• Proceedings of the Polymer Society of Korea Conference
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• 2006.10a
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• pp.215-215
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• 2006

The cyclic butylene terephthalte oligomer was synthesized and the composition of butylenes terephthalate cyclic oligomers was 51.2 % of dimer, 28.1 % of trimer, 7.9 % of tetramer, 8 % of pentamer and 4.8% of hexamer. Polybuthylene terephthalate was polymerized using this cyclic oligomer in the condition of melt process and supercritical process. And PBT/clay nanocomposite were manu- factured from melt process and supercritical process. Chlorodifluoro- methane(HCFC-22) was used as a solvent which has critical point ($Tc=96.2^{\circ}C$, Pc=49.7bar). Also polymer nanocomposite were manufactured using rapid expansion of supercritical solution process.

• Macromolecular Research
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• v.10 no.4
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• pp.194-203
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• 2002

In resin infusion process(RIP), the fiber and the resin are in contact with each other for an impregnation step and often results in flow-induced defects such as poor fiber wetting and void formation. Resin flow characteristics in transverse direction and process modeling for woven fabric were studied, and the process modeling was applied to the manufacturing of hybrid composite materials. This study also considered the compressibility of woven fabrics in a series of compression force, and it was fitted well to an elastic model equation. Void formation was varied with the processing conditions in the stage of manufacturing composites using RIP. It was concluded from this study that proper combination of pressure build-up and dynamic heating condition makes important factor for flow-induced composite processing.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.22 no.2
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• pp.298-303
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• 2013

Magnetic abrasive polishing is one of the most promising finishing methods applicable to complex surfaces. Nevertheless this process has a low efficiency when applied to very hardened materials. For this reason, EP-MAP hybrid process was developed. EP-MAP process is expected to machine complex and hardened materials. In this research, deburring process using EP-MAP hybrid process was proposed. EP-MAP deburring process is applied to micro channel, thereby it can obtain both deburring process and polishing process. EP-MAP deburring process on the micro channel was performed. Through design of experiment method, error of height in this process according to process parameter is analyzed. When the level 1 parameter A(magnetic flux density) and level 2 parameter B(electric potential), C(working gap) and level 3 parameter D(feed rate) are applied in the deburring process using EP-MAP hybrid process, it provides optimum result of EP-MAP hybrid deburring process.

• The Korean Journal of Ceramics
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• v.7 no.1
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• pp.1-5
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• 2001

Inorganic-organic hybrid Li$^+$ ion conductors were prepared by the sol-gel process. Tetramethyl orthosilicate (TMOS), polyethylene glycol 200 (PEG$_200$) and lithium bis (trifluoro-methylsulfony) imide were used as raw materials and $H_2O$ was used as a solvent. Hybrid Li$^+$ ion conductor prepared by the sol-gel process showed very high ion conductivities of log${\sigma}_R.T$(S/cm)=-3.73, log${\sigma}_60$(S/cm)=-3.00 at room temperature and $60^{\circ}C$, respectivery. Decomposition voltage was 3.1 V.

• Journal of Industrial Technology
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• v.28 no.B
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• pp.47-52
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• 2008

In this study, GAC adsorption, ozonation and $O_3/GAC$ hybrid processes were investigated for treatment of humic acid. The degradation characteristics and efficiencies of humic acid in each process were evaluated through pH variation, $UV_{254}$ decrease, DOC removal, change of molecular size distribution and by-products formation. DOC removal rate in $O_3/GAC$ hybrid process (80%) was higher than arithmetic sum of ozonation (38%) and GAC adsorption process (19%) by synergism. $UV_{254}$ decrease rate of humic acid was also the highest than any other processes when treated in $O_3/GAC$ hybrid process. Molecular size distribution was not significantly changed in the GAC adsorption process. Main distribution of molecular size of humic acid was converted from 3 k~30 kDa into 0.5 k~3 kDa in ozonation. But the most of large molecular sizes of humic acid converted into small molecules(smaller than 0.5 kDa) in $O_3/GAC$ hybrid process. Quantities of formaldehyde and glyoxal formed in $O_3/GAC$ hybrid process were less than the ones in ozonation.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.12 no.6
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• pp.10-16
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• 2013

Ultra-fine planing and micro punching are separately used for improving surface roughness and machining dot patterns, respectively, of metal molds. If these separate machining processes are applied for machining of identical molds, there could be an aligning mismatch between the machine tool and the mold. A hybrid machining system combining ultra-fine planing and micro punching was newly developed in this study in order to solve this mismatch; hybrid process technology was also developed for machining dot patterns on a mirror surface of a metal mold. The hybrid machining system has X, Y, and Z axes, and a cam axis for ultra-fine planing. The cam axis and attachable and removable solenoid actuators for micro punching can make large and small sizes of dot patterns, respectively. Ultra-fine planing was applied in the first place to improve the surface roughness of a metal mold; the measured surface roughness was about 20nm. Then, micro punching was applied to machine dot patterns on the same mold. It was possible to control the diameter of the dot patterns by changing the input voltage of the solenoid actuator. Before machining, severe inhomogeneous plastic deformation around the machined dot patterns was also removed by annealing heat treatment. Therefore, it was verified that metal molds with dots patterns for optical products can be machined using a hybrid machining system and the hybrid process technology developed in this study.

• Journal of the Korean Society for Precision Engineering
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• v.25 no.9
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• pp.7-13
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• 2008

• Journal of Welding and Joining
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• v.31 no.2
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• pp.4-15
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• 2013

The laser/arc hybrid welding process is a new process combining the laser beam and the arc as welding heat source. The laser beam and arc influence and assist one another. By application of hybrid welding, synergistic effects are achievable, and disadvantage of the respective processes can be compensated. The laser-arc hybrid welding process has good potential to extend the field of applications of laser technology, and provide significant improvements in weld quality and process efficiency in manufacturing applications. This review analyses the recent advances in the fundamental understanding of hybrid welding processes using the works of the data base of Web of Science (SCI-Expanded) since the 2000 year. The research activity on the hybrid welding has been become more actively since 2006, especially in China, presenting the most research papers in the world. Since the hybrid welding process was adopted in manufacturing of the automobile in Europe in the early of 2000's, its adopting is widely expanded in the field of manufacturing of automobile, ship building, steel construction and the other various industry. The hybrid welding process is expected to advance toward higher productivity, higher precision, higher reliability through the mixing of high power and flexible fiber laser or disk laser and digitalized pulsed arc source.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.1
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• pp.17-24
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• 2020

As an interconnect scaling faces a technical bottleneck, the device stacking technologies have been developed for miniaturization, low cost and high performance. To manufacture a stacked device structure, a vertical interconnect becomes a key process to enable signal and power integrities. Most bonding materials used in stacked structures are currently solder or Cu pillar with Sn cap, but copper is emerging as the most important bonding material due to fine-pitch patternability and high electrical performance. Copper bonding has advantages such as CMOS compatible process, high electrical and thermal conductivities, and excellent mechanical integrity, but it has major disadvantages of high bonding temperature, quick oxidation, and planarization requirement. There are many copper bonding processes such as dielectric bonding, copper direct bonding, copper-oxide hybrid bonding, copper-polymer hybrid bonding, etc.. As copper bonding evolves, copper-oxide hybrid bonding is considered as the most promising bonding process for vertically stacked device structure. This paper reviews current research trends of copper bonding focusing on the key process of Cu-SiO₂ hybrid bonding.

• Journal of the Korean Ceramic Society
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• v.50 no.6
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• pp.402-409
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• 2013

The objective of this study was to develop a synthesis process for ${\beta}$-SiC powders to reduce the synthesis temperature and to control the particle size and to prevent particle agglomeration of the synthesized ${\beta}$-SiC powders. A phenol resin and TEOS were used as the starting materials for the carbon and Si sources, respectively. $SiO_2$-C hybrid precursors with various C/Si mole ratios were fabricated using a conventional sol-gel process. ${\beta}$-SiC powders were synthesized by a carbothermal reduction process using $SiO_2$-C hybrid precursors with various C/Si mole ratios (1.6 ~ 2.5) fabricated using a sol-gel process. In this study, the effects of excess carbon and the addition of Si powders to the $SiO_2$-C hybrid precursor on the synthesis temperature and particle size of ${\beta}$-SiC were examined. It was found that the addition of metallic Si powders to the $SiO_2$/C hybrid precursor with excess carbon reduced the synthesis temperature of the ${\beta}$-SiC powders to as low as $1300^{\circ}C$. The synthesis temperature for ${\beta}$-SiC appeared to be reduced with an increase of the C/Si mole ratio in the $SiO_2$-C hybrid precursor by a direct carburization reaction between Si and excess carbon.