no.8
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    • pp.1119-1125
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    • 2010
  • To evaluate resveratrol as a prostate cancer preventive material, we investigated its anti-proliferative and apoptotic effects in RC-58T/h/SA#4 primary human prostate cancer cells. Resveratrol significantly decreased the number of viable RC-58T/h/SA#4 cells in a dose- and time-dependent manner. Resveratrol showed cytotoxicity against RC-58T/h/SA#4, LNCaP, PC-3 human prostate cancer cells with $IC_{50}$ values of 245, 320 and $340\;{\mu}M$, respectively. However the cytotoxic potential of resveratrol against normal RWPE-1 cells was lower ($IC_{50}=982\;{\mu}M$). Resveratrol induced cell death as evidenced by the increased formation of apoptotic bodies, nuclear condensation, sub-G1 phase, and DNA fragmentation. Resveratrol activated initiator caspases 8, and 9 as well as effector caspase 3 in a dose-dependent manner. Furthermore, the general caspase inhibitor z-VAD-fmk significantly inhibited resveratrol-induced apoptosis compared to cells without treatment. These results clearly indicate that resveratrol-induced apoptosis was dependent on caspase activation. Further, resveratrol modulated the down regulation of Bcl-2 (anti-apoptotic), and Bid. However, the level of Bax (pro-apoptotic) remained unchanged. These results suggest that resveratrol induced apoptosis in RC-58T/h/SA#4 cells via a mitochondrial-mediated caspase-dependent pathway, suggesting therapeutic potential against prostate cancer.

Design of Boost Converter PFC IC for Unity Power Factor Achievement (단일 역률 달성을 위한 Boost Converter용 PFC IC 설계)

  • Jeon, In-Sun;Kim, Hyoung-Woo;Kim, Ki-Hyun;Seo, Kil-Soo;Jo, Hyo-Mun;Lee, Jong-Hwa
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.47 no.2
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    • pp.60-67
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    • 2010
  • We designed Average Current Control PFC IC which has make the average value of boost inductor current became the shape of sine wave. Designed IC has fixed frequency of 75kHz to meet EMI standard requirement. And also RC compensation loop has been designed into the error amp and the current amp, in order that it has wide bandwidth for high speed control. And we use the oscillator which generates by square wave and triangle wave, and add to UVLO, OVP, OCP, TSD which is in order to operate stability. We simulated by using Spectre of Cadence to verify the unity power factor function and various protection circuits and fabricated in a $1{\mu}m$ High Voltage(20V) CMOS process.

Modeling and Analysis of Silicon Substrate Coupling for CMOS RE-IC Design (CMOS RE-IC 설계를 위한 실리콘 기판 커플링 모델 및 해석)

  • 신성규;어영선
    • Proceedings of the IEEK Conference
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    • 1999.06a
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    • pp.393-396
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    • 1999
  • A circuit model of silicon substrate coupling for CMOS RF-IC design is developed. Its characteristics are analyzed by using a simple RC mesh model in order to investigate substrate coupling. The coupling effects due to the substrate were characterized with substrate resistivity, oxide thickness, substrate thickness. and physical distance. Thereby the silicon substrate effects are analytically investigated and verified with simulation. The analysis and simulation of the model have excellent agreements with MEDICI(2D device simulator) simulation results.

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A PWM Phase-Shift Circuit using an RC Delay for Multiple LED Driver ICs

  • Oh, Jae-Mun;Kang, Hyeong-Ju;Yang, Byung-Do
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.15 no.4
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    • pp.484-492
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    • 2015
  • This paper proposes a PWM phase-shift circuit to make that the LED lighting system distributes the channel currents evenly for any number of LED strings by generating evenly phase-shifted PWM signals for multiple LED driver ICs. The evenly distributed channel currents reduce the peak current, the decoupling capacitor size, and EMI noise. The PWM phase-shift circuit makes an arbitrary degree of PWM phase-shift by using a resistor and a capacitor. It measures the RC delay once. It reduces the number of external resistors and capacitors by providing zero and 180 degree phase-shift modes requiring no resistor and capacitor. An LED driver IC with the PWM phase-shift circuit was fabricated with a $0.35{\mu}m$ BCDMOS process. The PWM phase-shift circuit receives a PWM signal of 50 Hz~20 kHz at $f_{CLK}=450kHz$ and it generates a $0{\sim}360^{\circ}$ phase-shifted PWM signal with $R=0{\sim}1.1M{\Omega}$ at C=1 nF and $f_{PWM}=1kHz$. The measured phase errors are 1.74~3.94% due to parasitic capacitances.

A experimental Study on the Reinforced Coil Development for the Efficiency Improvement of a Single Phase Induction Motor (단상유도전동기의 효율 개선을 위한 강화코일 개발에 관한 실험적 연구)

  • Lee, Jong-Myong;Kim, Nam-Ho
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.24 no.1
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    • pp.78-84
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    • 2010
  • The efficiency of system with a built-in coil is improved as (1) the total coil flux increases, (2) the space distribution of coil flux is closer to the sinusoidal wave and (3) the direction of coil flux flow becomes more inherent with the original direction at the same condition. Every turn RC(Reinforced Coil) is composed of OC having original region and two IC's strengthening bidirectionally the inner part flux in order to maintain the symmetry with origin. This way we will realize the inherent flux direction and the sinusoidal closeness as well. Accordingly RC type is obtained by connecting the pure OC's and RC's in just turns to be closer to sinusoidal flux wave. We proved experimentally the usefulness of reinforced coil to improve the efficiency of SPIM.

TSV Liquid Cooling System for 3D Integrated Circuits (3D IC 열관리를 위한 TSV Liquid Cooling System)

  • Park, Manseok;Kim, Sungdong;Kim, Sarah Eunkyung
    • Journal of the Microelectronics and Packaging Society
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    • v.20 no.3
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    • pp.1-6
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    • 2013
  • 3D integrated circuit(IC) technology with TSV(through Si via) liquid cooling system is discussed. As a device scales down, both interconnect and packaging technologies are not fast enough to follow transistor's technology. 3D IC technology is considered as one of key technologies to resolve a device scaling issue between transistor and packaging. However, despite of many advantages, 3D IC technology suffers from power delivery, thermal management, manufacturing yield, and device test. Especially for high density and high performance devices, power density increases significantly and it results in a major thermal problem in stacked ICs. In this paper, the recent studies of TSV liquid cooling system has been reviewed as one of device cooling methods for the next generation thermal management.